Claims
- 1. A resin molded semiconductor package, to be mounted on a printed circuit board by solder reflow, comprising:a semiconductor chip of silicon having a major surface and a rear surface opposite to said major surface, said semiconductor chip having a plurality of semiconductor elements and bonding pads formed on said major surface; a lead frame comprised of copper, said lead frame including: a first supporting lead and a second supporting lead for mounting said semiconductor chip, said first supporting lead extending in a first direction, said second supporting lead intersecting said first supporting lead and extending in a second direction which is different from said first direction, said first and second supporting leads being integrally formed each other; a plurality of leads each having an inner lead and an outer lead which is continuously formed with said inner lead, said plurality of leads being arranged to surround an intersecting portion of said first and second supporting leads; a plurality of bonding wires electrically connecting said inner leads of said plurality of leads with said plurality of bonding pads respectively; and a resin sealing body sealing said semiconductor chip, said inner leads of said plurality of leads, said first and second supporting leads and said plurality of bonding wires; wherein said semiconductor chip is mounted on said intersection of said first and second supporting leads, wherein an area where said first and second supporting leads overlap with said semiconductor chip is smaller than an area of, said semiconductor chip, wherein said semiconductor chip is adhered to said first and second supporting leads by an adhesive layer formed between said rear surface of said semiconductor chip and said intersecting portion of said first and second supporting leads, wherein said adhesive layer includes a base insulating film having upper and lower sides and adhesive formed on both the upper and lower sides of said base insulating film, and wherein a thermal expansion coefficient of said lead frame is larger than that of said semiconductor chip.
- 2. A semiconductor device according to claim 1, wherein said first and second directions intersect to each other at substantially a right angle.
- 3. A semiconductor device according to claim 1, wherein one portion of said rear surface of said semiconductor chip is adhered to said first and second supporting leads, and wherein another portion of said rear surface of said semiconductor chip is directly contacted with said resin sealing body.
- 4. A semiconductor device according to claim 2, wherein said resin sealing body has a tetragonal shape, wherein said outer leads of said plurality of leads protrude outwardly from four sides of said resin body, and wherein said first and second supporting leads extend from said intersection toward four corners of said resin sealing body.
- 5. A semiconductor device according to claim 3, wherein said semiconductor chip has a tetragonal shape, and wherein each width of first and second supporting leads at a vicinity of said intersection is larger than a width of first and second supporting leads outside of said semiconductor chip.
Priority Claims (1)
Number |
Date |
Country |
Kind |
10-245406 |
Aug 1998 |
JP |
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Parent Case Info
This is a continuation of application Ser. No. 09/387,052, filed Aug. 31, 1999 now U.S. Pat. No. 6,340,837.
US Referenced Citations (7)
Foreign Referenced Citations (6)
Number |
Date |
Country |
0712159 |
May 1996 |
EP |
63-204753 |
Aug 1988 |
JP |
7-263470 |
Oct 1995 |
JP |
8-204107 |
Aug 1996 |
JP |
9-111204 |
Apr 1997 |
JP |
10-012760 |
Jan 1998 |
JP |
Continuations (1)
|
Number |
Date |
Country |
Parent |
09/387052 |
Aug 1999 |
US |
Child |
10/051009 |
|
US |