Claims
- 1. A semiconductor chip package, comprising:
- a ceramic substrate including a first surface and a second surface, opposing said first surface;
- at least one semiconductor chip mounted on said first surface; and
- at least one pin which is mechanically connected to said ceramic substrate and electrically connected to said at least one semiconductor chip, Characterized In That
- said pin is mechanically connected to a contact pad on either said first surface or said second surface of said ceramic substrate, the mechanical connection between said pin and said contact pad, as well as the electrical connection between said pin and said semiconductor chip, including a region of solder at least partially encapsulated in a region of material including an epoxy resin, said material region being chosen in relation to said solder region so that said solder region exhibits an increase in electrical resistance less than 200 milliohms when said solder/material connection is subjected to sinusoidal thermal cycling from 0.degree. C. to 100.degree. C., at a frequency of 3 cycles per hour, for 2000 cycles.
- 2. The semiconductor chip package of claim 1, wherein said solder region is characterized by a first coefficient of thermal expansion, CTE.sub.1, and said material region is characterized by a second coefficient of thermal expansion, CTE.sub.2, and wherein
- CTE.sub.1 -30%CTE.sub.1 .ltoreq.CTE.sub.2 .ltoreq.CTE.sub.1 +30%CTE.sub.1
- 3. The semiconductor chip package of claim 1, wherein said epoxy resin is at least partially filled with a filler material, which filler material, per se, has a coefficient of thermal expansion which is less than a coefficient of thermal expansion of said epoxy resin, per se.
- 4. The semiconductor chip package of claim 1, wherein said epoxy resin includes cyclohexyldiepoxide resin.
- 5. The semiconductor chip package of claim 3, wherein said filler material is electrically insulating.
- 6. The semiconductor chip package of claim 3, wherein said filler material includes silica.
- 7. The semiconductor chip package of claim 1, wherein said ceramic substrate includes alumina.
- 8. The semiconductor chip package of claim 1, wherein said ceramic substrate includes aluminum nitride.
CROSS-REFERENCES TO RELATED APPLICATIONS
This is a continuation-in-part of U.S. application Ser. No. 07/838,613 filed Feb. 18, 1992 by Stephen R. Engle, Scott P. Moore and Mukund K. Saraiya, now U.S. Pat. No. 5,243,133.
US Referenced Citations (3)
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
838613 |
Feb 1992 |
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