Claims
- 1. A method of devising a high-density circuit module comprising the steps of:
providing a first-level CSP having contact sites along a major surface, an upper surface and a lower surface, and opposing lateral sides defining a lateral extent of the CSP; providing a second-level CSP having contact sites along a major surface; attaching a form standard to the first-level CSP such that at least one curved portion of the form standard extends outside of the lateral extent of the CSP to present an at least one curved outer surface, the form standard having a thickness of about 6 mils or less; providing flex circuitry having an outer set of plural flex contacts, an inner set of plural flex contacts, and a thickness of about 4 mils or less; disposing high-temperature solder paste on the contact sites of the first-level CSP; applying heat sufficient to connect selected contact sites of the first-level CSP to select ones of the inner set of plural flex contacts to form a reflowed contact having a height between 2 and 6 mils; wrapping the flex circuitry partially about the at least one curved outer surface of the at least one curved portion of the form standard such that the flex circuitry presents the outer set of plural flex contacts above the form standard and the inner set of plural flex contacts below a lower surface of the first-level CSP; disposing high-temperature solder paste on the CSP contact sites of the second-level CSP; and applying heat sufficient to connect select ones of the second-level CSP contact sites to select ones of the outer set of plural flex contacts to form a reflowed contact having a height between 2 and 6 mils.
- 2. The method of claim 1 in which the form standard and the flex circuitry are thermally connected.
- 3. The method of claim 1 in which the flex circuitry comprises at least one flex circuit having first and second conductive layers, the first conductive layer being closer to the first-level CSP than is the second conductive layer subsequent to the step of wrapping the flex circuitry, between which layers there is an intermediate layer, the second conductive layer having demarked selected ones of the inner and outer sets of plural flex contacts.
- 4. The method of claim 1 in which the flex circuitry comprises at least one flex circuit having first and second conductive layers, the first conductive layer being closer to the first-level CSP than is the second conductive layer subsequent to the step of wrapping the flex circuitry, between which layers there is an intermediate layer, the first conductive layer having demarked selected ones of the inner and outer sets of plural flex contacts.
- 5. The method of claim 1 in which in which the flex circuitry comprises a conductive layer that expresses the inner and outer sets of plural flex contacts for connection of the second-level and first-level CSPs, respectively.
- 6. The method of claim 1 in which the flex circuitry has first and second conductive layers, between which there is an intermediate layer.
- 7. The method of claim 1 further including the step of securing the flex circuitry to the form standard with adhesive.
- 8. The method of claim 1 in which the form standard comprises thermally conductive material, the method further including the step of securing the flex circuitry to the form standard with thermally conductive adhesive.
- 9. The method of claim 1 further including the step of securing the form standard to the first-level CSP with adhesive.
- 10. The method of claim 1 in which the form standard comprises thermally conductive material, the method further including the step of securing the form standard to the first-level CSP with thermally conductive adhesive.
- 11. A method of devising a high-density circuit module comprising the steps of:
providing a first-level CSP having a top major surface and a bottom major surface and contact sites along the bottom major surface; providing a second-level CSP having contact sites along a major surface; securing a flex support means to the top surface of the first-level CSP, the flex support means having a thickness of about 6 mils or less; providing flex circuitry having an outer set of plural flex contacts, an inner set of plural flex contacts, and a thickness of about 4 mils or less; disposing high-temperature solder paste on the first-level CSP contact sites; applying heat sufficient to connect selected contact sites of the first-level CSP to select ones of the inner set of plural flex contacts to form a reflowed contact having a height between 2 and 6 mils; wrapping the flex circuitry partially about the flex support means; disposing high-temperature solder paste on the contact sites of the second-level CSP; and applying heat sufficient to connect selected contact sites of the second-level CSP to select ones of the outer set of plural flex contacts.
- 12. The method of claim 11 in which the flex circuitry comprises at least one flex circuit having first and second conductive layers, the first conductive layer being closer to the first-level CSP than is the second conductive layer subsequent to the step of wrapping the flex circuitry, between which layers there is an intermediate layer, the second conductive layer having demarked selected ones of the inner and outer sets of plural flex contacts.
- 13. The method of claim 11 in which the flex circuitry comprises at least one flex circuit having first and second conductive layers, the first conductive layer being closer to the first-level CSP than is the second conductive layer subsequent to the step of wrapping the flex circuitry, between which layers there is an intermediate layer, the first conductive layer having demarked selected ones of the inner and outer sets of plural flex contacts.
