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Testing or measuring during manufacture or treatment; Reliability measurements
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
Current Industry
H01L22/00
Testing or measuring during manufacture or treatment; Reliability measurements
Sub Industries
H01L22/10
Measuring as part of the manufacturing process
H01L22/12
for structural parameters
H01L22/14
for electrical parameters
H01L22/20
Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
H01L22/22
Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
H01L22/24
Optical enhancement of defects or not directly visible states
H01L22/26
Acting in response to an ongoing measurement without interruption of processing
H01L22/30
Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
H01L22/32
Additional lead-in metallisation on a device or substrate
H01L22/34
Circuits for electrically characterising or monitoring manufacturing processes
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Patents Grants
last 30 patents
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Patent Grant
Hot-pressing member with improved focus of pressing and longevity a...
Patent number
12,220,891
Issue date
Feb 11, 2025
TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
Fei-Fan Yu
B30 - PRESSES
Information
Patent Grant
Methods for registration of circuit dies and electrical interconnects
Patent number
12,224,184
Issue date
Feb 11, 2025
3M Innovative Properties Company
Ankit Mahajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor circuit structure with direct die heat removal structure
Patent number
12,224,225
Issue date
Feb 11, 2025
INVENTION AND COLLABORATION LABORATORY, INC.
Chao-Chun Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having side wall plating
Patent number
12,224,232
Issue date
Feb 11, 2025
SILICONIX INCORPORATED
Barry Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out package having a main die and a dummy die
Patent number
12,224,247
Issue date
Feb 11, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yan-Fu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip and semiconductor package including the same
Patent number
12,224,258
Issue date
Feb 11, 2025
Samsung Electronics Co., Ltd.
Wonkyun Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory devices having cell over periphery structure, memory package...
Patent number
12,224,277
Issue date
Feb 11, 2025
Samsung Electronics Co., Ltd.
Yonghyuk Choi
G11 - INFORMATION STORAGE
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Patent Grant
Component arrangement, package and package arrangement, as well as...
Patent number
12,224,388
Issue date
Feb 11, 2025
MSG LITHOGLAS GMBH
Oliver Gyenge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked semiconductor device assembly in computer system
Patent number
12,222,880
Issue date
Feb 11, 2025
RAMBUS INC.
Scott C. Best
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Method of separating electronic devices having a back layer and app...
Patent number
12,224,208
Issue date
Feb 11, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Gordon M. Grivna
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating a semiconductor device
Patent number
12,224,214
Issue date
Feb 11, 2025
Samsung Electronics Co., Ltd.
Seongkeun Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device and bonding detection method of display device
Patent number
12,224,215
Issue date
Feb 11, 2025
Chengdu BOE Optoelectronics Technology Co., Ltd.
Chienpang Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having a thermally and electrically conductiv...
Patent number
12,224,222
Issue date
Feb 11, 2025
Infineon Technologies AG
Christian Neugirg
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
Patent number
12,224,230
Issue date
Feb 11, 2025
Amkor Technology Singapore Holding Pte Ltd.
Yasuaki Yamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module
Patent number
12,224,231
Issue date
Feb 11, 2025
Rohm Co., Ltd.
Kenji Hayashi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor wafer and semiconductor dies formed therefrom includi...
Patent number
12,224,248
Issue date
Feb 11, 2025
SanDisk Technologies, Inc.
Chin-Tien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetic core inductors in interposer
Patent number
12,224,252
Issue date
Feb 11, 2025
Intel Corporation
Krishna Bharath
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Millimeter-wave antenna chip and terminal device
Patent number
12,224,254
Issue date
Feb 11, 2025
Huawei Technologies Co., Ltd.
Weixi Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package including lead frame having multiple conductive...
Patent number
12,224,255
Issue date
Feb 11, 2025
Siliconware Precision Industries Co., Ltd.
Chih-Hsien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer structure and semiconductor device
Patent number
12,224,256
Issue date
Feb 11, 2025
Samsung Electronics Co., Ltd.
Hyunsu Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
12,224,257
Issue date
Feb 11, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip interconnecting method, interconnect device and method for for...
Patent number
12,224,267
Issue date
Feb 11, 2025
Yibu Semiconductor Co., Ltd.
Weiping Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out packages providing enhanced mechanical strength and methods...
Patent number
12,224,268
Issue date
Feb 11, 2025
Taiwan Semiconductor Manufacturing Company Limited
Jen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image display device manufacturing method and image display device
Patent number
12,224,273
Issue date
Feb 11, 2025
Nichia Corporation
Hajime Akimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro light-emitting diode display panel and manufacturing method t...
Patent number
12,224,274
Issue date
Feb 11, 2025
BOE Technology Group Co., Ltd.
Yuju Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for measurement of misregistration and ameliora...
Patent number
12,222,199
Issue date
Feb 11, 2025
KLA Corporation
Roie Volkovich
G01 - MEASURING TESTING
Information
Patent Grant
United states 3D memory semiconductor devices and structures with m...
Patent number
12,225,727
Issue date
Feb 11, 2025
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing 3D semiconductor devices and structures with t...
Patent number
12,225,737
Issue date
Feb 11, 2025
Monolithic 3D Inc.
Deepak C. Sekar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for low inductance phase switch for inverter fo...
Patent number
12,225,696
Issue date
Feb 11, 2025
BorgWarner US Technologies LLC
Mark Wendell Gose
B60 - VEHICLES IN GENERAL
Information
Patent Grant
Semiconductor manufacturing apparatus and method for manufacturing...
