Claims
- 1. A manufacturing method for forming a plastic lead frame structure for use with at least one semiconductor device comprising:forming a plastic lead frame structure from polymeric material; and coating said plastic lead frame structure with a conductive material.
- 2. The method of manufacturing in claim 1, further comprising:providing a sheet of said polymeric material; and forming said plastic lead frame structure by one of stamping said plastic lead frame structure or etching said plastic lead frame structure.
- 3. The method of manufacturing in claim 1, wherein said forming said plastic lead frame structure comprises forming said plastic lead frame structure by injection molding one of plastic material or polymer material.
- 4. The method of manufacturing in claim 1, wherein said forming said plastic lead frame structure comprises compression molding one of plastic material or polymer material.
- 5. The method of manufacturing in claim 1, wherein said coating comprises dipping said plastic lead frame structure into a solvent dispersion.
- 6. The method of manufacturing in claim 5, wherein said solvent dispersion further comprises an intrinsic conductive polymer material.
- 7. The method of manufacturing in claim 6, wherein said intrinsic conductive polymer material comprises a polyaniline material.
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a continuation of application Ser. No. 09/639,359, filed Aug. 14, 2000, now U.S. Pat. No. 6,294,410, which is a continuation of application Ser. No. 09/195,765, filed Nov. 18, 1998, now U.S. Pat. No. 6,124,151, issued Sep. 26, 2000, which is a continuation of application Ser. No. 08/878,935, filed Jun. 19, 1997, now U.S. Pat. No. 5,879,965, issued Mar. 9, 1999.
US Referenced Citations (21)
Non-Patent Literature Citations (1)
Entry |
US 5,455,394, 10/1995, Durand et al. (withdrawn) |
Continuations (3)
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Number |
Date |
Country |
Parent |
09/639359 |
Aug 2000 |
US |
Child |
09/921535 |
|
US |
Parent |
09/195765 |
Nov 1998 |
US |
Child |
09/639359 |
|
US |
Parent |
08/878935 |
Jun 1997 |
US |
Child |
09/195765 |
|
US |