FIELD OF THE INVENTION
The present invention relates to the field of integrated circuit packaging and interconnection.
BACKGROUND
Electronic packaging and specifically integrated circuit packaging and the interconnection between such devices have become a significant performance limiting elements of electronic circuits. Presently, semiconductors operate at internal clock speeds that surpass the current electronic interconnection infrastructure's ability to carry signals between semiconductors.
Copper (and other conductive metal) interconnect elements, including but not limited to semiconductor substrates (packages), connectors, and printed circuit boards have not followed the historical curve of semiconductor speed improvement; although arguably it has not been until recently that the copper interconnect represented a significant performance barrier in chip-to-chip systems. A well designed interconnection channel would allow two or more IC chips in close proximity to one another to communicate at their native speeds, as if they were a single chip.
Copper is in fact capable of transmitting signals at near the speed of light in a vacuum or air. However, in practice electrical circuits cannot be practically established in vacuums, and are typically composed of several components that must connect at points of potential discontinuity. The electrical circuits must be held in place physically by structures made of an insulating material, which normally impedes the signal propagation.
Copper interconnect systems typically incorporate several sources of signal discontinuity and disturbance, which degrade signal integrity and reduce speed. These include variances in metal conductor path height, width, length, and materials, proximity to other circuit paths, through-hole vias, connector and solder joints, and capacitive stubs
One fundamental design objective for high speed circuits is to incorporate the shortest signal path between two objects be chosen, which geometry teaches is a straight line. Typically the signal path from chip-to-chip in an electronic system travels from the semiconductor, through the package, into the circuit board, through another package and to the second semiconductor. This approach of involves a relatively tortuous circuit route that does not closely track the straight line design objective. However, by routing some or all signals through structures that create signal paths that do not traverse the package or the printed circuit board, a more straight line path can be accomplished. A path that avoids the printed circuit board and the package may also avoid common elements of those structures, such as vias and stubs, as well as other signal disruptors.
New interconnect elements may facilitate the creation of a more direct path for some or all signals. Structures that establish an electrical path directly from one chip to another chip may create performance advantages.
It is believed that such innovations and future products based on them will meet or exceed all cost and performance design requirements with minimal disruption to the manufacturing infrastructure. At the same time, it will remove most current roadblocks to high speed signal transmission from chip to chip.
BRIEF DESCRIPTION OF THE DRAWINGS
The present invention is illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which like reference numerals refer to similar elements and in which:
FIG. 1 provides an example of related prior art showing terminations at the on the surface of an IC package disposed for interconnection at the edge.
FIG. 2 is provide an illustration of an embodiment wherein a separate circuit is bonded to an IC package to provide alternative interconnection path ways for signals exiting an IC and further illustrating in cross section two prospective embodiments for making such interconnections from the chip either from the top or from the bottom of the package.
FIG. 3 provides an exploded perspective view of another embodiment illustrating major constituent elements of the construction.
FIG. 4 provides perspective views of the elements shown in FIG. 3 in a partially assembled form and an enlargement of a section to show greater detail.
FIG. 5 illustrates in a perspective view an embodiment of the invention wherein more than 1 chip is interconnected within the package.
FIG. 6 illustrates in a perspective view an embodiment of the invention wherein the assembly is encapsulated and having contacts disposed for connection both at the edge of the package and extending beyond the edge of the package on a length of circuit greater than the other lengths.
FIG. 7A and B provide perspective views of partially assembled embodiments having circuits on the upper surface which egress at differing angles and directions.
FIG. 8 illustrates an embodiment in cross section showing prospective elements of construction and having wire bonds made directly to a stripline circuit construction which exits the package on the edge.
FIG. 9 illustrates an embodiment wherein more than one cable is mounted and interconnected to a surface opposite of the IC in a package.
FIG. 10 illustrates an embodiment wherein the separate circuit is extended, folded back and bonded to the encapsulation which protects the IC chip.
FIG. 11 illustrates an embodiment wherein the separate circuit is extended, folded back and bonded to the encapsulation which protects the IC chip and having also a second IC chip interconnect to the circuit and the circuit then extending to make interconnection to another electronic device or element.
FIG. 12 provides an example of embodiment wherein multiple devices of varying embodiments are in process of assembly to a substrate and have interconnections to another element such as a cable or data bus.
FIG. 13 provides a perspective view of an assembly comprised of various component embodiments, circuit elements and interconnection support pedestals which serve as separable or permanent connectors.
FIG. 14 provides a perspective view of an embodiment disposed to having a connector on IC package before being provided with a locking lever and an enlarged area providing detail of the contacts.
