Patent Grant
8546947
1. Field of the Invention
The invention relates in general to a chip structure and a process for forming the same. More particularly, the invention relates to a chip structure for improving the resistance-capacitance delay and a forming process thereof.
2. Description of the Related Art
Nowadays, electronic equipment are increasingly used to achieve many various tasks. With the development of electronics technology, miniaturization, multi-function task, and comfort of utilization are among the principle guidelines of electronic product manufacturers. More particularly in semiconductor manufacture process, the semiconductor devices with 0.18 microns have been mass-produced. However, the relatively fine interconnections therein negatively impact the chip. For example, this causes the voltage drop of the buses, the resistance-capacitor delay of the key traces, and noises, etc.
As shown in
However, as far as the chip structure 100 is concerned, resistance-capacitance (RC) delay is easily generated because the line width of the interconnection scheme 124 is extremely fine, about below 0.3 microns, the thickness of the interconnection scheme 124 is extremely thin, and the dielectric constant of the dielectric body 122 is extremely high, about 4. Therefore, the chip efficiency drops off. In particular, the RC delay even usually occurs with respect to a power bus, a ground bus or other metal lines transmitting common signals. In addition, the production of the interconnection scheme 124 with extremely fine line width is necessarily performed using facilities with high accuracy. This causes production costs to dramatically rise.
The present invention is related to a R.O.C. patent application Ser. No. 88120548, filed Nov. 25, 1999, by M. S. Lin, issued Sep. 1, 2001, now R.O.C. Pat. No. 140721. R.O.C. patent application Ser. No. 88120548 claims the priority of pending U.S. patent application Ser. No. 09/251,183 and the subject matter thereof is disclosed in pending U.S. patent application Ser. No. 09/251,183. The present invention is related to a R.O.C. patent application Ser. No. 90100176, filed Jan. 4, 2001, by M. S. Lin and J. Y. Lee, now pending. The subject matter of R.O.C. patent application Ser. No. 90100176 is disclosed in pending U.S. patent application Ser. No. 09/691,497. The present invention is related to a Japanese patent application Ser. No. 200156759, filed Mar. 1, 2001, by M. S. Lin and J. Y. Lee, now pending. The present invention is related to a European patent application Ser. No. 01480077.5, filed Aug. 27, 2001, by M. S. Lin and J. Y. Lee, now pending. The present invention is related to a Singaporean patent application Ser. No. 200101847-2, filed Mar. 23, 2001, by M. S. Lin and J. Y. Lee, now pending. Japanese patent application Ser. No. 200156759, European patent application Ser. No. 01480077.5, and Singaporean patent application Ser. No. 200101847-2 claim the priority of pending U.S. patent application Ser. No. 09/691,497 and the subject matter of them is disclosed in pending U.S. patent application Ser. No. 09/691,497.
Accordingly, an objective of the present invention is to provide a chip structure and a process for forming the same that improves resistance-capacitance delay and reduces energy loss of the chip.
Another objective of the present invention is to provide a chip structure and a process for forming the same that can be produced using facilities with low accuracy. Therefore, production costs can substantially reduce.
To achieve the foregoing and other objectives, the present invention provides a chip structure that comprises a substrate, a first built-up layer, a passivation layer and a second built-up layer. The substrate includes many electric devices placed on a surface of the substrate. The first built-up layer is located on the substrate. The first built-up layer is provided with a first dielectric body and a first interconnection scheme, wherein the first interconnection scheme interlaces inside the first dielectric body and is electrically connected to the electric devices. The first interconnection scheme is constructed from first metal layers and plugs, wherein the neighboring first metal layers are electrically connected through the plugs. The passivation layer is disposed on the first built-up layer and is provided with openings exposing the first interconnection scheme. The second built-up layer is formed on the passivation layer. The second built-up layer is provided with a second dielectric body and a second interconnection scheme, wherein the second interconnection scheme interlaces inside the second dielectric body and is electrically connected to the first interconnection scheme. The second interconnection scheme is constructed from at least one second metal layer and at least one via metal filler, wherein the second metal layer is electrically connected to the via metal filler. The thickness, width, and cross-sectional area of the traces of the second metal layer are respectively larger than those of the first metal layers. In addition, the first dielectric body is constructed from at least one first dielectric layer, and the second dielectric body is constructed from at least one second dielectric layer. The individual second dielectric layer is thicker than the individual first dielectric layer.
According to a preferred embodiment of the present invention, the thickness of the traces of the second metal layer ranges from 1 micron to 50 microns; the width of the traces of the second metal layer ranges from 1 micron to 1 centimeter; the cross sectional area of the traces of the second metal layer ranges from 1 square micron to 0.5 square millimeters. The first dielectric body is made of, for example, an inorganic compound, such as a silicon nitride compound or a silicon oxide compound. The second dielectric body is made of, for example, an organic compound, such as polyimide (PI), benzocyclobutene (BCB), porous dielectric material, or elastomer. In addition, the above chip structure further includes at least one electrostatic discharge (ESD) circuit and at least one transitional device that are electrically connected to the first interconnection scheme. The transitional device can be a driver, a receiver or an I/O circuit. Moreover, the first interconnection scheme include at least one first conductive pad, at least one second conductive pad, and at least one linking trace, wherein the openings of the passivation layer expose the first conductive pad and the second conductive pad. The second conductive pad is electrically connected to the second interconnection scheme. The first conductive pad is exposed to the outside. The linking trace connects the first conductive pad with the second conductive pad and is shorter than 5,000 microns.
