Claims
- 1. An electronic package comprising:a first circuitized substrate having first and second surfaces; a semiconductor chip positioned on said first surface of said first circuitized substrate and including a first plurality of electrical conductors electrically coupling said semiconductor chip to said first circuitized substrate; a second plurality of electrical conductors located on said second surface of said first circuitized substrate and adapted for directly electrically coupling said first circuitized substrate to an external circuitized substrate, said second plurality of electrical conductors comprising a plurality of substantially spherical solder balls not being electrically connected to said external circuitized substrate; and a dielectric protective covering, substantially covering all external surfaces of said first circuitized substrate, said semiconductor chip, and said first plurality of electrical conductors, and wherein said dielectric protective covering conforms to an embedded external surface of one of said second plurality of substantially spherical solder balls such that an exposed curved surface of at least one of said substantially spherical solder balls is positioned for direct contact with the external circuitized substrate.
- 2. The electronic package of claim 1, wherein said dielectric protective covering forms a hydrophobic barrier.
- 3. The electronic package of claim 1, wherein said dielectric protective covering is comprised of TEFLON AF, a fluorinated thermosetting material or a fluorinated parylene material.
- 4. The electronic package of claim 1, wherein said first circuitized substrate is comprised of polymer or ceramic material and further includes one or more conductive layers.
- 5. The electronic package of claim 1, wherein said first plurality of conductors are comprised of solder material.
- 6. The electronic package of claim 1, wherein said first plurality of conductors are comprised of solder material.
- 7. The electronic package of claim 5, wherein said substantially spherical solder balls are comprised of a different solder material than said solder material of said first plurality of conductors, said first and second solder materials having different melting points.
- 8. The electronic package of claim 7, wherein said first plurality of conductors for electrically coupling said semiconductor chip to said first circuitized substrate are comprised of 90:10 lead-tin solder or 97:3 lead-tin solder.
- 9. The electronic package of claim 8, wherein said plurality of substantially spherical solder balls located on said substrate for electrically coupling said substrate to an external substrate are comprised of 63:37 lead-tin solder.
Parent Case Info
This application is a divisional application of Ser. No. 08/939,302, filed Sep. 29, 1997, U.S. Pat. No. 5,888,850 and entitled, “METHOD FOR PROVIDING A PROTECTIVE COATING AND ELECTRONIC PACKAGE UTILIZING SAME” (inventors: R. D. Havens et al).
US Referenced Citations (28)