Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor

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Patents Grantslast 30 patents

Information Patent Grant
High frequency and high power thin-film component
- Patent number 11,967,609
- Issue date Apr 23, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods used in fabricating integrated circuitry and methods of for...
- Patent number 11,968,821
- Issue date Apr 23, 2024
- Micron Technology, Inc.
- Scott E. Sills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer structure, capacitor structure and electronic device
- Patent number 11,967,611
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hai-Dang Trinh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ex-situ manufacture of metal micro-wires and FIB placement in IC ci...
- Patent number 11,967,569
- Issue date Apr 23, 2024
- Texas Instruments Incorporated
- Michael Lee Dawson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric device based on hafnium zirconate and method of fabri...
- Patent number 11,968,841
- Issue date Apr 23, 2024
- Imec VZW
- Mihaela Ioana Popovici
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a magnetoresistive random access memory (MRAM)
- Patent number 11,968,909
- Issue date Apr 23, 2024
- Godo Kaisha IP Bridge 1
- Shinji Yuasa
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Integrated high voltage capacitor
- Patent number 11,967,610
- Issue date Apr 23, 2024
- Semtech Corporation
- Christopher David Ainsworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming material layer, semiconductor devices, and metho...
- Patent number 11,967,502
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Younsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC including capacitor having segmented bottom plate
- Patent number 11,961,879
- Issue date Apr 16, 2024
- Texas Instruments Incorporated
- Jeffrey West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal structure
- Patent number 11,961,880
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect layout for semiconductor device
- Patent number 11,961,878
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure and semiconductor structure
- Patent number 11,961,881
- Issue date Apr 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Lingxiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal silicide structures for advanced integrated circuit stru...
- Patent number 11,961,767
- Issue date Apr 16, 2024
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 11,961,798
- Issue date Apr 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing High-K MIM capacitor to improve electrical...
- Patent number 11,961,671
- Issue date Apr 16, 2024
- Elohim Incorporation
- Seunggu Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual hydrogen barrier layer for trench capacitors integrated with l...
- Patent number 11,961,877
- Issue date Apr 16, 2024
- Kepler Computing Inc.
- Somilkumar J. Rathi
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 11,961,882
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,963,364
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Seok Han Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super CMOS devices on a microelectronics system
- Patent number 11,955,476
- Issue date Apr 9, 2024
- SCHOTTKY LSI, INC.
- Augustine Wei-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal gate structure having portions of metal gate layers in c...
- Patent number 11,955,532
- Issue date Apr 9, 2024
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip capacitors in semiconductor devices and methods for forming...
- Patent number 11,955,422
- Issue date Apr 9, 2024
- Yangtze Memory Technologies Co., Ltd.
- Lei Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor
- Patent number 11,955,509
- Issue date Apr 9, 2024
- Samsung Electronics Co., Ltd.
- Jihyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
- Patent number 11,955,534
- Issue date Apr 9, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-element gain memory bit-cell having stacked and folded planar...
- Patent number 11,955,153
- Issue date Apr 9, 2024
- Kepler Computing Inc.
- Rajeev Kumar Dokania
- G11 - INFORMATION STORAGE
Information Patent Grant
Dual hydrogen barrier layer for trench capacitors integrated with l...
- Patent number 11,955,512
- Issue date Apr 9, 2024
- Kepler Computing Inc.
- Somilkumar J. Rathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallel-connected trench capacitor structure with multiple electro...
- Patent number 11,955,292
- Issue date Apr 9, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-integrated multi-turn coil embedded in a package magnetic core
- Patent number 11,955,426
- Issue date Apr 9, 2024
- Intel Corporation
- Huong Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged module and metal plate
- Patent number 11,955,891
- Issue date Apr 9, 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Zhiqiang Xiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,955,508
- Issue date Apr 9, 2024
- SOCIONEXT INC.
- Isaya Sobue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out package with integrated peripheral devices and methods
- Patent number 11,955,395
- Issue date Apr 9, 2024
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED INDUCTOR OVER TRANSISTOR LAYER
- Publication number 20240136279
- Publication date Apr 25, 2024
- Intel Corporation
- Min Suet LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES, COMPONENTS THEREOF, AND RELATED METHODS AND SYSTEMS
- Publication number 20240136392
- Publication date Apr 25, 2024
- ASM IP HOLDING B.V.
- Alessandra Leonhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING LOWER ELECTRODES INCLUDING INNER PR...
- Publication number 20240136286
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Cheoljin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
- Publication number 20240136346
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING CAPACITORS, AND RELATED ELECTRONI...
- Publication number 20240136391
- Publication date Apr 25, 2024
- Micron Technology, Inc.
- Sanket S. Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE CAPACITO...
- Publication number 20240136393
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Hyukwoo KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERHEATING PROTECTION DEVICE
- Publication number 20240136350
- Publication date Apr 25, 2024
- STMicroelectronics (Rousset) SAS
- Loic BOURGUINE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY
- Publication number 20240136308
- Publication date Apr 25, 2024
- Innolux Corporation
- Yeong-E Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240136352
- Publication date Apr 25, 2024
- RENESAS ELECTRONICS CORPORATION
- Natsumi IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD
- Publication number 20240136237
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Changui Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240136312
- Publication date Apr 25, 2024
- UNITED MICROELECTRONICS CORP.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A FERROELECTRIC DEVICE
- Publication number 20240128308
- Publication date Apr 18, 2024
- TOKYO ELECTRON LIMITED
- Dina Triyoso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CAPACITOR ELECTRODE
- Publication number 20240128312
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING CAPACITORS BASED ON DUMMY THROUGH-SILICON-VIAS
- Publication number 20240128023
- Publication date Apr 18, 2024
- Intel Corporation
- Changyok Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passive Device Dies With Measurement Structures
- Publication number 20240128261
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu-Chiang KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20240130107
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Sungyeon RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES...
- Publication number 20240128163
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR
- Publication number 20240130046
- Publication date Apr 18, 2024
- Nippon Telegraph and Telephone Corporation
- Teruo Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240128307
- Publication date Apr 18, 2024
- TOKYO ELECTRON LIMITED
- Rintaro HIGUCHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE HAVING SUPPORTER PATTERN
- Publication number 20240128310
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Seung Jin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices and Methods for Improving Voltage Handling and/or Bi-Direct...
- Publication number 20240128968
- Publication date Apr 18, 2024
- pSemi Corporation
- Tero Tapio Ranta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUND-CONNECTED SUPPORTS WITH INSULARING SPACERS FOR SEMICONDUCTOR...
- Publication number 20240130111
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Yoon Young CHOI
- G11 - INFORMATION STORAGE
Information Patent Application
BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
- Publication number 20240128186
- Publication date Apr 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A CAPACITOR
- Publication number 20240128311
- Publication date Apr 18, 2024
- STMicroelectronics (Tours) SAS
- Mohamed Boufnichel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated transformer
- Publication number 20240128306
- Publication date Apr 18, 2024
- REAL TEK SEMICONDUCTOR CORPORATION
- HSIAO-TSUNG YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL TRANSMISSION DEVICE
- Publication number 20240128309
- Publication date Apr 18, 2024
- DENSO CORPORATION
- Shuji ASANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Schottky-CMOS Static Random-Access Memory
- Publication number 20240120922
- Publication date Apr 11, 2024
- Schottky LSI, Inc.
- Augustine Wei-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20240122013
- Publication date Apr 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- Joongsoo Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC NANOPARTICLE CAPACITOR FOR NON-BINARY LOGICS
- Publication number 20240120366
- Publication date Apr 11, 2024
- Terra Quantum AG
- Anna Razumnaya
- B82 - NANO-TECHNOLOGY
Information Patent Application
REDUCED ESR IN TRENCH CAPACITOR
- Publication number 20240120368
- Publication date Apr 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jing Hu
- H01 - BASIC ELECTRIC ELEMENTS

Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor

Industry

Parent Industries

Current Industry

Sub Industries

Patents Grantslast 30 patents

High frequency and high power thin-film component

Methods used in fabricating integrated circuitry and methods of for...

Multilayer structure, capacitor structure and electronic device

Ex-situ manufacture of metal micro-wires and FIB placement in IC ci...

Ferroelectric device based on hafnium zirconate and method of fabri...

Method of manufacturing a magnetoresistive random access memory (MRAM)

Integrated high voltage capacitor

Methods of forming material layer, semiconductor devices, and metho...

IC including capacitor having segmented bottom plate

Metal-insulator-metal structure

Interconnect layout for semiconductor device

Method for forming semiconductor structure and semiconductor structure

Dual metal silicide structures for advanced integrated circuit stru...

Semiconductor structure and method for manufacturing semiconductor...

Method for manufacturing High-K MIM capacitor to improve electrical...

Dual hydrogen barrier layer for trench capacitors integrated with l...

Semiconductor device

Semiconductor device

Super CMOS devices on a microelectronics system

Dual metal gate structure having portions of metal gate layers in c...

On-chip capacitors in semiconductor devices and methods for forming...

Metal-insulator-metal capacitor

Heterogeneous metal line compositions for advanced integrated circu...

Multi-element gain memory bit-cell having stacked and folded planar...

Dual hydrogen barrier layer for trench capacitors integrated with l...

Parallel-connected trench capacitor structure with multiple electro...

Package-integrated multi-turn coil embedded in a package magnetic core

Packaged module and metal plate

Semiconductor device

Fan out package with integrated peripheral devices and methods

Patents Applicationslast 30 patents

INTEGRATED INDUCTOR OVER TRANSISTOR LAYER

MEMORY DEVICES, COMPONENTS THEREOF, AND RELATED METHODS AND SYSTEMS

SEMICONDUCTOR DEVICES INCLUDING LOWER ELECTRODES INCLUDING INNER PR...

SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION

MICROELECTRONIC DEVICES INCLUDING CAPACITORS, AND RELATED ELECTRONI...

CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE CAPACITO...

OVERHEATING PROTECTION DEVICE

ELECTRONIC ASSEMBLY

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD

SEMICONDUCTOR PACKAGE STRUCTURE

METHOD FOR FABRICATING A FERROELECTRIC DEVICE

MULTILAYER CAPACITOR ELECTRODE

DECOUPLING CAPACITORS BASED ON DUMMY THROUGH-SILICON-VIAS

Passive Device Dies With Measurement Structures

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES...

CAPACITOR

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SEMICONDUCTOR DEVICE HAVING SUPPORTER PATTERN

Devices and Methods for Improving Voltage Handling and/or Bi-Direct...

GROUND-CONNECTED SUPPORTS WITH INSULARING SPACERS FOR SEMICONDUCTOR...

BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT

METHOD OF FABRICATING A CAPACITOR

Integrated transformer

SIGNAL TRANSMISSION DEVICE

Schottky-CMOS Static Random-Access Memory

DISPLAY APPARATUS

FERROELECTRIC NANOPARTICLE CAPACITOR FOR NON-BINARY LOGICS

REDUCED ESR IN TRENCH CAPACITOR