FIG. 15 provides the perspective view of an embodiment having a connector on IC package with a locking lever and a circuit assembly disposed for mating with the IC package connector.
FIG. 16 is an illustration of a cross sectioned view through the middle of the IC package and the circuit assembly.
FIG. 17A-C is a close up series of images illustrating the operation of the connector mechanism.
FIG. 18 illustrates gold bumps viewed through the flexible circuit assembly.
FIG. 19 is an illustration of the back of the locking lever in a perspective view.
FIG. 20 provides a perspective view of a partially assembled pedestal connector with one side engaged to a circuit and the second side disposed for interconnection.
FIG. 21 provides a perspective view of a partially assembled pedestal connector of FIG. 20 from the opposite side, showing circuits and having an enlarged area to provide greater detail of the contact area.
DETAILED DESCRIPTION
In the following description and in the accompanying drawings, specific terminology and drawing symbols are set forth to provide a thorough understanding of the present invention. In some instances, the terminology and symbols may imply specific details that are not required to practice the invention. For example, the interconnection between circuit elements or circuit blocks may be shown or described as multi-conductor or single conductor signal lines. Each of the multi-conductor signal lines may alternatively be single-conductor signal lines, and each of the single-conductor signal lines may alternatively be multi-conductor signal lines. Signals and signaling paths shown or described as being single-ended may also be differential, and vice-versa. The interconnecting structures may be microstrip or stripline and the signal lines may be either shielded or unshielded.
The present invention expands on concepts disclosed in pending U.S. patent application Ser. No. 10/426,930 entitled “Direct Connect Signaling System, filed Apr. 29, 2003, which is incorporated herein by reference and which describes various embodiments of high-speed signaling systems implemented by connecting electric signal conductors directly between integrated circuit packages so that high-speed signals are transmitted without passing through traces or other conductive structures on or within a printed circuit board. Among others, the application describes embodiments that facilitate interconnection of two or more integrated circuit packages which are mounted to a printed circuit board and coupled to one another either permanently or removably via a circuit or cable, which is suspended, positioned or fixed above the printed circuit board. Some or all high-speed signals, low-speed signals, power or ground may be routed from one integrated circuit package to the other via the circuit or cable, while other signals, power or ground may be routed to the integrated circuit packages via traces and conductive structures that route through the printed circuit board.
Where packaged IC die or chips interconnected in a typical system all signals leave the first chip, transition through the IC package and exit the IC package, travel through solder connections into the PCB substrate, emerge from the PCB substrate, travel through a second set of soldered connections into another IC package to the IC chip or die contained therein. This signal path typically contains discontinuities which distort and/or reduce the quality and strength of the transmitted signal.
The embodiments in U.S. patent application Ser. No. 10/426,930, set forth alternatives that allow signals to be transmitted “off-the-top” directly between chips by routing signals from one package to another package without traversing the printed circuit board. In one embodiment, signals are launched from the surface of one chip package, through a controlled impedance cable or circuit structure, to a second chip package of similar construction.
The embodiments set forth in the present patent application allow I/O drivers are connected directly to those signal lines and transmitted through the cable or circuit to the surface of the second chip package.
It is also possible to modify existing packages to convert them into off the top structures by the addition of a top circuit layer structure designed to carry high speed signals. This allows for a user of the technology to bond a circuit directly to the top of an existing IC package circuit with limited modifications. In such an embodiment the chosen I/O terminals formerly needed for IC interconnection to the package and PCB are bypassed and interconnection is instead made directly to the terminals on the cable or circuit mounted onto the package using an electrical connection technology, such as wire bonding or flip chip. Such added cable or circuit structures would provide the paths for some or all high speed signals either proximate to the edge of the body of the package or beyond the edge of the package to a location intermediate between the edge of the package and the chip where interconnections can be made to a terminal block or connector of a design which does not degrade the signal quality.
Alternatively, an embodiment could also provide a top circuit layer structure direct from the chip, off of and away from, the perimeter of the package. Some embodiments may carry the signal away from the chip starting at the chip itself, the bond wire, or the bond pad on the package.
The top circuit layer structure could be made of reinforced materials or non-reinforced materials (i.e., rigid to flexible) and could be made of various materials matching the electrical needs of the application.
These and other embodiments of the invention are disclosed in further detail below with the aid of figures.