To sum up, the chip structure of the present invention can decline the resistance-capacitance delay, the power of the chip, and the temperature generated by the driving chip since the cross sectional area, the width and the thickness of the traces of the second metal layer are extremely large, since the cross sectional area of the via metal filler is also extremely large, since the second interconnection scheme can be made of low-resistance material, such as copper or gold, since the thickness of the individual second dielectric layer is also extremely large, and since the second dielectric body can be made of organic material, the dielectric constant of which is very low, approximately between 1.about.3, the practical value depending on the applied organic material.
In addition, the chip structure of the present invention can simplify a design of a substrate board due to the node layout redistribution, fitting the design of the substrate board, of the chip structure by the second interconnection scheme and, besides, the application of the fewer nodes to which ground voltage or power voltage is applied. Moreover, in case the node layout redistribution of various chips by the second interconnection scheme causes the above various chips to be provided with the same node layout, the node layout, matching the same node layout of the above various chips, of the substrate board can be standardized. Therefore, the cost of fabricating the substrate board substantially drops off.
Moreover, according to the chip structure of the present invention, the second interconnection scheme can be produced using facilities with low accuracy. Therefore, production costs of the chip structure can substantially be reduced.
To achieve the foregoing and other objectives, the present invention provides a process for making the above chip structure. The process for fabricating a chip structure comprises the following steps.
Step 1: A wafer is provided with a plurality of electric devices, an interconnection scheme and a passivation layer. Both the electric devices and the interconnection scheme are arranged inside the wafer. The interconnection scheme is electrically connected with the electric devices. The passivation layer is disposed on a surface layer of the wafer. The passivation layer has at least one opening exposing the interconnection scheme. The largest width of the opening of the passivation ranges from 0.5 microns to 200 microns
Step 2: A conductive layer is formed over the passivation layer of the wafer by, for example, a sputtering process, and the conductive layer is electrically connected with the interconnection scheme.
Step 3: A photoresist is formed onto the conductive layer, and the photoresist has at least one opening exposing the conductive layer.
Step 4: At least one conductive metal is filled into the opening of the photoresist by, for example, a electroplating process, and the conductive metal is disposed over the conductive layer.
Step 5: The photoresist is removed.
Step 6: The conductive layer exposed to the outside is removed by, for example, an etching process, and the conductive layer deposited under the conductive metal remains. A signal is transmitted from one of the electric devices to the interconnection scheme, then passes through the passivation layer, and finally is transmitted to the conductive metal, and further, the signal is transmitted from the conductive metal to the interconnection scheme with passing through the passivation layer, and finally is transmitted to the other one or more of the electric devices.
Provided that two metal layers are to be formed, the process for fabricating the above chip structure further comprises the following steps:
Step 7: A dielectric sub-layer is formed over the passivation layer and covers the formed conductive metal. The dielectric sub-layer has at least one opening exposing the conductive metal formed at a lower portion.
Step 8: At least other one conductive layer is formed on the dielectric sub-layer and into the opening of the dielectric sub-layer by, for example, a sputtering process. The other conductive layer is electrically connected with the metal layer exposed by the opening of the dielectric sub-layer.
Step 9: A photoresist is formed onto the other conductive layer, and the photoresist having at least one opening exposing the other conductive layer.
Step 10: At least other one conductive metal is filled into the opening of the photoresist by, for example, an electroplating process, and the other conductive metal disposed over the other conductive layer.
Step 11: The photoresist is removed.
Step 12: The other conductive layer exposed to the outside is removed by, for example, an etching process, and the other conductive layer deposited under the other conductive metal remains.
Provided that multiple metal layers are to be formed, the sequential steps 7-12 are repeated at least one time.
To achieve the foregoing and other objectives, the present invention provides another process for making the above chip structure. The process for fabricating a chip structure comprises the following steps.
Step 1: A wafer is provided with a plurality of electric devices, an interconnection scheme and a passivation layer. Both the electric devices and the interconnection scheme are arranged inside the wafer. The interconnection scheme is electrically connected with the electric devices. The passivation layer is disposed on a surface layer of the wafer. The passivation layer has at least one opening exposing the interconnection scheme.
Step 2: At least one conductive metal is formed over the passivation layer of the wafer by, for example, a sputtering process, and the conductive metal is electrically connected with the interconnection scheme.
Step 3: A photoresist is formed onto the conductive metal, and the photoresist is patterned to expose the conductive metal to the outside.
Step 4: The conductive metal exposed to the outside is removed, and the conductive metal deposited under the photoresist remains.
Step 5: The photoresist is removed.
Provided that two metal layers are to be formed, the process for fabricating the above chip structure further comprises the following steps:
Step 6: A dielectric sub-layer is formed over the passivation layer and covers the formed conductive metal. The dielectric sub-layer has at least one opening exposing the conductive metal formed at a lower portion.
Step 7: At least other one conductive metal is formed over the passivation layer of the wafer by, for example, a sputtering process, and the other conductive metal electrically is connected with the conductive metal formed at a lower portion.
Step 8: A photoresist is formed onto the other conductive metal, and the photoresist is patterned to expose the other conductive metal to the outside.
Step 9: The other conductive metal exposed to the outside is removed, and the other conductive metal deposited under the photoresist remains.
Step 10: The photoresist is removed.
Provided that multiple metal layers are to be formed, the sequential steps 6-10 are repeated at least one time.
Both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed. It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed.
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. A simple description of the drawings is as follows.
Prior to describing the embodiment of the invention, the factors of the resistance-capacitance delay and those of the power loss will be introduced as the following equations.
τ=RC=2∈ρL[L(Tu.d.Tm)+L/(WS)]
P∝2πfV2k∈(tan δ)
where .tau. is effect of resistance-capacitance delay; P is power loss; .∈ is dielectric constant of dielectric material; ρ is resistance of traces; L is trace length; W is trace width; S is pitch between traces; Tu.d. is thickness of dielectric material; Tm is trace thickness; tan δ is dielectric loss; V is applied voltage; f is frequency; k is factor of capacitor structure.
According to the above equation, the factors of the resistance-capacitance delay and those of the power loss can be known. Therefore, an increase in thickness of every dielectric layer, an application of dielectric material with low dielectric constant, an application of traces with low resistance, or an increase in width or thickness of traces leads an effect of a resistance-capacitance delay and a power loss of a chip to decline.
According to the above conception, the present invention provides various improved chip structure. Please refer to
The passivation layer 230 is disposed on the first built-up layer 220 and is provided with openings exposing the conductive pads 227. The passivation layer 230 is constructed of, for example, an inorganic compound, such as a silicon oxide compound, a silicon nitride compound, phosphosilicate glass (PSG), a silicon oxide nitride compound or a composite formed by laminating the above material.
The second built-up layer 240 is formed on the passivation layer 230. The second built-up layer 240 is formed by cross lamination of second metal multi-layers 246 and second dielectric multi-layers 241. Moreover, via metal fillers 248 connect the upper second metal layers 246 with the lower second metal layers 246 or connect the second metal layers 246 with the conductive pads 227. The second metal layers 246 and the via metal fillers 248 compose a second interconnection scheme 242. The second dielectric multi-layers 241 compose a second dielectric body 244. The second interconnection scheme 242 interlaces inside the second dielectric body 244 and is electrically connected to the conductive pads 227. The second interconnection scheme 242 includes plenty of nodes 247 (only shows one of them). The second dielectric body 244 is provided with openings 249 exposing the nodes 247 of the second interconnection scheme 242. The second interconnection scheme 242 can electrically connect with external circuits through the nodes 247. The second dielectric body 244 is made of, for example, an organic compound, such as polyimide (PI), benzocyclobutene (BCB), porous dielectric material, parylene, elastomer, or other macromolecule polymers. The material of the second interconnection scheme 242 includes, for example, copper, aluminum, gold, nickel, titanium-tungsten, titanium or chromium. Because mobile ions and moisture of the second built-up layer 240 can be prevented by the passivation layer 230 from penetrating into the first built-up layer 220 or the electric devices 214, it is practicable that an organic compound and various metals are formed over the passivation layer 230. The cross-sectional area A2 of the traces of the second metal layers 246 is extremely larger than the cross-sectional area A1 of the traces of the first metal layers 226 and than the cross-sectional area of the plugs 228. The cross-sectional area a of the via metal fillers 248 is extremely larger than the cross-sectional area A1 of the traces of the first metal layers 226 and than the cross-sectional area of the plugs 228. The trace width d2 of the second metal layers 246 is extremely larger than the trace width d1 of the first metal layers 226. The trace thickness t2 of the second metal layers 246 is extremely larger than the trace thickness t1 of the first metal layers 226. The thickness L2 of the individual second dielectric layers 241 is extremely larger than the thickness L1 of the individual first dielectric layers of the first built-up layers 220. The cross-sectional area a of the via metal fillers 248 is extremely larger than the area, exposed outside the passivation layer 230, of the conductive pads 227. The trace width d2 of the second metal layers 246 is larger than 1 micron, and preferably ranges from 1 micron to 1 centimeter. The trace thickness t2 of the second metal layers 246 is larger than 1 micron, and preferably ranges from 1 micron to 50 microns. The cross-sectional area A2 of the second metal layers 246 is larger than 1 square micron, and preferably ranges from 1 square micron to 0.5 square millimeters. The cross-sectional area a of the via metal fillers 248 is larger than 1 square micron, and preferably ranges from 1 square micron to 10,000 square microns. The thickness L2 of the individual second dielectric layers 241 is larger than 1 micron, and preferably ranges from 1 micron to 100 microns.
The above chip structure can decline the resistance-capacitance delay, the power of the chip, and the temperature generated by the driving chip since the cross sectional area, the width and the thickness of the traces of the second metal layers 246 are extremely large, since the cross sectional area of the via metal fillers 248 is also extremely large, since the second interconnection scheme 242 can be made of low-resistance material, such as copper or gold, since the thickness L2 of the individual second dielectric layers 241 is also extremely large, and since the second dielectric body 244 can be made of organic material, the dielectric constant of which is very low, approximately between 1.about.3, the practical value depending on the applied organic material.
According to the above chip structure, the traces of the second interconnection scheme 242 are extremely wide and thick and the cross-sectional area of the via metal fillers 248 is extremely large. Thus, the second interconnection scheme 242 can be formed by low-cost fabricating processes, such as an electroplating process, an electroless plating process, or a sputtering process, and, moreover, the second interconnection scheme 242 can be produced using facilities with low accuracy. Therefore, the production costs of the chip structure can be substantially saved. In addition, the request for the clean room where the second built-up layer is formed is not high, ranging from Class 10 to Class 100. Consequently, the construction cost of the clean room can be conserved.
The chip structure can simplify a design of a substrate board due to the layout redistribution, fitting the design of the substrate board, of the nodes 247 of the chip structure by the second interconnection scheme 242 and, besides, the application of the fewer nodes 247 to which ground voltage or power voltage is applied. Moreover, in case the layout redistribution of nodes 247 of various chips by the second interconnection scheme 242 causes the above various chips to be provided with the same node layout, the node layout, matching the same node layout of the above various chips, of the substrate board can be standardized. Therefore, the cost of fabricating the substrate board substantially drops off.
