3553533

Information

• Patent Grant
• 3553533

• References
• Source

• Patent Number

  3,553,533

• Date Filed

  Not available

• Date Issued

  Tuesday, January 5, 1971
  54 years ago

• CPC

  • H01L23/15 - Ceramic or glass substrates
  • H01B1/00 - Conductors or conductive bodies characterised by the conductive materials Selection of materials as conductors
  • H01B3/004 - with conductive additives or conductive layers
  • H01C17/06 - adapted for coating resistive material on a base
  • H01F1/00 - Magnets or magnetic bodies characterised by the magnetic materials therefor Selection of materials for their magnetic properties
  • H01F1/0311 - Compounds
  • H01F1/0313 - Oxidic compounds
  • H01F1/346 - [(TO4) 3] with T= Si, Al, Fe, Ga
  • H01F41/34 - in patterns
  • H01G4/12 - Ceramic dielectrics
  • H01G4/1209 - characterised by the ceramic dielectric material
  • H01G13/06 - with provision of removing metal surfaces
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L23/10 - characterised by the material or arrangement of seals between parts,ween cap
  • H01L23/291 - Oxides or nitrides or carbides
  • H01L23/522 - including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
  • H01L23/5227 - Inductive arrangements or effects of, or between, wiring layers
  • H01L24/81 - using a bump connector
  • H01L27/00 - Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate
  • H01L49/02 - Thin-film or thick-film devices
  • H05K3/105 - by conversion of non-conductive material on or in the support into conductive material
  • H01L2224/81801 - Soldering or alloying
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01012 - Magnesium [Mg]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/0102 - Calcium [Ca]
  • H01L2924/01021 - Scandium [Sc]
  • H01L2924/01023 - Vanadium [V]
  • H01L2924/01024 - Chromium [Cr]
  • H01L2924/01029 - Copper [Cu]
  • H01L2924/0103 - Zinc [Zn]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01047 - Silver [Ag]
  • H01L2924/01049 - Indium [In]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01075 - Rhenium [Re]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/01322 - Eutectic Alloys
  • H01L2924/014 - Solder alloys
  • H01L2924/09701 - Low temperature co-fired ceramic [LTCC]
  • H01L2924/10253 - Silicon [Si]
  • H01L2924/12042 - LASER
  • H01L2924/14 - Integrated circuits
  • H05K2203/092 - Particle beam
  • H05K2203/107 - Using laser light
  • H05K2203/1105 - Heating or thermal processing not related to soldering, firing, curing or laminating
  • H05K2203/125 - Inorganic compounds

• US Classifications

  • 361 - Electricity: electrical systems and devices
  • 174 - Electricity: conductors and insulators
  • 257 - Active solid-state devices
  • 336 - Inductor devices