- 14. The method of claim 11 in which the flex support means comprises a mandrel having a lateral extent greater than a lateral extent of the major surface of the first-level CSP.
- 15. The method of claim 11 in which the flex support means comprises an angular cap.
- 16. The method of claim 11 in which the flex support means has a lateral extent extending beyond an at least one lateral side of the first-level CSP.
- 17. The method of claim 11 in which the flex support means has a lateral extent extending beyond two opposing lateral sides of the first-level CSP.
- 18. The method of claim 11 in which the flex support means has a lateral extent extending beyond a lateral extent of the first-level CSP defined by two opposing lateral sides of the first-level CSP, the flex support means presenting curved surfaces outside of the lateral extent of the first-level CSP.
- 19. The method of claim 11 in which the flex support means is thermally conductive, the method further including the step of securing the flex circuitry to the flex support means with thermally conductive adhesive.
- 20. The method of claim 11 in which the flex support means is thermally conductive, the method further including the step of securing the flex support means to the first-level CSP with thermally conductive adhesive.
- 21. A method of devising a high-density circuit module comprising the steps of:
providing a first CSP having a lateral extent defined by opposing lateral sides, and having a plurality of ball contacts disposed along a major surface; providing flex circuitry having a plurality of selected flex contacts each penetrated by an open orifice; disposing the first CSP proximal to the flex circuitry to place the plurality of ball contacts adjacent to the plurality of flex contacts; applying heat sufficient to melt the plurality of ball contacts such that the ball contacts melt and reflow partially through respective ones of the open orifices to present outer contact surfaces; attaching a second CSP to the flex circuitry in a stacked disposition above the first CSP.
- 22. The method of claim 21 in which the open orifices have curved edges.
- 23. The method of claim 21 in which the flex circuitry is comprised of two flex circuits.
- 24. The method of claim 21 in which the flex circuitry has two conductive layers.
- 25. The method of claim 21 further including the steps of:
attaching a form standard to the first CSP, the form standard having at least one curved outer surface; and wrapping the flex circuitry partially about the form standard.
- 26. The method of claim 25 in which the form standard has a thickness of less than about 6 mils.
- 27. The method of claim 25 in which the form standard presents at least one curved outer surface outside of the lateral extent of the first CSP, the step of wrapping the flex circuitry being further characterized by wrapping the flex circuitry about the at least one curved outer surface of the form standard.
- 28. The method of claim 27 in which the form standard has two curved outer surfaces.
- 29. The method of claim 21 in which the flex circuitry comprises at least one flex circuit having first and second conductive layers, the first conductive layer being closer to the first CSP than is the second conductive layer subsequent to the step of attaching a second CSP to the flex circuitry in a stacked disposition above the first CSP, between which first and second conductive layers there is an intermediate layer, the second conductive layer having demarked selected ones of the inner and outer sets of plural flex contacts.
- 30. The method of claim 21 in which the flex circuitry comprises at least one flex circuit having first and second conductive layers, the first conductive layer being closer to the first CSP than is the second conductive layer subsequent to the step of attaching a second CSP to the flex circuitry in a stacked disposition above the first CSP, between which first and second conductive layers there is an intermediate layer, the first conductive layer having demarked selected ones of the inner and outer sets of plural flex contacts.
Parent Case Info
[0001] This application is also a continuation of U.S. Pat. App. No. 10/457,608 filed Jun. 9, 2003, and which application is a continuation-in-part of U.S. Pat. App. No. 10/005,581, filed Oct. 26, 2001, now U.S. Pat. App. No. 6,576,992 B2.
Continuations (1)
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Number |
Date |
Country |
Parent |
10631886 |
Jul 2003 |
US |
Child |
10873847 |
Jun 2004 |
US |
Continuation in Parts (4)
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Number |
Date |
Country |
Parent |
10453398 |
Jun 2003 |
US |
Child |
10631886 |
Jul 2003 |
US |
Parent |
10005581 |
Oct 2001 |
US |
Child |
10453398 |
Jun 2003 |
US |
Parent |
10457608 |
Jun 2003 |
US |
Child |
10631886 |
|
US |
Parent |
10005581 |
Oct 2001 |
US |
Child |
10457608 |
Jun 2003 |
US |