Number | Date | Country | Kind |
---|---|---|---|
95 06994 | Jun 1995 | FRX |
Number | Name | Date | Kind |
---|---|---|---|
4731701 | Kuo | Mar 1988 | |
4982311 | Dehaine | Jan 1991 | |
5050040 | Gondusky | Sep 1991 | |
5319237 | Legros | Jun 1994 | |
5347091 | Schoeder | Sep 1994 | |
5471366 | Ozawa | Nov 1995 | |
5475264 | Sudo | Dec 1995 | |
5506755 | Miyagi | Apr 1996 | |
5583377 | Higgins, III | Dec 1996 | |
5600541 | Boue | Feb 1997 | |
5608261 | Bhattacharyya | Mar 1997 |
Number | Date | Country |
---|---|---|
9308842 | Sep 1993 | DEX |
4728869 | Nov 1972 | JPX |
382060 | Apr 1991 | JPX |
778917 | Mar 1995 | JPX |
Entry |
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IBM Technical Disclosure Bulletin, vol. 13, No. 1, Jun. 1970, NY, p. 58, G.O. Tiffany, "Integrated Circuit Package and Heat Sink". |
1993 Japan IEMT Symposium, Jun. 1994, Kanazawa, JP, pp. 41-45, B. Freyman et al., "Ball Grid Array (bga): the New Standard for High I/o Surface Mount Packages". |
4th IEEE/CHMT European Int. Electr. Manuf. Technol. Symp., Jun. 1988, Neuilly Sur Seine, FR, pp. 34-36; C.M. Val et al., "Mounting Open-Via Chip-Carriers (for 100 to 300 inputs/outputs i.c.)". |