Ichiro Anjoh

Person

Koganei, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 8,441,126
- Issue date May 14, 2013
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with stacked semiconductor devices
- Patent number 7,969,019
- Issue date Jun 28, 2011
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor apparatus
- Patent number 7,964,962
- Issue date Jun 21, 2011
- Elpidia Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 7,786,564
- Issue date Aug 31, 2010
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,420,284
- Issue date Sep 2, 2008
- Renesas Technology Corp.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor wafer, semiconductor module, an...
- Patent number 7,217,992
- Issue date May 15, 2007
- Renesas Technology Corp.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit tape having adhesive film semiconductor device and a method...
- Patent number 7,202,570
- Issue date Apr 10, 2007
- Renesas Technology Corp.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,091,620
- Issue date Aug 15, 2006
- Renesas Technology Corp.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring tape for semiconductor device including a buffer layer havin...
- Patent number 7,038,325
- Issue date May 2, 2006
- Hitachi Cable, Ltd.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor wafer, semiconductor module, an...
- Patent number 6,888,230
- Issue date May 3, 2005
- Renesas Technology Corp.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the devices
- Patent number 6,861,294
- Issue date Mar 1, 2005
- Renesas Technology Corp.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and lead frame therefor
- Patent number 6,844,219
- Issue date Jan 18, 2005
- Renesas Technology Corp.
- Makoto Kitano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit tape having adhesive film, semiconductor device, and a meth...
- Patent number 6,791,194
- Issue date Sep 14, 2004
- Hitachi, Ltd.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket for testing of semiconductor device, and semiconductor devic...
- Patent number 6,710,610
- Issue date Mar 23, 2004
- Hitachi, Ltd.
- Naotaka Tanaka
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device comprising stress relaxation layers and method...
- Patent number 6,710,446
- Issue date Mar 23, 2004
- Renesas Technology Corporation
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device a ball grid array pa...
- Patent number 6,686,226
- Issue date Feb 3, 2004
- Hitachi, Ltd.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,670,215
- Issue date Dec 30, 2003
- Renesas Technology Corporation
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a ball grid array type semiconductor package
- Patent number 6,664,135
- Issue date Dec 16, 2003
- Renesas Technology Corporation
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,642,083
- Issue date Nov 4, 2003
- Hitachi, Ltd.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,521,981
- Issue date Feb 18, 2003
- Hitachi, Ltd.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,472,727
- Issue date Oct 29, 2002
- Hitachi, Ltd.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and lead frame therefor
- Patent number 6,465,876
- Issue date Oct 15, 2002
- Hitachi, Ltd.
- Makoto Kitano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a porous buffer layer for semiconductor...
- Patent number 6,433,440
- Issue date Aug 13, 2002
- Hitachi, Ltd.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same technica...
- Patent number 6,396,145
- Issue date May 28, 2002
- Hitachi, Ltd.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a ball grid array type semiconductor package
- Patent number 6,365,439
- Issue date Apr 2, 2002
- Hitachi, Ltd.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,355,975
- Issue date Mar 12, 2002
- Hitachi, Ltd.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,355,500
- Issue date Mar 12, 2002
- Hitachi Ltd.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,353,255
- Issue date Mar 5, 2002
- Hitachi, Ltd.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealed stacked arrangement of semiconductor devices
- Patent number RE37539
- Issue date Feb 5, 2002
- Hitachi, Ltd.
- Satoshi Oguchi
- 257 - Active solid-state devices
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,342,726
- Issue date Jan 29, 2002
- Hitachi, Ltd.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR DEVICE
- Publication number 20120119356
- Publication date May 17, 2012
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE INCLUDING SEMICONDUCT...
- Publication number 20090184430
- Publication date Jul 23, 2009
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR...
- Publication number 20090020873
- Publication date Jan 22, 2009
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20090020874
- Publication date Jan 22, 2009
- Elpida Memory, Inc.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20060261494
- Publication date Nov 23, 2006
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing metthod thereof
- Publication number 20050212142
- Publication date Sep 29, 2005
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050200019
- Publication date Sep 15, 2005
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050189639
- Publication date Sep 1, 2005
- Hitachi, Ltd
- Hisashi Tanie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit tape having adhesive film semiconductor device and a method...
- Publication number 20040224149
- Publication date Nov 11, 2004
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, semiconductor wafer, semiconductor module, an...
- Publication number 20040217453
- Publication date Nov 4, 2004
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring tape for semiconductor device including a buffer layer havin...
- Publication number 20040195702
- Publication date Oct 7, 2004
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20040061220
- Publication date Apr 1, 2004
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices and methods of making the devices
- Publication number 20040063272
- Publication date Apr 1, 2004
- Hitachi, Ltd.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit tape having adhesive film, semiconductor device, and a meth...
- Publication number 20020160185
- Publication date Oct 31, 2002
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and wiring tape for semiconductor device
- Publication number 20020158343
- Publication date Oct 31, 2002
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacture thereof
- Publication number 20020130412
- Publication date Sep 19, 2002
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20020070461
- Publication date Jun 13, 2002
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20020066181
- Publication date Jun 6, 2002
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20020068380
- Publication date Jun 6, 2002
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20020064901
- Publication date May 30, 2002
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20010035575
- Publication date Nov 1, 2001
- CHUICHI MIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20010008304
- Publication date Jul 19, 2001
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20010007781
- Publication date Jul 12, 2001
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20010005055
- Publication date Jun 28, 2001
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20010004127
- Publication date Jun 21, 2001
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20010002724
- Publication date Jun 7, 2001
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20010003048
- Publication date Jun 7, 2001
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20010003059
- Publication date Jun 7, 2001
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20010002730
- Publication date Jun 7, 2001
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20010002064
- Publication date May 31, 2001
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS

Ichiro Anjoh

Person

Patents Grantslast 30 patents

Semiconductor device

Module with stacked semiconductor devices

Method of manufacturing a semiconductor apparatus

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device, semiconductor wafer, semiconductor module, an...

Circuit tape having adhesive film semiconductor device and a method...

Semiconductor device and manufacturing method thereof

Wiring tape for semiconductor device including a buffer layer havin...

Semiconductor device, semiconductor wafer, semiconductor module, an...

Semiconductor devices and methods of making the devices

Semiconductor device and lead frame therefor

Circuit tape having adhesive film, semiconductor device, and a meth...

Socket for testing of semiconductor device, and semiconductor devic...

Semiconductor device comprising stress relaxation layers and method...

Method of manufacturing a semiconductor device a ball grid array pa...

Semiconductor device and manufacturing method thereof

Method of manufacturing a ball grid array type semiconductor package

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and lead frame therefor

Semiconductor device having a porous buffer layer for semiconductor...

Semiconductor device and method for manufacturing the same technica...

Method of manufacturing a ball grid array type semiconductor package

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Sealed stacked arrangement of semiconductor devices

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE INCLUDING SEMICONDUCT...

SEMICONDUCTOR APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing metthod thereof

Semiconductor device and manufacturing method thereof

Semiconductor device

Circuit tape having adhesive film semiconductor device and a method...

Semiconductor device, semiconductor wafer, semiconductor module, an...

Wiring tape for semiconductor device including a buffer layer havin...

Semiconductor device and manufacturing method thereof

Semiconductor devices and methods of making the devices

Circuit tape having adhesive film, semiconductor device, and a meth...

Semiconductor device and wiring tape for semiconductor device

Semiconductor device and method of manufacture thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof