Claims
- 1. A method of assembling a multi-die semiconductor die assembly, comprising the steps of:providing a first die having a face surface, with said first die face surface having a configuration of bond pads positioned thereon; providing a second die having a face surface, with said second die face surface having a plurality of bond pads positioned thereon in a configuration different by at least one bond pad location from said first die bond pad configuration; providing a leadframe having a first side and a second side, and a plurality of lead finger elements of differing length, orientation or configuration; attaching said face surface of said first die to said leadframe first side, wherein at least some of said first die bond pads are in electrical communication with at least some of said plurality of lead finger elements; forming at least one layer of passivation material over said face surface of said first die and over said leadframe; and placing said second die over said at least one layer of passivation material and attaching said face surface of said second die to said leadframe second side with a portion of said at least one layer of passivation material disposed therebetween and wherein at least some of said second die bond pads are in electrical communication with at least some of said plurality of lead finger elements.
- 2. The method of claim 1, further comprising extending at least one internal lead finger segment in electrical communication between said first die bond pads and said second die bond pads.
- 3. The method of claim 1, further comprising providing a die paddle on said leadframe.
- 4. The method of claim 3, further comprising employing said die paddle as a power bus for said first and second dice.
- 5. The method of claim 3, further comprising employing said die paddle as a common ground for said first and second dice.
- 6. The method of claim 3, further comprising employing said die paddle as a signal-bearing lead finger accessed by said first and second dice.
- 7. The method of claim 1, further comprising encapsulating at least said first die and said second die with an encapsulant material.
Parent Case Info
This application is a continuation of application Ser. No. 08/843,283 filed Apr. 14, 1997, now U.S. Pat. No. 5,894,165 issued Apr. 13, 1999, which is a continuation of application Ser. No. 08/664,409 filed Jun. 17, 1996, now U.S. Pat. No. 5,677,567 issued Oct. 14, 1997.
US Referenced Citations (20)
Foreign Referenced Citations (2)
Number |
Date |
Country |
474224 |
Mar 1992 |
EP |
62-90958 |
Apr 1987 |
JP |
Continuations (2)
|
Number |
Date |
Country |
Parent |
08/843283 |
Apr 1997 |
US |
Child |
09/290733 |
|
US |
Parent |
08/664409 |
Jun 1996 |
US |
Child |
08/843283 |
|
US |