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Laura Wills Mirkarimi

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  • Surol, CA, US
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PROTECTIVE SEMICONDUCTOR ELEMENTS FOR BONDED STRUCTURES
    • Publication number 20250233086
    • Publication date Jul 17, 2025
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
    • Publication number 20250210457
    • Publication date Jun 26, 2025
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Gaius Gillman Fountain
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE
    • Publication number 20250125196
    • Publication date Apr 17, 2025
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
    • Publication number 20250125248
    • Publication date Apr 17, 2025
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIRECT BONDING METHODS AND STRUCTURES FOR DIES
    • Publication number 20250096191
    • Publication date Mar 20, 2025
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Guilian Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW TEMPERATURE BONDED STRUCTURES
    • Publication number 20250096172
    • Publication date Mar 20, 2025
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STRUCTURES AND METHODS FOR BONDING DIES
    • Publication number 20250006689
    • Publication date Jan 2, 2025
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONDUCTIVE MATERIALS FOR DIRECT BONDING
    • Publication number 20250006679
    • Publication date Jan 2, 2025
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Jeremy Alfred Theil
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSED STACKED DIES
    • Publication number 20240404990
    • Publication date Dec 5, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIRECT GANG BONDING METHODS AND STRUCTURES
    • Publication number 20240387439
    • Publication date Nov 21, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TECHNIQUES FOR PROCESSING DEVICES
    • Publication number 20240371850
    • Publication date Nov 7, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIMENSION COMPENSATION CONTROL FOR DIRECTLY BONDED STRUCTURES
    • Publication number 20240312953
    • Publication date Sep 19, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Guilian Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STRUCTURES FOR BONDING ELEMENTS INCLUDING CONDUCTIVE INTERFACE FEAT...
    • Publication number 20240249985
    • Publication date Jul 25, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Rajesh Katkar
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING
    • Publication number 20240249998
    • Publication date Jul 25, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Guilian Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DEBONDING REPAIR DEVICES
    • Publication number 20240222319
    • Publication date Jul 4, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Guilian GAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MITIGATING SURFACE DAMAGE OF PROBE PADS IN PREPARATION FOR DIRECT B...
    • Publication number 20240213105
    • Publication date Jun 27, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Guilian Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROV...
    • Publication number 20240203948
    • Publication date Jun 20, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METAL PADS OVER TSV
    • Publication number 20240194625
    • Publication date Jun 13, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Guilian Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW TEMPERATURE BONDED STRUCTURES
    • Publication number 20240113059
    • Publication date Apr 4, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TSV AS PAD
    • Publication number 20240088101
    • Publication date Mar 14, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Guilian Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RAPID THERMAL PROCESSING FOR DIRECT BONDING
    • Publication number 20240079376
    • Publication date Mar 7, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Dominik Suwito
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FOR...
    • Publication number 20230343734
    • Publication date Oct 26, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka UZOH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
    • Publication number 20230317591
    • Publication date Oct 5, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSED STACKED DIES
    • Publication number 20230282610
    • Publication date Sep 7, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDED STRUCTURES
    • Publication number 20230268300
    • Publication date Aug 24, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW TEMPERATURE BONDED STRUCTURES
    • Publication number 20230268307
    • Publication date Aug 24, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TECHNIQUES FOR JOINING DISSIMILAR MATERIALS IN MICROELECTRONICS
    • Publication number 20230253383
    • Publication date Aug 10, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Gaius Gillman Fountain
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIRECTLY BONDED FRAME WAFERS
    • Publication number 20230207402
    • Publication date Jun 29, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Gaius Gillman Fountain
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDED STRUCTURES WITH INTERCONNECT ASSEMBLIES
    • Publication number 20230207474
    • Publication date Jun 29, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
    • Publication number 20230187264
    • Publication date Jun 15, 2023
    • ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS