Claims
- 1. A device for wiring a wire shaped conductor to a substrate, the device comprising:a wire guide having a longitudinal axis for guiding the wire shaped conductor in parallel to a wiring plane of said substrate, said wire guide including a nozzle at a longitudinal end of said wire guide, said wire guide being movable to move said wire against said substrate by means of said nozzle for connection of said wire to said substrate, said wire guide defining a wire passage for receiving and radially surrounding the conductor; an ultrasonic generator connected to said wire guide to ultrasonically vibrate said wire guide in said longitudinal axis of said wire guide and in a direction transverse to said wiring plane to insert the wire shaped conductor in the wiring plane of the substrate.
- 2. The device according to claim 1, wherein the wire guide comprises a wire-guidance capillary in communication with said nozzle, said wire-guidance capillary extends in said wire guide substantially parallel to said longitudinal axis.
- 3. The device according to claim 1, further comprising:a wire supply channel spaced from said nozzle, said wire supply channel extending obliquely in relation to said longitudinal axis of said wire guide.
- 4. The device according to claim 1, wherein the ultrasonic generator includes an ultrasonic oscillator arranged to have a variable axis of oscillation.
- 5. The device according to claim 1, wherein the ultrasonic generator is arranged coaxially with respect to the wire guide.
- 6. The device according to claim 1, wherein:said wire guide is a wire-guidance capillary for aligning the wire shaped conductor in the wiring plane of the substrate.
- 7. The device according to claim 1, further comprising:a portal connected to said wire guide and movable of said wire guide in said wiring plane while said wire guide is connecting the wire shaped conductor to the substrate.
- 8. A device for embedding a wire into a wiring plane of a substrate, the device comprising:a wire guide having a longitudinal axis, said wire guide guiding the wire in parallel to the wiring plane of the substrate, said wire guide including a nozzle at a longitudinal end of said wire guide, said wire guide being movable to move the wire against the substrate by said nozzle for connection of the wire to the substrate; an ultrasonic generator connected to said wire guide to ultrasonically vibrate said wire guide in said longitudinal axis of said wire guide and in a direction transverse to said wiring plane, said ultrasonic generator vibrates said wire guide to embed the wire into the substrate as the wire guide moves along the substrate; a portal connected to said wire guide and movable of said wire guide in said wiring plane while said wire guide is connecting the wire to the substrate.
Priority Claims (3)
Number |
Date |
Country |
Kind |
196 04 840 |
Feb 1996 |
DE |
|
196 20 242 |
May 1996 |
DE |
|
196 19 771 |
May 1996 |
DE |
|
RELATED APPLICATION
This is a Continuation of application Ser. No. 09/368,149 filed Aug. 4, 1999, now abandoned, which is a divisional of 09/117,970 filed on Aug. 7, 1998, now U.S. Pat. No. 6,233,818 which is a 371 of PCT/OE97/00261 filed Feb. 12, 1997 and the entire disclosure of this prior application is considered to be part of the disclosure of the accompanying application and is hereby incorporated by reference therein.
US Referenced Citations (6)
Foreign Referenced Citations (4)
Number |
Date |
Country |
4410732 |
Oct 1995 |
DE |
0671705 |
Sep 1995 |
EP |
2180408 |
Mar 1987 |
GB |
WO 9526538 |
Oct 1995 |
WO |
Continuations (1)
|
Number |
Date |
Country |
Parent |
09/368149 |
Aug 1999 |
US |
Child |
09/918126 |
|
US |