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3472443
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Information
Patent Grant
3472443
References
Source
Patent Number
3,472,443
Date Filed
Not available
Date Issued
Tuesday, October 14, 1969
55 years ago
CPC
H01L24/85 - using a wire connector
B23K20/005 - Capillary welding
H01L24/78 - Apparatus for connecting with wire connectors
B23K2201/40 - Semiconductor devices
H01L24/45 - of an individual wire connector
H01L2224/45015 - being circular
H01L2224/45124 - Aluminium (Al) as principal constituent
H01L2224/45139 - Silver (Ag) as principal constituent
H01L2224/45144 - Gold (Au) as principal constituent
H01L2224/45147 - Copper (Cu) as principal constituent
H01L2224/4518 - Molybdenum (Mo) as principal constituent
H01L2224/45181 - Tantalum (Ta) as principal constituent
H01L2224/45183 - Rhenium (Re) as principal constituent
H01L2224/45184 - Tungsten (W) as principal constituent
H01L2224/78301 - Capillary
H01L2224/78302 - Shape
H01L2224/786 - Means for supplying the connector to be connected in the bonding apparatus
H01L2224/85043 - using a flame torch
H01L2224/851 - the connector being supplied to the parts to be connected in the bonding apparatus
H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
H01L2924/01005 - Boron [B]
H01L2924/01006 - Carbon [C]
H01L2924/01013 - Aluminum [Al]
H01L2924/01014 - Silicon [Si]
H01L2924/01027 - Cobalt [Co]
H01L2924/01028 - Nickel [Ni]
H01L2924/01029 - Copper [Cu]
H01L2924/01032 - Germanium [Ge]
H01L2924/01033 - Arsenic [As]
H01L2924/01041 - Niobium [Nb]
H01L2924/01042 - Molybdenum [Mo]
H01L2924/01047 - Silver [Ag]
H01L2924/01073 - Tantalum [Ta]
H01L2924/01074 - Tungsten [W]
H01L2924/01075 - Rhenium [Re]
H01L2924/01079 - Gold [Au]
Y10T29/49162 - by using wire as conductive path
Y10T29/49169 - Assembling electrical component directly to terminal or elongated conductor
Y10T29/49194 - Assembling elongated conductors, e.g., splicing, etc.
US Classifications
228 - Metal fusion bonding
029 - Metal working
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