FIG. 1A provides examples of an IC package 10 modified in accordance with an embodiment of the invention described in U.S. patent application Ser. No. 10/426,930 for reference, wherein terminations at both ends of selected circuit traces, are provided on the top surface of the package, disposed with terminations at one end near the center for connection to and IC die and at the other end near the edge of the package 11 disposed with terminations for connection to another circuit element such as a controlled impedance flexible cable. FIG. 1B provides a cross sectional view to illustrate a prospective construction, where a flexible or rigid insulating dielectric base material 12 has conductive circuit traces 13 extending to termination on either side partially protected by a second insulating dielectric material 14 of suitable properties. An IC die 15 is attached to the base circuit structure which can have one or more layers of interconnection wiring comprising internal layers (not shown) and interconnected to traces thereon by means of wire bonds 16. Alternatively it can be mounted flip chip with bumps (not shown). The IC die and wires are protected by an encapsulant 17 and contacts such as solder balls 18 are provided for connection to a PCB or other structure while a second circuit 19 such as a flexible circuit or cable, is attached to the opposite (e.g. upper) surface using a suitable means such as solder or conductive adhesive or by a separable connection (not shown). The circuit 19 can be but is not limited to a microstrip or stripline construction and can also be of unshielded differential pairs or single ended or coaxial connections if so desired. One or more of the separate circuits 19 can be mounted on the otherwise unmodified IC package substrate on one or both sides if desired.
FIG. 2 illustrates an embodiment showing a circuit side view of an otherwise unmodified IC package 20 having mounted onto its surface a circuit structure 21 comprised of three circuit arms (e.g. flexible circuits) from a central body extending beyond the edge and each having terminations sites 22 at the end and each having second termination sites 23 near the center of the package substrate. In this drawing, circuit structure 21 is comprised of three flexible circuits, although the circuit structure could contain one circuit structure or a plurality of circuit structures. Also shown in the figure are two alternative cross sectional embodiment views 20A and 20B of the unmodified IC package 20 with attached circuits 21. The cross section 20A shows an IC package structure embodiment wherein the circuits all terminations are on the same side of the package and a circuit structure 21 is attached with interconnections made directly to the chip. The cross section 20B shows an IC package structure where IC terminations are on one surface (e.g. top) and package terminations are on the side opposite with interconnection between the sides made by conductive pathways such as plated through holes and a circuit structure 21 is attached and interconnected directly to the IC die or chip.
FIG. 3 provides a perspective view of an IC package substrate 20 and a second circuit structure 30. The separately constructed circuit structure 30 in the figure has arms containing conductive circuit traces routed to near the edge of the IC package on three sides, 31a-31c and extending beyond the edge of the package on the fourth side 31d. However, the conductive circuit traces on all sides could be of any chosen length required for the design application, extending off of, to the edge of, or to a point on the IC package substrate 20. Though not shown, multiple layers of separate circuits may be placed one atop another to create multiple signal pathways. Access to each separately constructed circuit structures may be achieved by making successively wider openings in the central aperture in each successive separate circuit. Conductive circuit traces 32, 34 are provided on four sides, the traces each having terminations at both ends. One end 33 of each set of terminations are toward the edges of the arms and the second end of each set of terminations 34 are toward the edges of the aperture 35, the latter allowing access and interconnection to I/O terminals on the IC die.
FIG. 4 illustrates in a perspective view of an embodiment in which the assembly of IC package and the circuit structure shown in FIG. 3 comprises an IC die 41 wired bonded to a circuit structure to create a partially completed assembly 40. An enlarged detail section shows contacts being made by wires 42 directly from first terminations on the chip 43 to second terminations 34 on the attached circuit structure 30. Though only one die is shown, stacking of additional IC die atop the first is also possible and can be used in combination with the stacking of additional circuit layer if so desired. Such additional circuit layers could also include coiled inductors and wireless antenna.
FIG. 5 illustrates an assembly embodiment 50 with separate circuit structure 30 having additional IC chips 51 mounted and interconnected to it using a suitable method (e.g. flip chip interconnection) and positioned between the IC 41 and the circuit paths with their terminations. Such chips could provide extra functionality or improve signal performance with external drivers. Again, stacking of IC chips one atop another and then interconnected to the combined structure package (not shown) is also possible to provide extra functionality.
FIG. 6 illustrates the embodiment illustrated in FIG. 5 further processed to create a more complete assembly 60, having an encapsulant or over mold material 61 applied over the assembly to protect the IC chip mounted on and interconnected to both the unmodified IC package substrate and separate circuit 30 and leaving terminal locations 62 for the circuits open and free of encapsulant.
