3735911

Information

• Patent Grant
• 3735911

• References
• Source

• Patent Number

  3,735,911

• Date Filed

  Not available

• Date Issued

  Tuesday, May 29, 1973
  51 years ago

• CPC

  • H01L24/81 - using a bump connector
  • H01L24/75 - Apparatus for connecting with bump connectors or layer connectors
  • H01L24/799 - Apparatus for disconnecting
  • H01L24/98 - Methods for disconnecting semiconductor or solid-state bodies
  • H05K13/0486 - Replacement and removal of components
  • H01L2224/75 - Apparatus for connecting with bump connectors or layer connectors
  • H01L2224/7565 - Means for transporting the components to be connected
  • H01L2224/75745 - in the upper part of the bonding apparatus
  • H01L2224/81052 - Detaching bump connectors
  • H01L2224/81801 - Soldering or alloying
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01023 - Vanadium [V]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01047 - Silver [Ag]
  • H01L2924/01075 - Rhenium [Re]
  • H01L2924/01078 - Platinum [Pt]
  • H01L2924/014 - Solder alloys
  • H01L2924/12033 - Gunn diode
  • H01L2924/12042 - LASER
  • H01L2924/14 - Integrated circuits
  • H01L2924/19041 - being a capacitor
  • H01L2924/19043 - being a resistor
  • Y10S228/902 - using flame
  • Y10T29/49002 - Electrical device making
  • Y10T29/49131 - by utilizing optical sighting device
  • Y10T29/4973 - Replacing of defective part
  • Y10T29/49821 - by altering or destroying work part or connector

• US Classifications

  • 228 - Metal fusion bonding
  • 029 - Metal working
  • 257 - Active solid-state devices
  • 438 - Semiconductor device manufacturing: process