Next, other preferred embodiments of the present invention will be introduced. As a lot of electric devices are electrically connected with a power bus and a ground bus, the current through the power bus and the ground bus is relatively large. Therefore, the second interconnection scheme of the second built-up layer can be designed as a power bus or a ground bus, as shown in
Referring to
Referring to
According to the above embodiment, a second built-up layer is constructed from a second dielectric body and a second interconnection scheme. However, a second built-up layer also can be composed of only a second interconnection scheme, as shown in
According to the above chip structure, bumps or wires are directly electrically connected with the second interconnection layer. However, the application of the present invention is not limited to the above embodiment. Bumps or wires also can be directly connected with conductive pads and, besides, through the first interconnection scheme, the bumps or the wires can be electrically connected with the second interconnection scheme, as shown in
Referring to
Referring to
Following, the second built-up layer of the present invention will be described.
First, referring to
Next, a second dielectric sub-layer 541 is formed on the passivation layer 530 by, for example, a spin-coating process, wherein the second dielectric sub-layer 541 is made of, for instance, photosensitive organic material. Subsequently, one or more via metal openings 543 are formed through the second dielectric sub-layer 541 using, for example, a photolithography process. The via metal openings 543 expose the conductive pads 527. In case that the width of the openings 532 is very small, such as 1 micron, the width of the via metal openings 543 can be designed to be larger than that of the openings 532. This leads conductive metals, during the following metal-filling process, to be easily filled into the via metal openings 543 and the openings 532. For instance, the width of the via metal openings 543 is 3 microns or larger than 3 microns.
Next, referring to
Following, referring to
Besides, the chip structure of the present invention can also be performed by the other process, described as follows.
First, referring to
Subsequently, referring to
Following, referring to
Next, referring to
In addition, according to the above process, the present invention is not limited to the application of the second metal layer with a signal layer. However, second metal multi-layers also can be applied in the present invention. The fabrication method of the second metal multi-layers is to repeat the above fabrication method of the second metal layer with a single layer. The second built-up layer, with second metal multi-layers, fabricated by the above whatever process is finally formed with a second dielectric sub-layer having node openings that expose the second interconnection scheme to be electrically connected with external circuits. Alternatively, the whole surface of the second metal layer at the top portion can be exposed to the outside, and through bumps or conducting wires, the second metal layer can be electrically connected with external circuits. Besides, when the second metal layers is over 2 layers, the via metal openings of the second dielectric sub-layer at a higher portion expose the second metal layer at a lower portion so that the conductive metals disposited in the via metal openings electrically connect the upper second metal layer with the lower second metal layer.
To sum up, the present invention has the following advantages:
1. The chip structure of the present invention can decline the resistance-capacitance delay, the power of the chip, and the temperature generated by the driving chip since the cross sectional area, the width and the thickness of the traces of the second metal layer are extremely large, since the cross sectional area of the via metal filler is also extremely large, since the second interconnection scheme can be made of low-resistance material, such as copper or gold, since the thickness of the individual second dielectric layer is also extremely large, and since the second dielectric body can be made of organic material, the dielectric constant of which is very low, approximately between 1.about.3, the practical value depending on the applied organic material.
2. According to the chip structure of the present invention, each of the power buses or the ground buses can electrically connect with more electric devices than that of prior art. Consequently, the number of the power buses or the ground buses can be reduced and, also, the number of the electrostatic discharge circuits accompanying the power buses or the ground buses can be reduced. In addition, the number of the nodes accompanying the power buses or the ground buses can be reduced. Thus, the circuit layout can be simplified and the production cost of the chip structure can be saved. The electrostatic discharge circuits can prevent the electric devices electrically connected with the second interconnection scheme from being damaged by the sudden discharge of high voltage.
3. The chip structure of the present invention can simplify a design of a substrate board due to the node layout redistribution, fitting the design of the substrate board, of the chip structure by the second interconnection scheme and, besides, the application of the fewer nodes to which ground voltage or power voltage is applied. Moreover, in case the node layout redistribution of various chips by the second interconnection scheme causes the above various chips to be provided with the same node layout, the node layout, matching the same node layout of the above various chips, of the substrate board can be standardized. Therefore, the cost of fabricating the substrate board substantially drops off.
4. According to the chip structure of the present invention, the second interconnection scheme can be produced using facilities with low accuracy. Therefore, production costs of the chip structure can substantially be reduced.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
| Number | Date | Country | Kind |
|---|---|---|---|
| 90130876 A | Dec 2001 | TW | national |
| 90131030 A | Dec 2001 | TW | national |
| 90131796 A | Dec 2001 | TW | national |
This application is a continuation of U.S. patent application Ser. No. 12/024,998, filed on Feb. 2, 2008, now U.S. Pat. No. 8,008,776, which is a continuation of U.S. patent application Ser. No. 10/997,145, filed on Nov. 24, 2004, now U.S. Pat. No. 7,470,988, which is a division of U.S. patent application Ser. No. 10/690,250, filed on Oct. 20, 2003, now U.S. Pat. No. 6,936,531, which is a division of U.S. patent application Ser. No. 10/124,388, filed on Apr. 15, 2002, now U.S. Pat. No. 6,756,295, which claims the benefit of earlier filing date and right of priority to Taiwanese Patent Application No. 90131796, filed on Dec. 21, 2001, Taiwanese Patent Application No. 90131030, filed Dec. 14, 2001, and Taiwanese Patent Application No. 90130876, filed on Dec. 13, 2001. This application is related to Ser. No. 09/216,791, filed on Dec. 21, 1998, now abandoned, related to Ser. No. 09/251,183, filed on Feb. 17, 1999, now U.S. Pat. No. 6,383,916, related to Ser. No. 09/691,497, filed on Oct. 18, 2000, now U.S. Pat. No. 6,495,442, and related to Ser. No. 09/972,639, filed on Oct. 9, 2001, now U.S. Pat. No. 6,657,310. All disclosures of these prior applications are incorporated herein by reference.
| Number | Name | Date | Kind |
|---|---|---|---|
| 3573570 | Fuller et al. | Apr 1971 | A |
| 3668484 | Greig et al. | Jun 1972 | A |
| 4189909 | Marum | Feb 1980 | A |
| 4300184 | Colla | Nov 1981 | A |
| 4303423 | Camplin et al. | Dec 1981 | A |
| 4423547 | Farrar et al. | Jan 1984 | A |
| 4618878 | Aoyama et al. | Oct 1986 | A |
| 4685998 | Quinn | Aug 1987 | A |
| 4789647 | Peters | Dec 1988 | A |
| 4825276 | Kobayashi | Apr 1989 | A |
| 4959705 | Lemnios et al. | Sep 1990 | A |
| 4984061 | Matsumoto | Jan 1991 | A |
| 5046161 | Takada | Sep 1991 | A |
| 5055907 | Jacobs | Oct 1991 | A |
| 5061985 | Meguro et al. | Oct 1991 | A |
| 5065222 | Ishii | Nov 1991 | A |
| 5083187 | Lamson et al. | Jan 1992 | A |
| 5106461 | Volfson et al. | Apr 1992 | A |
| 5109267 | Koblinger et al. | Apr 1992 | A |
| 5134460 | Brady | Jul 1992 | A |
| 5196371 | Kulesza et al. | Mar 1993 | A |
| 5212403 | Nakanishi et al. | May 1993 | A |
| 5226232 | Boyd | Jul 1993 | A |
| 5229221 | Donado et al. | Jul 1993 | A |
| 5244833 | Gansauge et al. | Sep 1993 | A |
| 5272111 | Kosaki | Dec 1993 | A |
| 5357403 | Haller et al. | Oct 1994 | A |
| 5372967 | Sundaram et al. | Dec 1994 | A |
| 5384488 | Golshan et al. | Jan 1995 | A |
| 5418186 | Park et al. | May 1995 | A |
| 5427982 | Jun | Jun 1995 | A |
| 5434751 | Cole et al. | Jul 1995 | A |
| 5461333 | Condon et al. | Oct 1995 | A |
| 5461545 | Leroy et al. | Oct 1995 | A |
| 5468984 | Efland et al. | Nov 1995 | A |
| 5475236 | Yoshizaki | Dec 1995 | A |
| 5476726 | Harada et al. | Dec 1995 | A |
| 5478973 | Yoon | Dec 1995 | A |
| 5479049 | Aoki et al. | Dec 1995 | A |
| 5481205 | Frye et al. | Jan 1996 | A |
| 5497034 | Yamaguchi et al. | Mar 1996 | A |
| 5501006 | Gehman et al. | Mar 1996 | A |
| 5508228 | Nolan | Apr 1996 | A |
| 5514892 | Countryman et al. | May 1996 | A |
| 5532512 | Fillion | Jul 1996 | A |
| 5545909 | Williams et al. | Aug 1996 | A |
| 5569956 | Chillara et al. | Oct 1996 | A |
| 5576680 | Ling | Nov 1996 | A |
| 5578849 | Tadaki et al. | Nov 1996 | A |
| 5578860 | Costa et al. | Nov 1996 | A |
| 5612254 | Mu et al. | Mar 1997 | A |
| 5635767 | Wenzel et al. | Jun 1997 | A |
| 5641997 | Ohta et al. | Jun 1997 | A |
| 5652182 | Cleeves | Jul 1997 | A |
| 5659201 | Wollesen | Aug 1997 | A |
| 5663101 | Cronin | Sep 1997 | A |
| 5665989 | Dangelo | Sep 1997 | A |
| 5686764 | Fulcher | Nov 1997 | A |
| 5691248 | Cronin | Nov 1997 | A |
| 5700735 | Shiue et al. | Dec 1997 | A |
| 5701666 | DeHaven et al. | Dec 1997 | A |
| 5712194 | Kanazawa | Jan 1998 | A |
| 5726098 | Tsuboi | Mar 1998 | A |
| 5731945 | Bertin et al. | Mar 1998 | A |
| 5736792 | Orcutt | Apr 1998 | A |
| 5767010 | Mis et al. | Jun 1998 | A |
| 5792594 | Brown | Aug 1998 | A |
| 5798568 | Abercrombie et al. | Aug 1998 | A |
| 5807791 | Bertin et al. | Sep 1998 | A |
| 5818110 | Cronin | Oct 1998 | A |
| 5818748 | Bertin et al. | Oct 1998 | A |
| 5827778 | Yamada | Oct 1998 | A |
| 5834844 | Akagawa et al. | Nov 1998 | A |
| 5838043 | Yuan | Nov 1998 | A |
| 5854513 | Kim | Dec 1998 | A |
| 5883435 | Geffken | Mar 1999 | A |
| 5884990 | Burghartz et al. | Mar 1999 | A |
| 5892273 | Iwasaki | Apr 1999 | A |
| 5910020 | Yamada | Jun 1999 | A |
| 5925931 | Yamamoto | Jul 1999 | A |
| 5943597 | Kleffner | Aug 1999 | A |
| 5952726 | Liang | Sep 1999 | A |
| 5953626 | Hause et al. | Sep 1999 | A |
| 5959357 | Korman | Sep 1999 | A |
| 5959367 | O'Farrell et al. | Sep 1999 | A |
| 5960308 | Akagawa et al. | Sep 1999 | A |
| 5969424 | Matsuki et al. | Oct 1999 | A |
| 5970376 | Chen | Oct 1999 | A |
| 5973374 | Longcor | Oct 1999 | A |
| 5994766 | Shenoy | Nov 1999 | A |
| 5998873 | Blair et al. | Dec 1999 | A |
| 6008102 | Alford et al. | Dec 1999 | A |
| 6011314 | Leibovitz | Jan 2000 | A |
| 6015751 | Liu | Jan 2000 | A |
