Claims
- 1. A thermally conductive material for removing the heat dissipated by an integrated circuit, the thermally conductive material comprising a diamondoid.
- 2. The thermally conductive material of claim 1, wherein the diamondoid comprises a diamondoid-containing material.
- 3. The thermally conductive material of claim 1, wherein the diamondoid comprises a derivatized diamondoid.
- 4. The thermally conductive material of claim 1, wherein the diamondoid comprises an underivatized diamondoid.
- 5. The thermally conductive material of claim 1, wherein the diamondoid is a lower diamondoid.
- 6. The thermally conductive material of claim 1, wherein the diamondoid is a higher diamondoid.
- 7. The thermally conductive material of claim 6, wherein the diamondoid is selected from the group consisting of tetramantane, pentamantane, hexamantane, heptamantane, octamantane, nonamantane, decamantane, and undecamantane.
- 8. The thermally conductive material of claim 1, wherein the material is a film.
- 9. The thermally conductive material of claim 1, wherein the material is a fiber.
- 10. The thermally conductive material of claim 2, wherein the diamondoid-containing material is selected from the group consisting of a diamondoid-containing polymer, a diamondoid-containing sintered ceramic, a diamondoid ceramic composite, a CVD diamondoid film, and a self-assembled diamondoid film.
- 11. The thermally conductive material of claim 10, wherein the diamondoid content of the thermally conductive material ranges from about 1 to 100 percent by weight for the diamondoid-containing polymer, about 1 to 99.9 percent by weight for the diamondoid-containing sintered ceramic, about 1 to 100 percent by weight for the CVD diamondoid film, and about 1 to 99.99 percent by weight for the self-assembled diamondoid film.
- 12. The thermally conductive material of claim 1, wherein the thermal conductivity of the material is at least 200 W/m K.
- 13. The thermally conductive material of claim 1, wherein the thermal conductivity of the material is at least 500 W/m K.
- 14. The thermally conductive material of claim 1, wherein the thermal conductivity of the material is at least 1,000 W/m K.
- 15-60 (Canceled)
REFERENCE TO RELATED APPLICATIONS
[0001] The present application claims the benefit of U.S. Provisional Patent Application No. 60/262,842 filed Jan. 19, 2001. U.S. Provisional Patent Application No. 60/262,842 is hereby incorporated herein by reference in its entirety. The present application also hereby incorporates by reference in its entirety U.S. patent application Ser. No. 60/334,939, entitled “Polymerizable Higher Diamondoid Derivatives,” by Shenggao Liu, Jeremy E. Dahl, and Robert M. Carlson, filed Dec. 4, 2001, and also U.S. Provisional Patent Application Ser. No. 60/341,921, filed Dec. 18, 2001.
Divisions (1)
|
Number |
Date |
Country |
Parent |
10047044 |
Jan 2002 |
US |
Child |
10892037 |
Jul 2004 |
US |