Number | Name | Date | Kind |
---|---|---|---|
5334857 | Mennitt et al. | Aug 1994 | |
5355283 | Marrs et al. | Oct 1994 | |
5400220 | Swamy | Mar 1995 | |
5424492 | Petty et al. | Jun 1995 | |
5442852 | Danner | Aug 1995 | |
5444296 | Kaul et al. | Aug 1995 | |
5521435 | Mizukoshi | May 1996 | |
5541450 | Jones et al. | Jul 1996 | |
5561323 | Andros et al. | Oct 1996 | |
5717245 | Pedder | Feb 1998 | |
5796170 | Marcantonio | Aug 1998 |
Entry |
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Freyman et al., Overmolded Plastic Pad Array Carriers (OMPAC): A Low Cost, High Interconnect Density IC Packaging Solution For Consumer and Industrial Electronics, pp. 176-179, 181-182. |