Claims
- 1-34. (Canceled)
- 35. An optical sub-assembly (OSA) suitable for optical interconnection with optical fibers and electrical interconnection with a chip sub-assembly (CSA), the OSA comprising;
a ceramic block having a first face and a second face, the ceramic block being formed using one of low temperature co-fired ceramic (LTCC) and high temperature co-fired ceramic (HTCC); at least one photonic device formed on the first face of the ceramic block; and at least one electrical line configured to pass through internal portions of the ceramic block, wherein the electrical line electrically connects a photonic device to a chip sub-assembly (CSA).
- 36. The optical sub-assembly (OSA) of claim 35 wherein the at least one electrical line includes at least one of a signal connection and a ground connection.
- 37. The optical sub-assembly (OSA) of claim 36 wherein the at least one photonic device comprises a plurality of photonic devices;
wherein the at least one electrical line includes a plurality of ground connections and a plurality of signal connections wherein the ground and signal connections each pass through internal portions of the ceramic block.
- 38. The optical sub-assembly (OSA) of claim 37 wherein the plurality of ground connections is configured so that each ground connection electrically connects a photonic device to at least one ground.
- 39. The optical sub-assembly (OSA) of claim 38 wherein each at least one ground is shielded from other grounds by a metal shield layer.
- 40. The optical sub-assembly (OSA) of claim 38 wherein the at least one ground comprises a single ground plane.
- 41. The optical sub-assembly (OSA) of claim 38 wherein the at least one ground comprises a two ground planes.
- 42. The optical sub-assembly (OSA) of claim 41 wherein the two ground planes are shielded from each other by a shield plane.
- 43. An optical sub-assembly (OSA) suitable for optical interconnection with optical fibers and electrical interconnection with a chip sub-assembly (CSA), the OSA comprising:
a ceramic block having a first surface and a second surface, the ceramic block being formed using one of low temperature co-fired ceramic (LTCC) and high temperature co-fired ceramic (HTCC); a plurality of photonic device formed on the first surface of the ceramic block; and a plurality of electrical connections that pass internally through the ceramic block to electrically connect with the photonic devices on the first face of the block.
- 44. The OSA of claim 43, wherein said plurality of electrical connections are configured to pass internally through the ceramic block to electrically connect the photonic devices with CSA.
CROSS-REFERENCE TO RELATED PATENTS AND APPLICATIONS
[0001] This application is a continuation-in-part of U.S. patent application Ser. No. 09/568,558 (Attorney Docket No. NSC1P156), entitled “ARRAYABLE, SCALABLE AND STACKABLE MOLDED PACKAGE CONFIGURATION,” filed on May 9, 2000, and of U.S. patent application Ser. No. 10/165,553 (Attorney Docket No. NSC1P212), entitled “OPTICAL SUB-ASSEMBLY FOR OPTOTELECTRONIC MODULES,” filed on Jun. 6, 2002, which claims priority from U.S. Provisional Application No. 60/331,339, filed on Aug. 3, 2001, the content of each of which are hereby incorporated by reference.
[0002] This application is related to U.S. Pat. No. 6,364,542, entitled “DEVICE AND METHOD FOR PROVIDING A TRUE SEMICONDUCTOR DIE TO EXTERNAL FIBER OPTIC CABLE CONNECTION”, filed on May 9, 2000, to U.S. patent application Ser. No. 09/713,367, (Attorney Docket No. NSC1P180), entitled “MINIATURE OPTO-ELECTRIC TRANSCEIVER,” filed on Nov. 14, 2000, to U.S. patent application Ser. No. 09/922,358 (Attorney Docket No. NSC1P204), entitled “MINIATURE SEMICONDUCTOR PACKAGE FOR OPTO-ELECTRONIC DEVICES”, filed on Aug. 3, 2001, to U.S. patent application Ser. No. 09/947,210 (Atty. Docket No. NSC1P205), entitled “TECHNIQUES FOR JOINING AN OPTO-ELECTRONIC MODULE TO A SEMICONDUCTOR PACKAGE”, filed on Aug. 3, 2001, and to U.S. patent application Ser. No. 10/290,481, (Attorney Docket No. NSC1P247), entitled “TWO-LAYER ELECTRICAL SUBSTRATE FOR OPTICAL DEVICES”, filed on Nov. 6, 2002, the content of each of which are hereby incorporated by reference.
[0003] This application is also related to U.S. patent application Ser. No. 10/165/711 (Attorney Docket No. NSC1P212×1), entitled “CERAMIC OPTICAL SUB-ASSEMBLY FOR OPTO-ELECTRONIC MODULES” on Jun. 6, 2002, which is a continuation-in-part of U.S. patent application Ser. No. 10/165,553, the content of which is hereby incorporated by reference.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60331339 |
Aug 2001 |
US |
Continuations (1)
|
Number |
Date |
Country |
Parent |
10379474 |
Mar 2003 |
US |
Child |
10849338 |
May 2004 |
US |
Continuation in Parts (2)
|
Number |
Date |
Country |
Parent |
09568558 |
May 2000 |
US |
Child |
10849338 |
May 2004 |
US |
Parent |
10165553 |
Jun 2002 |
US |
Child |
10849338 |
May 2004 |
US |