3900153

Information

• Patent Grant
• 3900153

• References
• Source

• Patent Number

  3,900,153

• Date Filed

  Not available

• Date Issued

  Tuesday, August 19, 1975
  49 years ago

• CPC

  • H05K3/341 - Surface mounted components
  • B23K35/0244 - Powders, particles or spheres; Preforms made therefrom
  • H01L24/27 - Manufacturing methods
  • H01L24/29 - of an individual layer connector
  • H01L24/32 - of an individual layer connector
  • H01L24/83 - using a layer connector
  • H01L2224/27505 - Sintering
  • H01L2224/29216 - Lead [Pb] as principal constituent
  • H01L2224/29339 - Silver [Ag] as principal constituent
  • H01L2224/29455 - Nickel [Ni] as principal constituent
  • H01L2224/81136 - involving guiding structures
  • H01L2224/83138 - the guiding structures being at least partially left in the finished device
  • H01L2224/8321 - using a reflow oven
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01025 - Manganese [Mn]
  • H01L2924/01029 - Copper [Cu]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01042 - Molybdenum [Mo]
  • H01L2924/01047 - Silver [Ag]
  • H01L2924/01049 - Indium [In]
  • H01L2924/0105 - Tin [Sn]
  • H01L2924/01057 - Lanthanum [La]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01078 - Platinum [Pt]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/014 - Solder alloys
  • H01L2924/09701 - Low temperature co-fired ceramic [LTCC]
  • H01L2924/351 - Thermal stress
  • H05K2201/0209 - Inorganic, non-metallic particles
  • H05K2201/0215 - Metallic fillers
  • H05K2201/10969 - Metallic case or integral heatsink of component electrically connected to a pad on PCB
  • H05K2201/2036 - Permanent spacer or stand-off in a printed circuit or printed circuit assembly
  • Y02P70/613 - involving the assembly of several electronic elements

• US Classifications

  • 228 - Metal fusion bonding
  • 257 - Active solid-state devices