Guilian Gao

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dimension compensation control for directly bonded structures
- Patent number 12,341,125
- Issue date Jun 24, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal for microelectronic assembly
- Patent number 12,322,667
- Issue date Jun 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
DBI to SI bonding for simplified handle wafer
- Patent number 12,300,662
- Issue date May 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated optical waveguides, direct-bonded waveguide interface jo...
- Patent number 12,271,032
- Issue date Apr 8, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Shaowu Huang
- G02 - OPTICS
Information Patent Grant
Direct bonded stack structures for increased reliability and improv...
- Patent number 12,272,677
- Issue date Apr 8, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct bonded and interconnected stack
- Patent number 12,266,640
- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling systems with coolant channel for device packaging
- Patent number 12,261,099
- Issue date Mar 25, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset pads over TSV
- Patent number 12,243,851
- Issue date Mar 4, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Bongsub Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV as pad
- Patent number 12,205,926
- Issue date Jan 21, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling systems and methods of manufacturing embedded cool...
- Patent number 12,191,233
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer structures for making direct metal-to-metal bonds at low temp...
- Patent number 12,136,605
- Issue date Nov 5, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 12,132,020
- Issue date Oct 29, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 12,100,676
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct gang bonding methods including directly bonding first elemen...
- Patent number 12,080,672
- Issue date Sep 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processed stacked dies
- Patent number 12,068,278
- Issue date Aug 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 12,046,571
- Issue date Jul 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dimension compensation control for directly bonded structures
- Patent number 12,009,338
- Issue date Jun 11, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mitigating surface damage of probe pads in preparation for direct b...
- Patent number 11,978,681
- Issue date May 7, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,967,575
- Issue date Apr 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pads over TSV
- Patent number 11,955,445
- Issue date Apr 9, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded stack structures for increased reliability and improv...
- Patent number 11,955,463
- Issue date Apr 9, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated optical waveguides, direct-bonded waveguide interface jo...
- Patent number 11,860,415
- Issue date Jan 2, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Shaowu Huang
- G02 - OPTICS
Information Patent Grant
Techniques for processing devices
- Patent number 11,855,064
- Issue date Dec 26, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct bonded and interconnected stack
- Patent number 11,837,582
- Issue date Dec 5, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DBI to SI bonding for simplified handle wafer
- Patent number 11,791,307
- Issue date Oct 17, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct bonded and interconnected stack
- Patent number 11,764,189
- Issue date Sep 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV as pad
- Patent number 11,749,645
- Issue date Sep 5, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset pads over TSV
- Patent number 11,728,313
- Issue date Aug 15, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Bongsub Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processed stacked dies
- Patent number 11,652,083
- Issue date May 16, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 11,515,279
- Issue date Nov 29, 2022
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED OPTICAL WAVEGUIDES, DIRECT-BONDED WAVEGUIDE INTERFACE JO...
- Publication number 20250231341
- Publication date Jul 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Shaowu HUANG
- G02 - OPTICS
Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20250226290
- Publication date Jul 10, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICES USING RECONSTITUTED SUBSTRATES AND METHODS OF FORMI...
- Publication number 20250221128
- Publication date Jul 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
Information Patent Application
TRANSFER OF MULTIPLE SMALL ELEMENTS TO A CARRIER
- Publication number 20250212554
- Publication date Jun 26, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
Information Patent Application
LOW TEMPERATURE BONDED STRUCTURES
- Publication number 20250096172
- Publication date Mar 20, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR BONDING DIES
- Publication number 20250006689
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MATERIALS FOR DIRECT BONDING
- Publication number 20250006679
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSED STACKED DIES
- Publication number 20240404990
- Publication date Dec 5, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT GANG BONDING METHODS AND STRUCTURES
- Publication number 20240387439
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR PROCESSING DEVICES
- Publication number 20240371850
- Publication date Nov 7, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TANDEM OLED DEVICES WITH STABLE INORGANIC CHARGE GENERATION LAYERS
- Publication number 20240334733
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Oliver Zhao
Information Patent Application
DIMENSION COMPENSATION CONTROL FOR DIRECTLY BONDED STRUCTURES
- Publication number 20240312953
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20240282747
- Publication date Aug 22, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING
- Publication number 20240249998
- Publication date Jul 25, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED DIRECT BONDED AND INTERCONNECTED STACK
- Publication number 20240243103
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING FUNCTIONAL AND NON-...
- Publication number 20240222239
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEBONDING REPAIR DEVICES
- Publication number 20240222319
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED GRAIN GROWTH FOR BONDING AND BONDED STRUCTURE WITH CONTR...
- Publication number 20240213191
- Publication date Jun 27, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING SURFACE DAMAGE OF PROBE PADS IN PREPARATION FOR DIRECT B...
- Publication number 20240213105
- Publication date Jun 27, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROV...
- Publication number 20240203948
- Publication date Jun 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PADS OVER TSV
- Publication number 20240194625
- Publication date Jun 13, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20240186284
- Publication date Jun 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED OPTICAL WAVEGUIDES, DIRECT-BONDED WAVEGUIDE INTERFACE JO...
- Publication number 20240118492
- Publication date Apr 11, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Shaowu HUANG
- G02 - OPTICS
Information Patent Application
LOW TEMPERATURE BONDED STRUCTURES
- Publication number 20240113059
- Publication date Apr 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV AS PAD
- Publication number 20240088101
- Publication date Mar 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20240038633
- Publication date Feb 1, 2024
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET PADS OVER TSV
- Publication number 20240006383
- Publication date Jan 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Bongsub Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20230420313
- Publication date Dec 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GANG-FLIPPING OF DIES PRIOR TO BONDING
- Publication number 20230360950
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSED STACKED DIES
- Publication number 20230282610
- Publication date Sep 7, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS

Guilian Gao

Person

Patents Grantslast 30 patents

Dimension compensation control for directly bonded structures

Seal for microelectronic assembly

DBI to SI bonding for simplified handle wafer

Integrated optical waveguides, direct-bonded waveguide interface jo...

Direct bonded stack structures for increased reliability and improv...

Molded direct bonded and interconnected stack

Embedded cooling systems with coolant channel for device packaging

Offset pads over TSV

TSV as pad

Embedded cooling systems and methods of manufacturing embedded cool...

Layer structures for making direct metal-to-metal bonds at low temp...

Low temperature bonded structures

Low temperature bonded structures

Direct gang bonding methods including directly bonding first elemen...

Processed stacked dies

Low temperature bonded structures

Dimension compensation control for directly bonded structures

Mitigating surface damage of probe pads in preparation for direct b...

Bond enhancement structure in microelectronics for trapping contami...

Metal pads over TSV

Direct bonded stack structures for increased reliability and improv...

Integrated optical waveguides, direct-bonded waveguide interface jo...

Techniques for processing devices

Molded direct bonded and interconnected stack

DBI to SI bonding for simplified handle wafer

Molded direct bonded and interconnected stack

TSV as pad

Offset pads over TSV

Processed stacked dies

Low temperature bonded structures

Patents Applicationslast 30 patents

INTEGRATED OPTICAL WAVEGUIDES, DIRECT-BONDED WAVEGUIDE INTERFACE JO...

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...

DISPLAY DEVICES USING RECONSTITUTED SUBSTRATES AND METHODS OF FORMI...

TRANSFER OF MULTIPLE SMALL ELEMENTS TO A CARRIER

LOW TEMPERATURE BONDED STRUCTURES

STRUCTURES AND METHODS FOR BONDING DIES

CONDUCTIVE MATERIALS FOR DIRECT BONDING

PROCESSED STACKED DIES

DIRECT GANG BONDING METHODS AND STRUCTURES

TECHNIQUES FOR PROCESSING DEVICES

TANDEM OLED DEVICES WITH STABLE INORGANIC CHARGE GENERATION LAYERS

DIMENSION COMPENSATION CONTROL FOR DIRECTLY BONDED STRUCTURES

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING

MOLDED DIRECT BONDED AND INTERCONNECTED STACK

SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING FUNCTIONAL AND NON-...

DEBONDING REPAIR DEVICES

CONTROLLED GRAIN GROWTH FOR BONDING AND BONDED STRUCTURE WITH CONTR...

MITIGATING SURFACE DAMAGE OF PROBE PADS IN PREPARATION FOR DIRECT B...

DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROV...

METAL PADS OVER TSV

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

INTEGRATED OPTICAL WAVEGUIDES, DIRECT-BONDED WAVEGUIDE INTERFACE JO...

LOW TEMPERATURE BONDED STRUCTURES

TSV AS PAD

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...

OFFSET PADS OVER TSV

SEAL FOR MICROELECTRONIC ASSEMBLY

GANG-FLIPPING OF DIES PRIOR TO BONDING

PROCESSED STACKED DIES