Number | Date | Country | Kind |
---|---|---|---|
56-100337 | Jun 1981 | JPX |
Number | Name | Date | Kind |
---|---|---|---|
4142203 | Dietz | Feb 1979 | |
4150421 | Nishihara et al. | Apr 1979 | |
4245273 | Feinberg et al. | Jan 1981 | |
4296456 | Reid | Oct 1981 | |
4322778 | Barbour et al. | Mar 1982 |
Number | Date | Country |
---|---|---|
2736055 | Feb 1978 | DEX |
2282719 | Mar 1976 | FRX |
Entry |
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"Personalized Prepackaged Semiconductor Devices" Chang et al.-IBM Technical Disclosure Bulletin, vol. 17, No. 7, Dec. 1974, p. 1950. |
"Heat Dissipation from IC Chips through Module Package" Balderes et al., IBM Technical Disclosure Bulletin, vol. 19, No. 11, Apr. 1977, p. 4165. |
"Microcircuit Having Pinned Terminals"-Cochran et al.-IBM Disclosure Bulletin, vol. 8, No. 11, Apr. 1966, pp. 1483-1484. |