Liang-Guo Wang

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing an apparatus for manipulating a droplet
- Patent number 12,201,984
- Issue date Jan 21, 2025
- MGI Tech Co., Ltd.
- Jian Gong
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Method of direct-bonded optoelectronic devices
- Patent number 12,199,082
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded LED arrays drivers
- Patent number 12,166,024
- Issue date Dec 10, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for integrated sensor cartridge
- Patent number 12,134,093
- Issue date Nov 5, 2024
- MGI Tech Co., Ltd.
- Liang Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-transducer chip ultrasound device
- Patent number 12,099,150
- Issue date Sep 24, 2024
- EXO IMAGING, INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low temperature bonded structures
- Patent number 12,046,571
- Issue date Jul 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,967,575
- Issue date Apr 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 11,948,847
- Issue date Apr 2, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multilayer electrical connection for digital microfluidics on subst...
- Patent number 11,865,543
- Issue date Jan 9, 2024
- MGI Tech Co., Ltd.
- Jian Gong
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Integrated optical waveguides, direct-bonded waveguide interface jo...
- Patent number 11,860,415
- Issue date Jan 2, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Shaowu Huang
- G02 - OPTICS
Information Patent Grant
Direct-bonded LED arrays including optical elements configured to t...
- Patent number 11,715,730
- Issue date Aug 1, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 11,670,615
- Issue date Jun 6, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Cavity packages
- Patent number 11,600,542
- Issue date Mar 7, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 11,515,279
- Issue date Nov 29, 2022
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal for microelectronic assembly
- Patent number 11,417,576
- Issue date Aug 16, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-chip modules formed using wafer-level processing of a reconst...
- Patent number 11,387,214
- Issue date Jul 12, 2022
- Invensas LLC
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 11,380,597
- Issue date Jul 5, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Direct-bonded LED structure contacts and substrate contacts
- Patent number 11,329,034
- Issue date May 10, 2022
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,296,044
- Issue date Apr 5, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal for microelectronic assembly
- Patent number 11,257,727
- Issue date Feb 22, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated optical waveguides, direct-bonded waveguide interface jo...
- Patent number 11,169,326
- Issue date Nov 9, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Shaowu Huang
- G02 - OPTICS
Information Patent Grant
Back biasing of FD-SOI circuit blocks
- Patent number 11,127,738
- Issue date Sep 21, 2021
- Xcelsis Corporation
- Javier A. Delacruz
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
System and method for providing 3D wafer assembly with known-good-dies
- Patent number 11,114,408
- Issue date Sep 7, 2021
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for reliable packages
- Patent number 11,056,390
- Issue date Jul 6, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of a light-emitting diode display
- Patent number 11,024,220
- Issue date Jun 1, 2021
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded optoelectronic interconnect for high-density integrat...
- Patent number 11,011,503
- Issue date May 18, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity packages
- Patent number 10,923,408
- Issue date Feb 16, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 10,879,210
- Issue date Dec 29, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded structures
- Patent number 10,879,207
- Issue date Dec 29, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
DIRECT-BONDED OPTOELECTRONIC DEVICES
- Publication number 20250038161
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20240162102
- Publication date May 16, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED OPTICAL WAVEGUIDES, DIRECT-BONDED WAVEGUIDE INTERFACE JO...
- Publication number 20240118492
- Publication date Apr 11, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Shaowu HUANG
- G02 - OPTICS
Information Patent Application
BONDED STRUCTURES
- Publication number 20240120245
- Publication date Apr 11, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTILAYER ELECTRICAL CONNECTION FOR DIGITAL MICROFLUIDICS ON SUBST...
- Publication number 20240066522
- Publication date Feb 29, 2024
- MGI TECH CO., LTD.
- Jian Gong
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
DIRECT-BONDED OPTOELECTRONIC DEVICES
- Publication number 20240063199
- Publication date Feb 22, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONST...
- Publication number 20240006377
- Publication date Jan 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20230420313
- Publication date Dec 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED STRUCTURES
- Publication number 20230361072
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIRECT-BONDED LED ARRAYS AND DRIVERS
- Publication number 20230317703
- Publication date Oct 5, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR FABRICATION OF ULTRASOUND TRANSDUCER DEVICES
- Publication number 20230303389
- Publication date Sep 28, 2023
- eXo Imaging, Inc.
- Liang WANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW TEMPERATURE BONDED STRUCTURES
- Publication number 20230268307
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY PACKAGES
- Publication number 20230260858
- Publication date Aug 17, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES
- Publication number 20230187398
- Publication date Jun 15, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TRANSDUCER CHIP ULTRASOUND DEVICE
- Publication number 20230125688
- Publication date Apr 27, 2023
- eXo Imaging, Inc.
- Liang WANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20220415734
- Publication date Dec 29, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONST...
- Publication number 20220375864
- Publication date Nov 24, 2022
- Invensas LLC
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20220367302
- Publication date Nov 17, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOND ENHANCEMENT STRUCTURE IN MICROELECTRONICS FOR TRAPPING CONTAMI...
- Publication number 20220246564
- Publication date Aug 4, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED OPTICAL WAVEGUIDES, DIRECT-BONDED WAVEGUIDE INTERFACE JO...
- Publication number 20220043209
- Publication date Feb 10, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Shaowu HUANG
- G02 - OPTICS
Information Patent Application
SYSTEM AND METHOD FOR INTEGRATION OF BIOLOGICAL CHIPS
- Publication number 20220040662
- Publication date Feb 10, 2022
- Liang Wang
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Back Biasing of FD-SOI Circuit Block
- Publication number 20220020741
- Publication date Jan 20, 2022
- Xcelsis Corporation
- Javier A. DELACRUZ
- G11 - INFORMATION STORAGE
Information Patent Application
SYSTEM AND METHOD FOR INTEGRATED SENSOR CARTRIDGE
- Publication number 20210402391
- Publication date Dec 30, 2021
- MGI TECH CO., LTD.
- Liang Wang
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
MULTILAYER ELECTRICAL CONNECTION FOR DIGITAL MICROFLUIDICS ON SUBST...
- Publication number 20210379594
- Publication date Dec 9, 2021
- MGI TECH CO., LTD.
- Jian Gong
- G01 - MEASURING TESTING
Information Patent Application
DIRECT-BONDED LED ARRAYS AND APPLICATIONS
- Publication number 20210288037
- Publication date Sep 16, 2021
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT-BONDED OPTOELECTRONIC INTERCONNECT FOR HIGH-DENSITY INTEGRAT...
- Publication number 20210265331
- Publication date Aug 26, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20210202428
- Publication date Jul 1, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAVITY PACKAGES
- Publication number 20210134689
- Publication date May 6, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE BONDED STRUCTURES
- Publication number 20200381389
- Publication date Dec 3, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT-BONDED LED ARRAYS AND APPLICATIONS
- Publication number 20200235085
- Publication date Jul 23, 2020
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS

Liang-Guo Wang

Person

Patents Grantslast 30 patents

Method for manufacturing an apparatus for manipulating a droplet

Method of direct-bonded optoelectronic devices

Direct-bonded LED arrays drivers

System and method for integrated sensor cartridge

Bonded structures

Multi-transducer chip ultrasound device

Low temperature bonded structures

Bond enhancement structure in microelectronics for trapping contami...

Bonded structures

Multilayer electrical connection for digital microfluidics on subst...

Integrated optical waveguides, direct-bonded waveguide interface jo...

Direct-bonded LED arrays including optical elements configured to t...

Bonded structures

Cavity packages

Low temperature bonded structures

Seal for microelectronic assembly

Multi-chip modules formed using wafer-level processing of a reconst...

Bonded structures

Direct-bonded LED structure contacts and substrate contacts

Bond enhancement structure in microelectronics for trapping contami...

Seal for microelectronic assembly

Integrated optical waveguides, direct-bonded waveguide interface jo...

Back biasing of FD-SOI circuit blocks

System and method for providing 3D wafer assembly with known-good-dies

Structures and methods for reliable packages

Formation of a light-emitting diode display

Direct-bonded optoelectronic interconnect for high-density integrat...

Cavity packages

Bonded structures

Bonded structures

Patents Applicationslast 30 patents

DIRECT-BONDED OPTOELECTRONIC DEVICES

BONDED STRUCTURES

INTEGRATED OPTICAL WAVEGUIDES, DIRECT-BONDED WAVEGUIDE INTERFACE JO...

BONDED STRUCTURES

MULTILAYER ELECTRICAL CONNECTION FOR DIGITAL MICROFLUIDICS ON SUBST...

DIRECT-BONDED OPTOELECTRONIC DEVICES

MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONST...

SEAL FOR MICROELECTRONIC ASSEMBLY

BONDED STRUCTURES

DIRECT-BONDED LED ARRAYS AND DRIVERS

METHODS AND SYSTEMS FOR FABRICATION OF ULTRASOUND TRANSDUCER DEVICES

LOW TEMPERATURE BONDED STRUCTURES

CAVITY PACKAGES

BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES

MULTI-TRANSDUCER CHIP ULTRASOUND DEVICE

SEAL FOR MICROELECTRONIC ASSEMBLY

MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONST...

BONDED STRUCTURES

BOND ENHANCEMENT STRUCTURE IN MICROELECTRONICS FOR TRAPPING CONTAMI...

INTEGRATED OPTICAL WAVEGUIDES, DIRECT-BONDED WAVEGUIDE INTERFACE JO...

SYSTEM AND METHOD FOR INTEGRATION OF BIOLOGICAL CHIPS

Back Biasing of FD-SOI Circuit Block

SYSTEM AND METHOD FOR INTEGRATED SENSOR CARTRIDGE

MULTILAYER ELECTRICAL CONNECTION FOR DIGITAL MICROFLUIDICS ON SUBST...

DIRECT-BONDED LED ARRAYS AND APPLICATIONS

DIRECT-BONDED OPTOELECTRONIC INTERCONNECT FOR HIGH-DENSITY INTEGRAT...

BONDED STRUCTURES

CAVITY PACKAGES

LOW TEMPERATURE BONDED STRUCTURES

DIRECT-BONDED LED ARRAYS AND APPLICATIONS