| 6018183 | Hsu | Jan 2000 | A |
| 6022792 | Ishii | Feb 2000 | A |
| 6037664 | Zhao et al. | Mar 2000 | A |
| 6066877 | Williams | May 2000 | A |
| 6069078 | Weaver et al. | May 2000 | A |
| 6071806 | Wu et al. | Jun 2000 | A |
| 6071809 | Zhao | Jun 2000 | A |
| 6075290 | Schaefer et al. | Jun 2000 | A |
| 6077726 | Mistry | Jun 2000 | A |
| 6100184 | Zhao et al. | Aug 2000 | A |
| 6100548 | Nguyen et al. | Aug 2000 | A |
| 6100590 | Yegnashankaran et al. | Aug 2000 | A |
| 6111317 | Okada et al. | Aug 2000 | A |
| 6114231 | Chen et al. | Sep 2000 | A |
| 6130457 | Yu et al. | Oct 2000 | A |
| 6143646 | Wetzel | Nov 2000 | A |
| 6144100 | Shen | Nov 2000 | A |
| 6153511 | Watatani | Nov 2000 | A |
| 6157079 | Taguchi | Dec 2000 | A |
| 6163075 | Okushima | Dec 2000 | A |
| 6165899 | Matumoto | Dec 2000 | A |
| 6168974 | Chang et al. | Jan 2001 | B1 |
| 6180426 | Lin | Jan 2001 | B1 |
| 6184121 | Buchwalter et al. | Feb 2001 | B1 |
| 6184143 | Ohashi | Feb 2001 | B1 |
| 6187680 | Costrini | Feb 2001 | B1 |
| 6191477 | Hashemi | Feb 2001 | B1 |
| 6214630 | Hsuan et al. | Apr 2001 | B1 |
| 6218302 | Braeckelmann et al. | Apr 2001 | B1 |
| 6229221 | Kloen et al. | May 2001 | B1 |
| 6232147 | Matsuki et al. | May 2001 | B1 |
| 6232662 | Saran | May 2001 | B1 |
| 6245662 | Naik et al. | Jun 2001 | B1 |
| 6245663 | Zhao et al. | Jun 2001 | B1 |
| 6287893 | Elenius et al. | Sep 2001 | B1 |
| 6288447 | Amishiro | Sep 2001 | B1 |
| 6300234 | Flynn | Oct 2001 | B1 |
| 6303423 | Lin | Oct 2001 | B1 |
| 6303977 | Schroen et al. | Oct 2001 | B1 |
| 6306749 | Lin | Oct 2001 | B1 |
| 6359328 | Dubin | Mar 2002 | B1 |
| 6362087 | Wang | Mar 2002 | B1 |
| 6383916 | Lin | May 2002 | B1 |
| 6387734 | Inaba | May 2002 | B1 |
| 6410435 | Ryan | Jun 2002 | B1 |
| 6429120 | Ahn | Aug 2002 | B1 |
| 6429764 | Karam et al. | Aug 2002 | B1 |
| 6448641 | Ker et al. | Sep 2002 | B2 |
| 6455885 | Lin | Sep 2002 | B1 |
| 6472745 | Iizuka | Oct 2002 | B1 |
| 6489647 | Lin | Dec 2002 | B1 |
| 6489656 | Lin | Dec 2002 | B1 |
| 6489689 | Nojiri | Dec 2002 | B2 |
| 6495442 | Lin et al. | Dec 2002 | B1 |
| 6515369 | Lin | Feb 2003 | B1 |
| 6518092 | Kikuchi | Feb 2003 | B2 |
| 6578754 | Tung | Jun 2003 | B1 |
| 6578784 | Lischynski et al. | Jun 2003 | B1 |
| 6593222 | Smoak | Jul 2003 | B2 |
| 6605528 | Lin | Aug 2003 | B1 |
| 6605873 | Vigna et al. | Aug 2003 | B1 |
| 6614091 | Downey | Sep 2003 | B1 |
| 6639299 | Aoki | Oct 2003 | B2 |
| 6646347 | Mercado | Nov 2003 | B2 |
| 6649509 | Lin | Nov 2003 | B1 |
| 6653563 | Bohr | Nov 2003 | B2 |
| 6657310 | Lin | Dec 2003 | B2 |
| 6667552 | Buynoski | Dec 2003 | B1 |
| 6680544 | Lu | Jan 2004 | B2 |
| 6683380 | Efland et al. | Jan 2004 | B2 |
| 6700162 | Lin et al. | Mar 2004 | B2 |
| 6707124 | Wachtler | Mar 2004 | B2 |
| 6756295 | Lin et al. | Jun 2004 | B2 |
| 6780748 | Yamaguchi | Aug 2004 | B2 |
| 6798050 | Homma | Sep 2004 | B1 |
| 6798073 | Lin et al. | Sep 2004 | B2 |
| 6800555 | Test | Oct 2004 | B2 |
| 6818540 | Saran et al. | Nov 2004 | B2 |
| 6818542 | Son et al. | Nov 2004 | B2 |
| 6835595 | Suzuki | Dec 2004 | B1 |
| 6844631 | Yong | Jan 2005 | B2 |
| 6861740 | Hsu | Mar 2005 | B2 |
| 6936531 | Lin et al. | Aug 2005 | B2 |
| 6943440 | Kim | Sep 2005 | B2 |
| 6963136 | Shinozaki et al. | Nov 2005 | B2 |
| 6965165 | Lin | Nov 2005 | B2 |
| 6977435 | Kim et al. | Dec 2005 | B2 |
| 6979647 | Bojkov | Dec 2005 | B2 |
| 7023088 | Suzuki | Apr 2006 | B2 |
| 7098127 | Ito | Aug 2006 | B2 |
| 7157363 | Suzuki | Jan 2007 | B2 |
| 7239028 | Anzai | Jul 2007 | B2 |
| 7246432 | Tanaka | Jul 2007 | B2 |
| 7294870 | Lin | Nov 2007 | B2 |
| 7309920 | Lin et al. | Dec 2007 | B2 |
| 7420276 | Lin et al. | Sep 2008 | B2 |
| 7470988 | Lin et al. | Dec 2008 | B2 |
| 7482259 | Lee et al. | Jan 2009 | B2 |
| 7582966 | Lin | Sep 2009 | B2 |
