Claims
- 1. A semiconductor device assembly comprising:a lead frame having a plurality of lead fingers thereon, at least one lead finger of said plurality of lead fingers having an attaching surface; a semiconductor device having an active surface having at least one bond pad thereon; and a non-conductive polymer adhesive comprising a copolymer material selected from a group of isobutyl compounds, a first portion of said non-conductive polymer adhesive including isobutyl acetal diphenol copolymer, said non-conductive polymer adhesive being characteristically tacky and compliant at a room temperature in a range of about 50° F. to 95° F., said non-conductive polymer adhesive applied to one of said attaching surface of said at least one lead finger of said plurality of lead fingers of said lead frame and a portion of said active surface of said semiconductor device for compression therebetween to connect said at least one bond pad of said semiconductor device to said at least one lead finger of said plurality of lead fingers of said lead frame.
- 2. The semiconductor device assembly of claim 1, wherein said first portion of said non-conductive polymer adhesive consists of isobutyl acetal diphenol copolymer.
- 3. The semiconductor device assembly of claim 1, wherein said non-conductive polymer adhesive includes a first material chosen from a group of copolymers that includes isobutyl acetal diphenol copolymer and a second material that is from a group of metal oxides that includes titanium dioxide.
- 4. The semiconductor device assembly of claim 3, wherein said non-conductive polymer adhesive has from about 75 percent to about 95 percent by weight of isobutyl acetal diphenol copolymer and from about 25 percent to about 5 percent by weight, respectively, of titanium dioxide.
- 5. A semiconductor device assembly comprising:a lead frame having a plurality of lead fingers thereon, each lead finger of said plurality of lead fingers having an attaching surface; a semiconductor device having an active surface having bond pads thereon; and a non-conductive polymer adhesive comprising a copolymer material selected from a group of isobutyl compounds, said non-conductive polymer adhesive comprising from about 75 percent to about 95 percent by weight of isobutyl acetal diphenol copolymer and from about 25 percent to about 5 percent by weight, respectively, of titanium dioxide, said non-conductive polymer adhesive being characteristically tacky and compliant at a room temperature in a range of about 50° F. to 95° F. and is applicable to a substrate through a stencil, said non-conductive polymer adhesive being applied to said attaching surface of said plurality of lead fingers of said lead frame and a portion of said active surface of said semiconductor device for compression therebetween to connect said bond pads of said semiconductor device to said plurality of lead fingers of said lead frame.
- 6. The semiconductor device assembly of claim 5, wherein a first portion of said non-conductive polymer adhesive is isobutyl acetal diphenol copolymer.
- 7. The semiconductor device assembly of claim 5, wherein said non-conductive polymer adhesive includes a first material chosen from a group of copolymers that includes isobutyl acetal diphenol copolymer and a second material that is from a group of metal oxides that includes titanium dioxide.
- 8. The semiconductor device assembly of claim 7, wherein said non-conductive polymer adhesive consists of from about 75 percent to about 95 percent by weight of isobutyl acetal diphenol copolymer and from about 25 percent to about 5 percent by weight, respectively, of titanium dioxide.
- 9. A semiconductor device assembly comprising:a lead frame having a plurality of lead fingers having attaching surfaces thereon; a semiconductor die having an active surface having a plurality of bond pads thereon; and a non-conductive polymer adhesive which includes a first material chosen from a group of copolymers that includes isobutyl acetal diphenol copolymer and a second material that is from a group of metal oxides that includes titanium dioxide, said non-conductive polymer adhesive being applied at a temperature in a range of about 50° F. to 95° F. to one of said attaching surfaces of said plurality of lead fingers and a portion of said active surface of said semiconductor die for compression therebetween to connect said semiconductor die to said at least two lead fingers of said plurality of lead fingers of said lead frame.
- 10. A semiconductor device comprising:a lead frame having an attaching surface thereon; a semiconductor die having a plurality of bond pads on an active surface thereof; and an adhesive that includes from about 75 percent to about 95 percent of isobutyl acetal diphenol copolymer and from about 25 percent to about 5 percent, respectively, of titanium dioxide, said adhesive being applied at a temperature in a range of about 50° F. to 95° F. to at least a portion of said attaching surface of said lead frame and a portion of said active surface of said semiconductor die for compression therebetween.
- 11. A semiconductor device assembly comprising:a lead frame having a plurality of lead fingers thereon, each lead finger of said plurality of lead fingers having an attaching surface thereon; a semiconductor die having an active surface having a plurality of bond pads thereon; and a non-conductive polymer adhesive which includes a first material chosen from a group of copolymers that includes isobutyl acetal diphenol copolymer and a second material that is from a group of metal oxides that includes titanium dioxide, said non-conductive polymer adhesive being applied at a temperature in a range of about 50° F. to 95° F. to portions of said attaching surfaces of said lead fingers of said plurality of lead fingers and to a portion of said active surface of said semiconductor die for compression therebetween to connect said active surface of said semiconductor die to said attaching surfaces of said plurality of lead fingers of said lead frame.
- 12. A semiconductor device comprising:a lead frame having an attaching surface; a semiconductor die having bond pads on an active surface thereof; and an adhesive that includes from about 75 percent to about 95 percent of isobutyl acetal diphenol copolymer and from about 25 percent to about 5 percent, respectively, of titanium dioxide, said adhesive being applied at a temperature in a range of about 50° F. to 95° F. to portions of at least two of said attaching surfaces of said lead frame and a portion of said active surface of said semiconductor die for compression therebetween.
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a division of application Ser. No. 09/339,718, filed Jun. 24, 1999, now U.S. Pat. No. 6,316,823 B1, issued Nov. 13, 2001, which is a continuation of application Ser. No. 09/177,000, filed Oct. 22, 1998, now U.S. Pat. No. 5,959,347, issued Sep. 28, 1999, which is a divisional of application Ser. No. 08/916,977, filed Aug. 14, 1997, now U.S. Pat. No. 5,840,598, issued Nov. 24, 1998.
US Referenced Citations (23)
Continuations (1)
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Number |
Date |
Country |
Parent |
09/177000 |
Oct 1998 |
US |
Child |
09/339718 |
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US |