MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Abstract

The adhesive property of the mold resin exposed to the ball face side of a semiconductor package and under-filling resin is improved, and the manufacturing method of the semiconductor device which can prevent peeling at both interface is obtained.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a flow chart which shows the manufacturing method of the semiconductor device concerning Embodiment 1 of the present invention.

FIG. 2 is a cross-sectional view showing the manufacturing process of a semiconductor package.

FIG. 3 is a side view showing the manufacturing process of a semiconductor package.

FIGS. 4 to 6 are enlarged sectional views showing near the interface of mold resin and a metallic mold.

FIGS. 7 to 16 are side views showing the manufacturing process of the semiconductor device concerning Embodiment 1 of the present invention.

FIG. 17 is a flow chart which shows the manufacturing method of the semiconductor device concerning Embodiment 2 of the present invention.

FIGS. 18 to 22 are side views showing the manufacturing process of the semiconductor device concerning Embodiment 2 of the present invention.

Claims

1. A manufacturing method of a semiconductor device, comprising the steps of: sputtering a ball face side of a semiconductor package whose mold resin in which silicone oil was included exposed to the ball face side by Ar plasma;doing flip chip junction of the semiconductor package at wiring substrate upper part after the sputtering step; andfilling up with under-filling resin between the semiconductor package and the wiring substrate.

2. A manufacturing method of a semiconductor device, comprising the steps of: sputtering a ball face side of a semiconductor package whose mold resin in which wax or fatty acid was included exposed to the ball face side by Ar plasma;doing flip chip junction of the semiconductor package at wiring substrate upper part after the sputtering step; andfilling up with under-filling resin between the semiconductor package and the wiring substrate.

3. A manufacturing method of a semiconductor device according to claim 1, wherein as the semiconductor package, that by which the mold resin was formed with a metallic mold is used.

4. A manufacturing method of a semiconductor device according to claim 1, wherein in the sputtering step, an amount of shaving of the mold resin is less than or equal to an average of a diameter of a filler included in the mold resin.

5. A manufacturing method of a semiconductor device according to claim 1, further comprising a step of: attaching a solder ball to an under surface of the wiring substrate, and performing reflow after being filled up with the under-filling resin.

6. A manufacturing method of a semiconductor device according to claim 1, further comprising a step of: performing O2 plasma treatment after doing flip chip junction of a bare chip over the wiring substrate.

7. A manufacturing method of a semiconductor device according to claim 6, wherein flip chip junction of the bare chip is done by a fluxless over the wiring substrate, applying supersonic vibration to the bare chip.

8. A manufacturing method of a semiconductor device according to claim 6, wherein after using flux and doing flip chip junction of the semiconductor package and the bare chip over the wiring substrate, reflow is simultaneously performed about the semiconductor package and the bare chip.