Patent number
12,224,199
Issue date
Feb 11, 2025
Mitsubishi Electric Corporation
Takafumi Yamamoto
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
EPITAXIAL WAFER MANUFACTURING METHOD AND EPITAXIAL WAFER MANUFACTUR...
Publication number
20250051959
Publication date
Feb 13, 2025
SUMCO CORPORATION
Masayuki TSUJI
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
CERAMIC COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME
Publication number
20250054848
Publication date
Feb 13, 2025
Kabushiki Kaisha Toshiba
Yasuhiro HONDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
Publication number
20250054853
Publication date
Feb 13, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Sang Hyun Jin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAVILY DOPED SEMICONDUCTOR DEVICES FOR POWER DISTRIBUTION
Publication number
20250054854
Publication date
Feb 13, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh KATKAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
Publication number
20250054885
Publication date
Feb 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsing-Hsiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR WAFER SCALE CHIP PACKAGE
Publication number
20250054886
Publication date
Feb 13, 2025
TEXAS INSTRUMENTS INCORPORATED
Indumini W. Ranmuthu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT AND PREPARATION METHOD THEREOF, THREE-DIMENSIONA...
Publication number
20250054888
Publication date
Feb 13, 2025
Huawei Technologies Co., Ltd
Ran He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
Publication number
20250054892
Publication date
Feb 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chao-Wei Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method Using Lead Frame Interposer in Bump...
Publication number
20250054902
Publication date
Feb 13, 2025
STATS ChipPAC Pte Ltd.
Peik Eng Ooi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRO BONDING DEVICE, BONDING BACKPLANE AND DISPLAY DEVICE
Publication number
20250054903
Publication date
Feb 13, 2025
Xiamen Extremely PQ Display Technology Co., Ltd.
Gang MA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250054906
Publication date
Feb 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR THREE-DIMENSIONAL MEMORY STACKING
Publication number
20250054911
Publication date
Feb 13, 2025
Meta Platforms Technologies, LLC
Huichu Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250054913
Publication date
Feb 13, 2025
Samsung Electronics Co., Ltd.
HYUNSOO CHUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated transceiver array
Publication number
20250054930
Publication date
Feb 13, 2025
Apple Inc.
Shingo Mandai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF SELECTIVE RELEASE OF COMPONENTS USING THERMAL RELEASE LAYER
Publication number
20250054785
Publication date
Feb 13, 2025
Deca Technologies USA, Inc.
Benedict SAN JOSE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING SYSTEM AND METHOD
Publication number
20250054798
Publication date
Feb 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chien-Ling Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SUBSTRATE WITH PROTECTIVE MEMBER
Publication number
20250054815
Publication date
Feb 13, 2025
Disco Corporation
Mitsuru IKUSHIMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STIFFENER ASSEMBLY AND METHOD FOR MAKING A SEMICONDUCTOR ASSEMBLY
Publication number
20250054819
Publication date
Feb 13, 2025
Intel Corporation
Seok Ling LIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITE CARRIER, METHOD OF MAKING AND METHOD OF USING THE COMPOSI...
Publication number
20250054821
Publication date
Feb 13, 2025
Yibu Semiconductor Co., Ltd.
Ming Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20250054828
Publication date
Feb 13, 2025
Siliconware Precision Industries Co., Ltd.
Wei-Shen HUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE, METHOD FOR MANUFA...
Publication number
20250054830
Publication date
Feb 13, 2025
Mitsubishi Electric Corporation
Riki KAJIYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING TOPSIDE COOLED SEMICONDUCTOR PACKAGES BY FIL...
Publication number
20250054831
Publication date
Feb 13, 2025
INFINEON TECHNOLOGIES AG
Chee Yang Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTROLLING AN IRON AND MAGNETIC SLURRY IN SEMICONDUCTOR ASSEMBLY
Publication number
20250054833
Publication date
Feb 13, 2025
Lenovo (United States) Inc.
Mark K. Summerville
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD FRAME ADAPTED TO BE APPLIED TO A QUAD FLAT NO-LEAD PACKAGE STR...
Publication number
20250054844
Publication date
Feb 13, 2025
Realtek Semiconductor Corp.
Yu-Hsin Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
LEAD FRAME, SEMICONDUCTOR DEVICE, AND LEAD FRAME MANUFACTURING METHOD
Publication number
20250054845
Publication date
Feb 13, 2025
Shinko Electric Industries Co., Ltd.
Kentaro Kaneko
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
HIGH-FREQUENCY DRAIN-EXTENDED METAL-OXIDE-SEMICONDUCTOR (DEMOS) DEV...
Publication number
20250056829
Publication date
Feb 13, 2025
Zhejiang University
Kai XU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
DRIVER BACKPLANE, DISPLAY PANEL, SPLICING SCREEN AND ELECTRONIC APP...
Publication number
20250056951
Publication date
Feb 13, 2025
Chengdu Vistar Optoelectronics Co., Ltd.
Chen SU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEFORMATION CONTROL OF MANUFACTURING DEVICES USING FRONT-SIDE IRRAD...
Publication number
20250054757
Publication date
Feb 13, 2025
Applied Materials, Inc.
Pradeep Kumar Subrahmanyan
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Publication number
20250054774
Publication date
Feb 13, 2025
Samsung Electronics Co., Ltd.
Hyeyeong Jo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS
Publication number
20250054775
Publication date
Feb 13, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Ching-Yi Lin
H01 - BASIC ELECTRIC ELEMENTS