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2530217 | Bain | Nov 1950 | |
3154503 | Janakirama-Rao et al. | Oct 1964 | |
4002799 | Dumesnil et al. | Jan 1977 | |
4186023 | Dumesnil et al. | Jan 1980 | |
4251595 | Dumesnil et al. | Feb 1981 | |
4401767 | Dietz et al. | Aug 1983 | |
4476090 | Heidsiek et al. | Oct 1984 |
Entry |
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Moghadam, F. K. "Development of Adhesive Die Attach Technology in Cerdip Packages; Material Issues"-Proceedings of the 1983 ISHM International Microelectronics Symposium, Oct. 31-Nov. 2, 1983, Phila., Pa.-9 pages. |