Number | Date | Country | Kind |
---|---|---|---|
1-264165 | Oct 1989 | JPX |
This application is a continuation of application Ser. No. 07/592,492 filed Oct. 4, 1990 now abandoned.
Number | Name | Date | Kind |
---|---|---|---|
3495133 | Miller | Feb 1970 | |
3795845 | Cass et al. | Mar 1974 | |
4080512 | Ramet et al. | Mar 1978 | |
4746966 | Fitzgerald et al. | May 1988 | |
4831433 | Ogura | May 1989 | |
4839820 | Kinoshita et al. | Jun 1989 | |
4864381 | Seefeldt et al. | Sep 1989 | |
5017993 | Shibata | May 1991 | |
5021856 | Wheaton | Jun 1991 | |
5109265 | Utesch et al. | Apr 1992 |
Number | Date | Country |
---|---|---|
0136888 | Apr 1985 | EPX |
3134343A1 | Jun 1982 | DEX |
3223276A1 | Jan 1983 | DEX |
59-43536 | Mar 1984 | JPX |
63-289826 | May 1987 | JPX |
WO8504518 | Oct 1985 | WOX |
Entry |
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"Chip I/O Macros Growable and Placeable Within Cell Array", IBM Technical Disclosure Bulletin, vol. 30, No. 10, Mar., 1988, pp. 222-223. |
"Large Chip Substrate", IBM Technical Disclosure Bulletin, vol. 28, No. 3, Aug., 1985, p. 965. |
Mitsutaka Sato, "Plastic-Molded Semiconductor Device and its Manufacture", Patent Abstracts of Japan, E-832, Oct. 17, 1989, vol. 13, No. 459 (Corresponds to JP 1-179351). |
A. H. Mones et al., "Interconnecting and Packaging VLsI Chips", Solid-State Technology, Jan., 1984, pp. 119-122. |
Number | Date | Country | |
---|---|---|---|
Parent | 592492 | Oct 1990 |