FIGS. 7A and 7B provide prospective views of alternative embodiments for the separate circuit. In FIG. 7A the assembly 70 has arms extending away from the location of the central IC die in varying discrete directions 72 allowing for circuit paths to be routed at any desired angle. The assembly embodiment 71 shows a top circuit as a monolithic structure with circuits routable along any desired path on its surface. Such structure could also serve as a foundation for a coil or like structures. Any of the separate circuits could be constructed with perforations in them (not shown) that may improve bonding to the IC package and the flow and fill of any adhesives that might be used in the bonding process. Perforations may also facilitate and or improve bonding of the overmolding or encapsulating material used to protect the IC and its interconnections.
FIG. 8 illustrates an embodiment wherein an unmodified IC package substrate 80 comprising an insulating dielectric base material 82 and IC chip 81 mounted thereon. Circuit paths 86 on the base material of the package, terminate on the package at a solder ball terminals 88 and the IC chip 81 is interconnected to the circuit paths on the package by means of wire bonds 83. The mounted and bonded separate circuit 89, shown in the image as a three metal conductor layer stripline circuit which extends beyond the perimeter of the IC package interconnection substrate is also interconnected to the chip by means of a separate wire bond 84. The chip, bonded separate circuit and the interconnections are protected by an encapsulant 87.
FIG. 9 illustrates an embodiment wherein the separate circuits 95, shown in the figure as stripline circuits are bonded and interconnected circuit paths 92b using an interconnection material such as solder or conductive adhesive 94. An interconnection path is made to the flip chip IC 91 on the opposite side of the package substrate by way of vias 93 passing through the IC package to the surface opposite the strip line circuits. The side having the flip chip also has circuit paths 92a to be mounted to a next level interconnection substrate.
FIG. 10 illustrates an embodiment wherein the separate circuit 100 is extended, folded back and bonded to the encapsulated chip and circuit using an adhesive 101 and having terminals 102 to provide a larger or more stable platform for interconnecting to and routing signals to one or more other IC chip packages distant or proximate to the first IC chip package.
FIG. 11 illustrates an embodiment wherein a bonded separate circuit (e.g. a stripline circuit) 100 has an extended length separate circuit and a separate IC chip or package 111 mounted on the separate circuit to provide either greater functionality or performance. The extended length separate circuit is bonded to the top of the encapsulated package using an adhesive 101.
FIG. 12 illustrates a partially assembled embodiment showing potential interconnection methods for some of the various described embodiments of finished parts. A base interconnection structure or printed circuit 121 has disposed for interconnection four package structures 120a-120b each having integral separate circuit extensions 30 and openings 61 allowing interconnections to be made either to one another or to other separate interconnecting structures, such as a common buss cable 122 or other interconnecting structure.
FIG. 13 show a perspective view of another assembly embodiment 130 comprised of a base circuit structure 131 and four interconnected package structures 132a-132b. While only four packages are shown, it is obvious that many packages are possible. The packages are interconnected by means of discrete circuit elements of varying shapes and lengths. For example section 133 is straight, 134 is curved and 135 is bifurcated. Also show are pedestals which serve to support and interconnect the partial circuits. The pedestals can be of insulating material (e.g. polymer ceramic or glass), conductive material (e.g., metal or metal filled polymers), semi-conductive materials (e.g. silicon) or combinations there of. The pedestals serve to support and can also align circuits they interconnect and can be used to make either permanent or temporary/separable connections.
FIG. 14 shows a perspective view of an embodiment of an IC package assembly 140 comprising a base circuit 141 and a central die 142 and encapsulated with a suitable material 143 but having at least one open area 145 with exposed electrical contacts 146. An enlarged detail view 147 shows the contacts provided with conductive bumps 148 if desired. The encapsulating material 143 is disposed with a hinge position 144.
FIG. 15 shows assembly 140 with a locking lever 155 in place and in an open position. Also shown is a partial view of a circuit assembly 150 disposed for mating to the IC package. Circuit assembly 150 has a base circuit 151 which may be a flexible circuit and has a stiffener 152 affixed to the base circuit. The stiffener can also serve as an alignment mechanism such as providing a slot thereon which would capture a pin on the mating assembly (not shown).
FIG. 16 illustrates a cross sectioned view through the middle of assembly 140 and the circuit assembly 150. The circuit assembly 150 has been inserted under locking lever 155. When notch 153 in stiffener 152 (shown in FIG. 15) touches stop 161, the circuit assembly 150 is in position for the next operation.
FIG. 17A-C illustrate, in a close-up cross section views, selected elements of FIG. 16 showing detail of the operation.
FIG. 17A shows of the locking lever 155, circuit assembly 150 and assembly 140.
FIG. 17B shows the locking lever 155 partially rotated toward the fully locked position. The pulls 173 are just beginning to engage the notches 174.
