Method of fabrication on high coplanarity of copper pillar for flip chip packaging application

Abstract

This invention is characteristic of combining an electroplating process with a polishing process to uniformly fabricate multi-layer flip chip copper pillar. All kinds of flip chip copper pillar with varied shapes and sizes are able to be defined by using multi-layer photolithography process commonly utilized in the semiconductor processes. After that, use both exposure and alignment procedures to accurately define multi-layer photoresist's patterns on the substrate. Some designated metallic materials are then electroplated on those completed well-defined patterns during the last photolithography process by means of an electroplating process. A polishing process follows the electroplating to level the rugged solder bumps, resulted from the impact on the certain changeable and inevitable electroplating parameters. The first layer of evenly polished flip chip copper pillar could be used as a base metal to continuously deposit another separate flip chip copper pillar that may have different materials as well as heights from the first one. Similarly, the second upper layer of flip chip copper pillar is capable of being uniformly polished employing the same polishing mechanism as the first one. High coplanarity of multi-layer electroplating-based flip chip copper pillar suitable to be used in the high-end and advanced three-dimensional electronic packaging will be achieved after finishing the final reflow process.

Description

BRIEF DESCRIPTION OF DRAWINGS

The detailed drawings of this invention will be fully understood from the following descriptions wherein:

FIG. 1 is a flow chart showing the whole procedures of this invention.

FIGS. 2A-2K are schematic diagrams depicting the whole procedures involved in forming plated high coplanarity of flip chip copper pillar step by step.

FIG. 3 is a schematic diagram of the polisher used to polish non-uniform plated structures.

FIG. 4 illustrates the self-designed polishing fixture and shows the relative locations of the taped flexible rubber and the outer PVC ring.

Claims

1. A method for controlling the coplanarity of multi-layer flip chip copper pillars based on the processes of multi-layer photolithography, electroplating, polishing, stripping PR and UBMs, and reflow, comprising the steps of: (1) using a mask to give the layout of flip chip copper pillars on the substrate by photolithography process;(2) depositing two separate layers of copper pillars in turn by using electroplating process inner the open holes defined after photolithography process;(3) employing a polishing process to planarize the plated structures exceeded the PR surface throughout the whole substrate to control the height of the electroplated copper pillars;(4) stripping PR and UBMs; and(5) placing the polished copper pillars into the reflow oven to conduct reflow process, if necessary.

2. The method of claim 1, wherein in said step (2), the first layer out of the two separate layers of copper pillars is made of copper or other metals dispelling heat well such as Au (Gold), Ag (Silver) and Al (Aluminum).

3. The method of claim 1, wherein in said step (2), the second layer out of the two separate layers of copper pillars is made of Sn—Pb or other Pb-free Sn-based metals or alloys such as pure Sn, Sn—Ag, Sn—Cu, Sn—Bi, Sn—Ag—Cu.

4. The method of claim 1, wherein in said step (3), the height of the electroplated copper pillars could be precisely controlled to the desired and expectative dimension by means of a polishing mechanism.

5. A method for controlling the coplanarity of single-layer and multi-layer flip chip copper pillars by using a polisher equipped with a main platen, a hard polishing plate, a soft polishing pad, polishing slurry and a polishing holding fixture.

6. The method of claim 5, wherein the multi-layer refer to the electroplated flip chip copper pillars contain two layers or above.

7. The method of claim 5, wherein the hard polishing plate is made of stainless or cast iron.

8. The method of claim 5, wherein the soft polishing pad is made of non-woven or Polyurethane materials applicable to be taped on the hard polishing plate.

9. The method of claim 5, wherein the types of slurry composition in accordance with using varied polishing speeds, electroplated solder materials and hardness of the soft polishing pad are Al2O3, SiO2, CeO2 and ZrO2.

10. The method of claim 5, wherein the surface of the polishing holding fixture is taped with a piece of flexible soft rubber and a fixing device that could fix the polished substrate unmoved like a PVC ring is placed on the rim of the flexible soft rubber.