Claims
- 1. A manufacturing method for forming a plastic lead frame structure for use with at least one semiconductor device comprising:providing a source of material for one of an injection molding thereof in an injection molding process, a stamping thereof in a stamping process, and an etching thereof in an etching process; forming a plastic lead frame structure from the material; and coating the plastic lead frame structure with a conductive material.
- 2. The manufacturing method of claim 1, further comprising:providing a sheet of polymeric material from the source of material; and forming the plastic lead frame structure by one of stamping the plastic lead frame structure and etching the plastic lead frame structure.
- 3. The manufacturing method of claim 1, wherein forming the plastic lead frame structure comprises forming the plastic lead frame structure by injection molding one of plastic material and polymer material.
- 4. The manufacturing method of claim 1, wherein forming the plastic lead frame structure comprises compression molding one of plastic material and polymer material.
- 5. The manufacturing method of claim 1, wherein coating comprises dipping the plastic lead frame structure into a solvent dispersion.
- 6. The manufacturing method of claim 5, wherein the solvent dispersion further comprises an intrinsic conductive polymer material.
- 7. The manufacturing method of claim 6, wherein the intrinsic conductive polymer material comprises a polyaniline material.
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a divisional of application Ser. No. 09/921,535, filed Aug. 3, 2001, now U.S. Pat. No. 6,544,820, issued Apr. 8, 2003, which is a continuation of application Ser. No. 09/639,359, filed Aug. 14, 2000, now U.S. Pat. No. 6,294,410, issued Sep. 25, 2001, which is a continuation of application Ser. No. 09/195,765, filed Nov. 18, 1998, now U.S. Pat. No. 6,124,151, issued Sep. 26, 2000, which is a continuation of application Ser. No. 08/878,935, filed Jun. 19, 1997, now U.S. Pat. No. 5,879,965, issued Mar. 9, 1999.
US Referenced Citations (31)
Non-Patent Literature Citations (4)
Entry |
US 5,455,394, 10/1995, Durand et al. (withdrawn) |
Rao R. Tummala et al., “Microelectronics Packaging Handbook”, pps. 544-548. |
Published Patent No. 2001/0054735 A1, Publication Date: Dec. 27, 2001; Name of Patentee: Nagai. |
Published Patent No. 2002/0132393 A1, Publication Date: Sep. 19, 2002, Name of Patentee:Kraxenberger et al. |
Continuations (4)
|
Number |
Date |
Country |
Parent |
09/921535 |
Aug 2001 |
US |
Child |
10/371301 |
|
US |
Parent |
09/639359 |
Aug 2000 |
US |
Child |
09/921535 |
|
US |
Parent |
09/195765 |
Nov 1998 |
US |
Child |
09/639359 |
|
US |
Parent |
08/878935 |
Jun 1997 |
US |
Child |
09/195765 |
|
US |