FIG. 17C shows the locking lever 155 in the fully locked position. The pulls 173 have pulled the flexible circuit assembly into the IC package. As the locking lever rotates into the locked position, the cam surface 175 on the locking lever 155 pushes down on the top of the sitffener 152 thus forcing the flexible circuit's contact pads downward. These two actions create contact force and contact wipe thus increasing contact reliability.
FIG. 18 shows a hidden section view through the top of assembly 140 and circuit assembly 150. The section enables us to view the locations of the electrical contacts 148 on assembly 140 and the electrical contacts 171 on the circuit assembly 150. The electrical contacts provide more than one contact per signal interconnection and are designed to eliminate the capacitive stub common when only one electrical contact is present per signal interconnection. The electrical contacts may be conductive dots or bumps of gold or other suitable corrosion resistant contact metal. The dots or bumps serve to connect with electrical contact pads. FIGS. 17A-C illustrate how the contacts on each side of the interconnection interface move with respect to each other to provide contact wipe.
FIG. 19 provides a rear view of the locking lever 155. The stop 161, pulls 173, and cam surface 175 are shown. The stop 161 and pull 173 features on the locking lever 155. While shown as having defined dimensions for the illustration, they are not limited in size, shape or location on the locking lever nor are the size, shape or location of corresponding mating notches on the stiffener 152 with the major concern being that their primary functions are fulfilled.
FIG. 20 illustrates a partially assembled embodiment 200 of the pedestals interconnection devices 136 shown in FIG. 13. In the figure, a pedestal connector 136 serves to electrically interconnect circuit assemblies 150, which are disposed to be positioned within the saddle of the body of the pedestal. Locking levers 155a, 155b are positioned back to back and have the same basic functions and configurations as locking lever 155 shown in FIG. 15. In the figure, locking lever 155a is shown in the open position and disposed for connecting to circuit assembly 150, while locking lever 155b is shown in the closed position with the circuit assembly connected and locked into position. Circuit substrate 203, resides inside connector housing 206, and has a set of exposed electrical contacts 204 with conductive bumps 205 at or proximate to the end of the conductors. Conductive bumps 205 are similar to those items 146, 148 respectively shown in FIG. 14. There is an unseen, mirror image of electrical contacts with conductive bumps under locking lever 155b. The locking levers 155a, 155b provide the force required to electrically interconnect circuit assemblies 150 through circuit substrate 203. Either or both circuit assemblies 150 may be electrically attached to IC packages or other electrical components and provide electrical function such as a ground function. Circuit assemblies 150 can also be provided with alignment features such as slots which would capture pins on the pedestal (not shown)
FIG. 21 illustrates an isometric view from the bottom of the partially assembled structure 200. In the figure, the bottom of the pedestal electrical connector 136 and circuit assemblies 150, Conductive bumps 171 are at the ends of the circuit assemblies' electrical contact pads. Posts 210 may be integral with the connector housing 206 may be positioned into holes in a printed circuit board or the like (not shown). These posts or additional posts on the bottom of the connector housing may be conductive and electrically connect electronic signals, ground or power, originating in the printed circuit board to the conductors in the circuit assemblies 150 and or pedestal connector 136 or to conductors in the circuit substrate 203.
While the much discussion has be given to the use of circuits bonded into the saddle of a pedestal, it should be clear to those of average skill in the art that the circuit conductors could be molded into the body of the pedestal and that the shoulders which define the saddle are not a mandatory requirement.
The locking lever, when operated, may provide the contact force necessary for low contact resistance while simultaneously moving the contact with respect to the contact pad to produce contact wipe. Present known art relative to locking levers provide no purposeful contact wipe but instead commonly produce a butt contact which normally offers no contact wipe. Moreover, butt contact requires much larger contact forces than a contact with wiping action. Thus the embodiments illustrated may not require as much contact force as prior art. When the contact forces of all the interconnections in the embodiments are added, the necessary connector clamping force may thus be lower.
In FIG. 18 conductive bumps or conductive dots are placed at the ends of the contact pads in each circuit element. When the contacts are overlapped and electrically interconnected, they may fully or partially eliminate the capacitive stub that is typically created when only one conductive bump is present in the signal interconnection. FIG. 18 illustrates contact redundancy for each signal interconnection. FIG. 18 also illustrates alignment between the contacts in the direction defined by a line between the redundant contacts in the signal interconnection. In this embodiment, if one contact is farther away from or closer to the redundant contact in the signal interconnection, contact and signal integrity are still generally retained.
Although the invention has been described with reference to specific exemplary embodiments thereof, modifications and changes may be made thereto without departing from the broader spirit and scope of the invention. The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense.
Patent Application
20060091507
