Number | Name | Date | Kind |
---|---|---|---|
4506938 | Madden | Mar 1985 | |
4513353 | Bakermans et al. | Apr 1985 | |
4513355 | Schroeder et al. | Apr 1985 | |
4551746 | Gilbert et al. | Nov 1985 | |
4561006 | Currie | Dec 1985 | |
4608592 | Miyamoto | Aug 1986 | |
4648666 | Lovell | Mar 1987 | |
4655524 | Etzel | Apr 1987 | |
4676564 | Mitchell, Jr. | Jun 1987 | |
4692790 | Oyamada | Sep 1987 | |
4695870 | Patraw | Sep 1987 | |
4699593 | Grabbe et al. | Oct 1987 | |
4703984 | Mitchell, Jr. | Nov 1987 | |
4705917 | Gates, Jr. et al. | Nov 1987 | |
4733172 | Smolley | Mar 1988 | |
4750089 | Derryberry et al. | Jun 1988 | |
4760335 | Lindberg | Jul 1988 | |
4807019 | Tustaniwskyj | Feb 1989 | |
4860165 | Cassinelli | Aug 1989 | |
4910584 | Mizuo | Mar 1990 | |
4933808 | Horton et al. | Jun 1990 |
Number | Date | Country |
---|---|---|
0261013 | Mar 1988 | EPX |
57-85244 | May 1982 | JPX |
0197863 | Nov 1983 | JPX |
62-112354 | May 1987 | JPX |
63-250845 | Oct 1988 | JPX |
63-301552 | Dec 1988 | JPX |
1-25444 | Jan 1989 | JPX |
1-151252 | Jun 1989 | JPX |
Entry |
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European Patent Application, Publication Number 0150928-A2 Published 8/7/85 entitled, "A Compliant Interconnection Device and Assembly Method of Manufacture, and of Micro Interconnection Casting." |
Great Britain Patent Application No. GB 2,135,525A Published 8/30/84 entitled "Heat Dissipating Chip Carrier Substrates." |