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Guilian Gao

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  • San Jose, CA, US
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    CONTROLLED GRAIN GROWTH FOR BONDING AND BONDED STRUCTURE WITH CONTR...
    • Publication number 20240213191
    • Publication date Jun 27, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Jeremy Alfred Theil
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MITIGATING SURFACE DAMAGE OF PROBE PADS IN PREPARATION FOR DIRECT B...
    • Publication number 20240213105
    • Publication date Jun 27, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Guilian Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROV...
    • Publication number 20240203948
    • Publication date Jun 20, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METAL PADS OVER TSV
    • Publication number 20240194625
    • Publication date Jun 13, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Guilian Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
    • Publication number 20240186284
    • Publication date Jun 6, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Chandrasekhar Mandalapu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW TEMPERATURE BONDED STRUCTURES
    • Publication number 20240113059
    • Publication date Apr 4, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TSV AS PAD
    • Publication number 20240088101
    • Publication date Mar 14, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Guilian Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
    • Publication number 20240038633
    • Publication date Feb 1, 2024
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OFFSET PADS OVER TSV
    • Publication number 20240006383
    • Publication date Jan 4, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Bongsub Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEAL FOR MICROELECTRONIC ASSEMBLY
    • Publication number 20230420313
    • Publication date Dec 28, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Rajesh Katkar
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    GANG-FLIPPING OF DIES PRIOR TO BONDING
    • Publication number 20230360950
    • Publication date Nov 9, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Guilian Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSED STACKED DIES
    • Publication number 20230282610
    • Publication date Sep 7, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDED STRUCTURES
    • Publication number 20230268300
    • Publication date Aug 24, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW TEMPERATURE BONDED STRUCTURES
    • Publication number 20230268307
    • Publication date Aug 24, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MOLDED DIRECT BONDED AND INTERCONNECTED STACK
    • Publication number 20230253367
    • Publication date Aug 10, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Guilian Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIRECT BONDING ON PACKAGE SUBSTRATES
    • Publication number 20230215836
    • Publication date Jul 6, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIRECTLY BONDED FRAME WAFERS
    • Publication number 20230207402
    • Publication date Jun 29, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Gaius Gillman Fountain
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    APPARATUSES AND METHODS FOR DIE BOND CONTROL
    • Publication number 20230207514
    • Publication date Jun 29, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Guilian Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW STRESS DIRECT HYBRID BONDING
    • Publication number 20230197655
    • Publication date Jun 22, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Jeremy Alfred Theil
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES
    • Publication number 20230187398
    • Publication date Jun 15, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Guilian GAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER DISTRIBUTION FOR STACKED ELECTRONIC DEVICES
    • Publication number 20230187412
    • Publication date Jun 15, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Guilian Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED STRUCTURES WITH CAPACITIVE COUPLING CONNECTIONS
    • Publication number 20230125395
    • Publication date Apr 27, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Guilian Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LAYER STRUCTURES FOR MAKING DIRECT METAL-TO-METAL BONDS AT LOW TEMP...
    • Publication number 20230118156
    • Publication date Apr 20, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Guilian Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED INDUCTORS IN MULTI-DIE STACKING
    • Publication number 20230123423
    • Publication date Apr 20, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Guilian Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF BONDING THIN SUBSTRATES
    • Publication number 20230115122
    • Publication date Apr 13, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING STACKED SUBSTRATES
    • Publication number 20230008039
    • Publication date Jan 12, 2023
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka UZOH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEAL FOR MICROELECTRONIC ASSEMBLY
    • Publication number 20220415734
    • Publication date Dec 29, 2022
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Rajesh Katkar
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    DIRECT BONDING AND DEBONDING OF CARRIER
    • Publication number 20220320036
    • Publication date Oct 6, 2022
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Guilian Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIRECT BONDING AND DEBONDING OF CARRIER
    • Publication number 20220319901
    • Publication date Oct 6, 2022
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Dominik Suwito
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METAL PADS OVER TSV
    • Publication number 20220302058
    • Publication date Sep 22, 2022
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Guilian GAO
    • H01 - BASIC ELECTRIC ELEMENTS