| 7906422 | Lee et al. | Mar 2011 | B2 |
| 7906849 | Lee et al. | Mar 2011 | B2 |
| 7915157 | Lee et al. | Mar 2011 | B2 |
| 7915734 | Lee et al. | Mar 2011 | B2 |
| 7919867 | Lee et al. | Apr 2011 | B2 |
| 7932603 | Lee et al. | Apr 2011 | B2 |
| 8008776 | Lee et al. | Aug 2011 | B2 |
| 8368204 | Lin et al. | Feb 2013 | B2 |
| 20010035452 | Test | Nov 2001 | A1 |
| 20010051426 | Pozser | Dec 2001 | A1 |
| 20020000671 | Zuniga | Jan 2002 | A1 |
| 20020037643 | Ishimaru | Mar 2002 | A1 |
| 20020043723 | Shimizu | Apr 2002 | A1 |
| 20020106884 | Ahn et al. | Aug 2002 | A1 |
| 20020121702 | Higgins, III | Sep 2002 | A1 |
| 20020158334 | Vu | Oct 2002 | A1 |
| 20030218246 | Abe | Nov 2003 | A1 |
| 20040023450 | Katagiri | Feb 2004 | A1 |
| 20050230783 | Lin | Oct 2005 | A1 |
| 20060038231 | Lin et al. | Feb 2006 | A9 |
| 20060063371 | Lin et al. | Mar 2006 | A1 |
| 20060063378 | Lin et al. | Mar 2006 | A1 |
| 20070026660 | Yamasaki | Feb 2007 | A1 |
| Number | Date | Country |
|---|---|---|
| 2793943 | Nov 2000 | FR |
| 01135043 | May 1989 | JP |
| 01183836 | Jul 1989 | JP |
| 01184848 | Jul 1989 | JP |
| 01184849 | Jul 1989 | JP |
| 04316351 | Nov 1992 | JP |
| 940007290 | Aug 1994 | KR |
| 339465 | Sep 1998 | TW |
| 383482 | Mar 2000 | TW |
| 401628 | Aug 2000 | TW |
| 417269 | Jan 2001 | TW |
| 428298 | Apr 2001 | TW |
| 430973 | Apr 2001 | TW |
| 441020 | Jun 2001 | TW |
| 452877 | Sep 2001 | TW |
| 452930 | Sep 2001 | TW |
| 465042 | Nov 2001 | TW |
| 489465 | Jun 2002 | TW |
| WO0035013 | Jun 2000 | WO |
| Entry |
|---|
| H. Hedler, T. Meyer, W. Leiberg, and R. Irsigler, “Bump wafer level packaging: A new packaging platform (not only) for memory products.” IMAPS, 2003 International Symposium on Microelectronics, Nov. 2003, pp. 681-686. |
| R. Dudek, H. Walter, R. Doering, B. Michel, T. Meyer, J. Zapf, and H. Hedler, “Thermomechanical design for reliability of WLPs with compliant interconnects.” Electronics Packaging Technology Conference, 2005, pp. 328-334. |
| Jen-Huang Jeng and T. E. Hsieh, “Application of AI/PI Composite Bumps to COG Bonding Process.” IEEE Transactions on Components and Packaging Technologies, vol. 24, No. 2, Jun. 2001, pp. 271-278. |
| Mistry, K. et al. “A 45nm Logic Technology with High-k+ Metal Gate Transistors, Strained Silicon, 9 Cu Interconnect Layers, 193nm Dry Patterning, and 100% Pb-free Packaging,” IEEE International Electron Devices Meeting (2007) pp. 247-250. |
| Edelstein, D.C., “Advantages of Copper Interconnects,” Proceedings of the 12th International IEEE VLSI Multilevel Interconnection Conference (1995) pp. 301-307. |
| Theng, C. et al. “An Automated Tool Deployment for ESD (Electro-Static-Discharge) Correct-by-Construction Strategy in 90 nm Process,” IEEE International Conference on Semiconductor Electronics (2004) pp. 61-67. |
| Gao, X. et al. “An improved electrostatic discharge protection structure for reducing triggering voltage and parasitic capacitance,” Solid-State Electronics, 27 (2003), pp. 1105-1110. |
| Yeoh, A. et al. “Copper Die Bumps (First Level Interconnect) and Low-K Dielectrics in 65nm High Volume Manufacturing,” Electronic Components and Technology Conference (2006) pp. 1611-1615. |
| Hu, C-K. et al. “Copper-Polyimide Wiring Technology for VLSI Circuits,” Materials Research Society Symposium Proceedings VLSI V (1990) pp. 369-373. |
| Roesch, W. et al. “Cycling copper flip chip interconnects,” Microelectronics Reliability, 44 (2004) pp. 1047-1054. |
| Lee, Y-H. et al. “Effect of ESD Layout on the Assembly Yield and Reliability,” International Electron Devices Meeting (2006) pp. 1-4. |
| Yeoh, T-S. “ESD Effects on Power Supply Clamps,” Proceedings of the 6th International Symposium on Physical & Failure Analysis of Integrated Circuits (1997) pp. 121-124. |
