Claims
- 1. An integrated circuit package comprising:
- (a) an integrated circuit,
- (b) a lead frame having a plurality of legs in electrical connnection with the integrated circuit, and
- (c) an electrically insulating, thermally conductive substrate having first and second faces, the first face being coated with diamond film which is in intimate thermal contact with both the integrated circuit and the plurality of legs of the lead frame, the bulk of the substrate comprising a thermally-conductive non-diamond material.
- 2. The package of claim 1 wherein the non-diamond material is chosen from the group consisting of molybdenum, aluminum nitride, graphite, and silicon carbide.
- 3. The package of claim 2 wherein the diamond film has a thickness of at least 5 micrometers.
- 4. The package of claim 1 wherein the non-diamond material is about 500 microns thick.
CROSS-REFERENCE TO RELATED APPLICATIONS
This is a continuation-in-part of application Ser. No. 08/269,706 filed Jul. 1, 1994.
US Referenced Citations (4)
Foreign Referenced Citations (8)
Number |
Date |
Country |
0273556 |
Jul 1988 |
EPX |
515094 |
Nov 1992 |
EPX |
0538798 |
Apr 1993 |
EPX |
3227535 |
Aug 1991 |
JPX |
3227535 |
Oct 1991 |
JPX |
5160304 |
Jun 1993 |
JPX |
5251609 |
Sep 1993 |
JPX |
6291217 |
Oct 1994 |
JPX |
Non-Patent Literature Citations (1)
Entry |
Electrical Resistive, Thermally conductive Diamond Coating for Integrated Circuit Chips "Research Disclosure", Apr. 1988, No. 288. |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
269706 |
Jul 1994 |
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