Claims
- 1. A process of fabricating a molded semiconductor device comprising the steps of:
- a) preparing a conductive lattice patterned on a film carrier, a semiconductor chip, and a lead frame having an island portion and external leads;
- b) selectively cutting said conductive lattice so as to form intermediate conductive leads on said film carrier;
- c) coupling said intermediate conductive leads with terminals of said semiconductor chip mounted on said island portion and with said external leads; and
- d) molding said semiconductor chip on said island portion and said intermediate conductive leads on said film carrier in molding material, said external leads partially projecting from said molding material.
- 2. A process as set forth in claim 1, in which said conductive lattice is selectively cut by using a laser beam.
- 3. A process of fabricating a molded semiconductor device comprising the steps of:
- (a) preparing
- a semiconductor chip having an integrated circuit fabricated therein and terminals coupled with said integrated circuit for communicating with an external electric device,
- a lead frame having an island portion for mounting said semiconductor chip and external leads provided around said island portion, and
- a conductive lattice pattern formed on a film carrier;
- b) selectively cutting said conductive lattice pattern so as to form intermediate conductive leads on said film carrier, said intermediate conductive leads being arranged in such a manner as to be aligned with said terminals and said external leads,
- c) connecting said intermediate conductive leads with said terminals and with said external leads, at least some of said intermediate conductive leads being electrically isolated from one another; and
- d) sealing said semiconductor chip on said island portion and said intermediate conductive leads on said film carrier in a molding material in such a manner that said external leads at least partially project therefrom.
Priority Claims (1)
Number |
Date |
Country |
Kind |
3-318295 |
Dec 1991 |
JPX |
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Parent Case Info
This is a divisional of application Ser. No. 07/985,191, filed Dec. 3, 1992 abandoned.
US Referenced Citations (11)
Divisions (1)
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Number |
Date |
Country |
Parent |
985191 |
Dec 1992 |
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