3796598

Information

• Patent Grant
• 3796598

• References
• Source

• Patent Number

  3,796,598

• Date Filed

  Not available

• Date Issued

  Tuesday, March 12, 1974
  51 years ago

• CPC

  • H01L24/10 - Bump connectors ; Manufacturing methods related thereto
  • H01L23/485 - consisting of layered constructions comprising conductive layers and insulating layers
  • H01L24/13 - of an individual bump connector
  • H01L24/81 - using a bump connector
  • H01L24/45 - of an individual wire connector
  • H01L2224/13 - of an individual bump connector
  • H01L2224/13099 - Material
  • H01L2224/45124 - Aluminium (Al) as principal constituent
  • H01L2224/45144 - Gold (Au) as principal constituent
  • H01L2224/48247 - connecting the wire to a bond pad of the item
  • H01L2224/81801 - Soldering or alloying
  • H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01014 - Silicon [Si]
  • H01L2924/01015 - Phosphorus [P]
  • H01L2924/01018 - Argon [Ar]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01023 - Vanadium [V]
  • H01L2924/01024 - Chromium [Cr]
  • H01L2924/01027 - Cobalt [Co]
  • H01L2924/01029 - Copper [Cu]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01039 - Yttrium [Y]
  • H01L2924/01042 - Molybdenum [Mo]
  • H01L2924/01047 - Silver [Ag]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01078 - Platinum [Pt]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/01322 - Eutectic Alloys
  • H01L2924/014 - Solder alloys
  • H01L2924/12036 - PN diode
  • H01L2924/14 - Integrated circuits
  • H01L2924/19043 - being a resistor
  • Y10S148/02 - Contacts, special
  • Y10S148/17 - Vapor-liquid-solid

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 148 - Metal treatment
  • 257 - Active solid-state devices