Claims
- 1. A manufacturing method for a plastic lead frame structure for use with at least one semiconductor device comprising injection molding one of a composite plastic material and an intermixed plastic and a conductive material, said conductive material including one of an intrinsic conductive polymer material or a polyaniline material.
- 2. A manufacturing method for a plastic lead frame structure for use with a semiconductor die comprising injection molding one of a composite plastic material and an intermixed plastic and a conductive material, said conductive material including one of an intrinsic conductive polymer material or a polyaniline material.
- 3. A manufacturing method for a plastic lead frame structure for use with a plurality of semiconductor dice comprising injection molding one of a composite plastic material and an intermixed plastic and a conductive material, said conductive material including one of an intrinsic conductive polymer material or a polyaniline material.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional of application Ser. No. 09/921,535, filed Aug. 3, 2001, pending, which is a continuation of application Ser. No. 09/639,359, filed Aug. 14, 2000, now U.S. Pat. No. 6,294,410 B1, issued Sep. 25, 2001, which is a continuation of application Ser. No. 09/195,765, filed Nov. 18, 1998, now U.S. Pat. No. 6,124,151, issued Sep. 26, 2000, which is a continuation of application Ser. No. 08/878,935, filed Jun. 19, 1997, now U.S. Pat. No. 5,879,965, issued Mar. 9, 1999.
Divisions (1)
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Number |
Date |
Country |
Parent |
09921535 |
Aug 2001 |
US |
Child |
10371673 |
Feb 2003 |
US |
Continuations (3)
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Number |
Date |
Country |
Parent |
09639359 |
Aug 2000 |
US |
Child |
09921535 |
Aug 2001 |
US |
Parent |
09195765 |
Nov 1998 |
US |
Child |
09639359 |
Aug 2000 |
US |
Parent |
08878935 |
Jun 1997 |
US |
Child |
09195765 |
Nov 1998 |
US |