3060076

Information

• Patent Grant
• 3060076

• References
• Source

• Patent Number

  3,060,076

• Date Filed

  Not available

• Date Issued

  Tuesday, October 23, 1962
  62 years ago

• CPC

  • H05K3/4617 - characterized by laminating only or mainly similar single-sided circuit boards
  • H05K3/007 - Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
  • H05K3/205 - using a pattern electroplated or electroformed on a metallic carrier
  • H05K3/421 - Blind plated via connections
  • H05K1/036 - Multilayers with layers of different types
  • H05K3/005 - Punching of holes
  • H05K3/28 - Applying non-metallic protective coatings
  • H05K2201/0394 - Conductor crossing over a hole in the substrate
  • H05K2201/043 - Stacked PCBs with their backs attached to each other without electrical connection
  • H05K2201/09509 - Blind vias
  • H05K2201/09527 - Inverse blind vias
  • H05K2201/096 - Vertically aligned vias, holes or stacked vias
  • H05K2203/0108 - Male die used for patterning, punching or transferring
  • H05K2203/0152 - Temporary metallic carrier
  • H05K2203/0156 - Temporary polymeric carrier or foil
  • H05K2203/1572 - Processing both sides of a PCB by the same process Providing a similar arrangement of components on both sides Making interlayer connections from two sides
  • Y10S425/811 - Stencil
  • Y10T29/49126 - Assembling bases
  • Y10T156/1056 - Perforating lamina
  • Y10T156/108 - Flash, trim or excess removal

• US Classifications

  • 156 - Adhesive bonding and miscellaneous chemical manufacture
  • 029 - Metal working
  • 174 - Electricity: conductors and insulators
  • 264 - Plastic and nonmetallic article shaping or treating: processes
  • 425 - Plastic article or earthenware shaping or treating: apparatus