This is a continuation of application Ser. No. 07/091,807, filed 08/31/87 now U.S. Pat. No. 4,827,610.
Number | Name | Date | Kind |
---|---|---|---|
3449640 | Franklin | Jun 1969 | |
3483615 | Gottfried | Dec 1969 | |
3501342 | Haberecht et al. | Mar 1970 | |
3549784 | Hargis | Dec 1970 | |
4360968 | D'Amico et al. | Nov 1982 | |
4544577 | May | Oct 1985 | |
4765864 | Holland et al. | Aug 1988 | |
4794093 | Tong et al. | Dec 1988 | |
4807022 | Kazior et al. | Feb 1989 | |
4827610 | Williams et al. | May 1989 | |
4837536 | Honjo | Jun 1989 |
Number | Date | Country |
---|---|---|
62-128179 | Jun 1987 | JPX |
62-268147 | Nov 1987 | JPX |
2046514 | Nov 1980 | GBX |
2136203 | Sep 1984 | GBX |
2150749 | Jul 1985 | GBX |
Entry |
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Crimi et al, "Landless Hole Circuit Card", IBM TDB, vol. 9, No. 10, Mar./67, pp. 1310-1311. |
Balderes et al, "Glass-Metal Module to Chip Intersection", vol. 14, No. 11, Apr. 72, pp. 3224. |
Magdo, "Pyramid Shaped Electrical Feedthrough in Silicon Wafers", IBM TDB, vol. 19, No. 4, Sep./76, pp. 1232-1233. |
Number | Date | Country | |
---|---|---|---|
Parent | 91807 | Aug 1987 |