This is a divisional of application Ser. No. 08/208,691 filed on Mar. 11, 1994, now U.S. Pat. No. 5,541,449.
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3337838 | Damiano et al. | Aug 1967 | |
3366915 | Miller | Jan 1968 | |
3444506 | Wedekind | May 1969 | |
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4274700 | Keglewitsch | Jun 1981 | |
4487463 | Tillotson | Dec 1984 | |
4572604 | Ammon et al. | Feb 1986 | |
4616406 | Brown | Oct 1986 | |
4654472 | Goldfarb | Mar 1987 | |
4655526 | Shaffer | Apr 1987 | |
4698663 | Sugimoto et al. | Oct 1987 | |
4734042 | Martens et al. | Mar 1988 | |
4897055 | Jurista et al. | Jan 1990 | |
4943846 | Shirling | Jul 1990 | |
4959750 | Cnyrim et al. | Sep 1990 | |
4975066 | Sucheski et al. | Dec 1990 | |
4997376 | Buck et al. | Mar 1991 | |
5015207 | Koepke | May 1991 | |
5037311 | Frankeny et al. | Aug 1991 | |
5071363 | Reylek et al. | Dec 1991 | |
5081563 | Feng et al. | Jan 1992 | |
5106461 | Volfson et al. | Apr 1992 | |
5110760 | Hsu | May 1992 | |
5117069 | Higgins, III | May 1992 | |
5123164 | Shaheen et al. | Jun 1992 | |
5137456 | Desai et al. | Aug 1992 | |
5200357 | Collot et al. | Apr 1993 | |
5281151 | Arima et al. | Jan 1994 | |
5309024 | Hirano | May 1994 | |
5326936 | Taniuchi et al. | Jul 1994 | |
5330372 | Pope et al. | Jul 1994 | |
5334279 | Gregoire | Aug 1994 | |
5342999 | Frei et al. | Aug 1994 | |
5351393 | Gregoire | Oct 1994 | |
5371404 | Juskey et al. | Dec 1994 | |
5376825 | Tukamoto et al. | Dec 1994 | |
5390412 | Gregoire | Feb 1995 | |
5536362 | Love et al. | Jul 1996 |
Number | Date | Country |
---|---|---|
0 321 212 | Jun 1989 | EPX |
0 405 454 A2 | Jan 1991 | EPX |
0 467 698 | Jan 1992 | EPX |
3737819A1 | May 1988 | DEX |
1129608 | Oct 1968 | GBX |
WO 9427345 | Nov 1991 | WOX |
WO 9413034 | Jun 1994 | WOX |
Entry |
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George D. Gregoire,"3-Dimensional Circuitry Solves Fine Pitch SMT Device Assembly Problem:" Connection Technology. |
Dimensional Circuits Corporation, "Dimensional Circuits Corp. Awarded Two U.S. Patents", D.C.C. News, Apr. 5, 1994. |
George D. Gregoire, "Very Fine Line Recessed Circuitry--A New PCB Fabrication Process". |
Robert Barnhouse, "Bifurcated Through-Hole Technology--An Innovative Solution to Circuit Density," Connection Technology, pp. 33-35 (Feb.1992). |
"AMP-ASC Interconnection Systems," AMP Product Information Bulletin, pp. 1-4 (1991). |
"Micro-Strip Interconnection System," AMP Product Guide pp. 3413-3414 (Jun. 1991). |
"Rib-Cage II Through-Mount Shrouded Headers" and Micropax Board-to-Board Interconnect System, Du Pont Connector Systems Product Catalog A, pp. 2-6, 3-0, 3-1 (Feb. 1992). |
R.R. Tummala et al., "Microelectronics Packaging Handbook," Van Nostrand Reinhold, 1989, pp. 38-43, 398-403, 779-791, 853-859, and 900-905. |
"Packing" Intel Corporation 1993, pp. 2-36, 2-96, 2-97, 2-100, 3-2,3-24, and 3-25. |
Number | Date | Country | |
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Parent | 208691 | Mar 1994 |