| Edelstein, D. et al. “Full Copper Wiring in a Sub-0.25 pm CMOS ULSI Technology,” Technical Digest IEEE International Electron Devices Meeting (1997) pp. 773-776. |
| Venkatesan, S. et al. “A High Performance 1.8V, 0.20 pm CMOS Technology with Copper Metallization,” Technical Digest IEEE International Electron Devices Meeting (1997) pp. 769-772. |
| Jenei, S. et al. “High Q Inductor Add-on Module in Thick Cu/SiLK™ single damascene,” Proceedings from the IEEE International Interconnect Technology Conference (2001) pp. 107-109. |
| Groves, R. et al. “High Q Inductors in a SiGe BiCMOS Process Utilizing a Thick Metal Process Add-on Module,” Proceedings of the Bipolar/BiCMOS Circuits and Technology Meeting (1999) pp. 149-152. |
| Sakran, N. et al. “The Implementation of the 65nm Dual-Core 64b Merom Processor,” IEEE International Solid-State Circuits Conference, Session 5, Microprocessors, 5.6 (2007) pp. 106-107, p. 590. |
| Kumar, R. et al. “A Family of 45nm IA Processors,” IEEE International Solid-State Circuits Conference, Session 3, Microprocessor Technologies, 3.2 (2009) pp. 58-59. |
| Bohr, M. “The New Era of Scaling in an SoC World,” International Solid-State Circuits Conference (2009) Presentation Slides 1-66. |
| Bohr, M. “The New Era of Scaling in an SoC World,” International Solid-State Circuits Conference (2009) pp. 23-28. |
| Ingerly, D. et al. “Low-K Interconnect Stack with Thick Metal 9 Redistribution Layer and Cu Die Bump for 45nm High vol. Manufacturing,” International Interconnect Technology Conference (2008) pp. 216-218. |
| Kurd, N. et al. “Next Generation Intel® Micro-architecture (Nehalem) Clocking Architecture,” Symposium on VLSI Circuits Digest of Technical Papers (2008) pp. 62-63. |
| Maloney, T. et al. “Novel Clamp Circuits for IC Power Supply Protection,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part C, vol. 19, No. 3 (Jul. 1996) pp. 150-161. |
| Geffken, R. M. “An Overview of Polyimide Use in Integrated Circuits and Packaging,” Proceedings of the Third International Symposium on Ultra Large Scale Integration Science and Technology (1991) pp. 667-677. |
| Luther, B. et al. “Planar Copper-Polyimide Back End of the Line Interconnections for ULSI Devices,” Proceedings of the 10th International IEEE VLSI Multilevel Interconnection Conference (1993) pp. 15-21. |
| Master, R. et al. “Ceramic Mini-Ball Grid Array Package for High Speed Device,” Proceedings from the 45th Electronic Components and Technology Conference (1995) pp. 46-50. |
| Maloney, T. et al. “Stacked PMOS Clamps for High Voltage Power Supply Protection,” Electrical Overstress/Electrostatic Discharge Symposium Proceedings (1999) pp. 70-77. |
| Lin, M.S. et al. “A New System-on-a-Chip (SOC) Technology—High Q Post Passivation Inductors,” Proceedings from the 53rd Electronic Components and Technology Conference (May 30, 2003) pp. 1503-1509. |
| Megic Corp. “MEGIC way to system solutions through bumping and redistribution,” (Brochure) (Feb. 6, 2004) pp. 1-3. |
| Lin, M.S. “Post Passivation Technology™—MEGIC ® Way to System Solutions,” Presentation given at TSMC Technology Symposium, Japan (Oct. 1, 2003) pp. 1-32. |
| Lin, M.S. et al. “A New IC Interconnection Scheme and Design Architecture for High Performance ICs at Very Low Fabrication Cost—Post Passivation Interconnection,” Proceedings of the IEEE Custom Integrated Circuits Conference (Sep. 24, 2003) pp. 533-536. |
| Number | Date | Country | |
|---|---|---|---|
| 20110278727 A1 | Nov 2011 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 10690250 | Oct 2003 | US |
| Child | 10997145 | US | |
| Parent | 10124388 | Apr 2002 | US |
| Child | 10690250 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 12024998 | Feb 2008 | US |
| Child | 13191356 | US | |
| Parent | 10997145 | Nov 2004 | US |
| Child | 12024998 | US |
