SEMICONDUCTOR DEVICE

Abstract

A semiconductor device improved in IC card function is disclosed. An external connecting terminal for extended interface not conforming to ISO/IEC7816-3 is disposed on a first main surface of a card chip and in an area sandwiched in between two rows of external connecting terminals for interface conforming to ISO/IEC7816-3 which is for IC card function. With this layout, the memory card function and other electronic circuit functions can be incorporated into the card chip and hence it is possible to improve the function of the card chip.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an entire plan view of a first main surface of an IC card having a semiconductor device according to an embodiment of the present invention;

FIG. 2 is an entire plan view of a second main surface as a back side of the first main surface of the IC card shown in FIG. 1;

FIG. 3 is a side view of the IC card shown in FIGS. 1 and 2;

FIG. 4 is a perspective view of a first main surface side of a card body of the IC card shown in FIG. 1;

FIG. 5 is a perspective view of a second main surface side of the card body of the IC card shown in FIG. 1;

FIG. 6 is a sectional view taken on line X1-X1 in FIG. 5;

FIG. 7 is an exploded perspective view of the IC card body of the IC card shown in FIG. 1;

FIG. 8 is a plan view of a first main surface of a principal portion of the card body shown in FIG. 4;

FIG. 9 is a plan view of a second main surface of the principal portion of the card body shown in FIG. 8;

FIG. 10 is a plan view of the second main surface of the principal portion of the card body shown in FIG. 8;

FIG. 11 is a sectional view taken on line X2-X2 in FIGS. 9 and 10;

FIG. 12 is a sectional view taken on line X2-X2 in FIGS. 9 and 10, showing a modification of FIG. 11;

FIG. 13 is an enlarged plan view of external connecting terminals on the first main surface of the principal portion of the card body shown in FIG. 8;

FIG. 14 is a sectional view taken on line X3-X3 in FIG. 13;

FIG. 15 is a sectional view taken on line X3-X3 in FIG. 13, showing a modification of FIG. 14;

FIG. 16 is a sectional view taken on line X3-X3 in FIG. 13, showing another modification of FIG. 14;

FIG. 17 is a plan view of a second main surface of a wiring board, showing a modification of construction of semiconductor chips in the principal portion of the card body shown in FIG. 8;

FIG. 18 is a plan view of the second main surface of the wiring board, showing another modification of construction of semiconductor chips in the principal portion of the card body shown in FIG. 8;

FIG. 19 is a plan view of the second main surface of the wiring board, showing a further modification of construction of semiconductor chips in the principal portion of the card body shown in FIG. 8;

FIG. 20 is an entire plan view of the first main surface of the card body, showing an example of function of external connecting terminals in the card body shown in FIG. 4;

FIG. 21 is a circuit diagram for explaining a circuit operation performed in accordance with signals inputted to external connecting terminals for extended interface in the card body shown in FIG. 4;

FIG. 22 is a circuit diagram for explaining circuit operations performed in accordance with signals inputted to the external connecting terminals for extended interface in the card body shown in FIG. 4;

FIG. 23 is a diagram illustrating an example of an IC card microcomputer circuit formed in the card body shown in FIG. 4;

FIG. 24 is a diagram illustrating an example of an interface controller circuit formed in the card body shown in FIG. 4;

FIG. 25 is a diagram illustrating another example of an IC card microcomputer circuit formed in the card body shown in FIG. 4;

FIG. 26 is a diagram illustrating another example of an interface controller circuit formed in the card body shown in FIG. 4;

FIG. 27 is a perspective view on a first main surface side of a card body of an IC card having a semiconductor device according to another embodiment of the present invention;

FIG. 28 is an exploded perspective view of the card body shown in FIG. 27;

FIG. 29 is a perspective view on a first main surface side of a card body of an IC card having a semiconductor device according to a further embodiment of the present invention;

FIG. 30 is an exploded perspective view of the card body shown in FIG. 29;

FIG. 31 is a perspective view on a first main surface side of a card body of an IC card having a semiconductor device according to a still further embodiment of the present invention;

FIG. 32 is an exploded perspective view of the card body shown in FIG. 31;

FIG. 33 is a perspective view of a first main surface side of a card body as a semiconductor device according to a still further embodiment of the present invention;

FIG. 34 is a perspective view of a second main surface side of the card body shown in FIG. 33;

FIG. 35 is a sectional view taken on line X4-X4 in FIG. 34;

FIG. 36 is a plan view of a first main surface of a card body of an IC card having a semiconductor device according to a still further embodiment of the present invention;

FIG. 37 is an entire plan view of a first main surface of an IC card having a semiconductor device according to a still further embodiment of the present invention;

FIG. 38 is an entire plan view of a second main surface of the IC card shown in FIG. 37;

FIG. 39 is a side view of the IC card shown in FIGS. 37 and 38;

FIG. 40 is a perspective view of a first main surface side of a card body shown in FIGS. 37 and 38;

FIG. 41 is a perspective view of a second main surface side of the card body shown in FIG. 40;

FIG. 42 is an exploded perspective view of the card body shown in FIG. 40;

FIG. 43 is a perspective view of a first main surface side of a card body of an IC card having a semiconductor device according to a still further embodiment of the present invention;

FIG. 44 is a perspective view of a second main surface side of the card body shown in FIG. 43;

FIG. 45 is a sectional view taken on line X5-X5 in FIG. 44;

FIG. 46 is an exploded perspective view of the card body shown in FIG. 43;

FIG. 47 is a perspective view of a first main surface side of a card body according to a still further embodiment of the present invention;

FIG. 48 is a perspective view of a second main surface side of the card body shown in FIG. 47;

FIG. 49 is an entire plan view of a first main surface of an IC card having a semiconductor device according to a still further embodiment of the present invention;

FIG. 50 is an entire plan view of a second main surface of the IC card shown in FIG. 49;

FIG. 51 is a side view of the IC card shown in FIGS. 49 and 50;

FIG. 52 is a perspective view of a first main surface side of a card body shown in FIGS. 49 and 50;

FIG. 53 is a perspective view of a second main surface side of the cad body shown in FIGS. 49 and 50;

FIG. 54 is a sectional view taken on line X6-X6 in FIG. 53;

FIG. 55 is an exploded perspective view of the card body shown in FIGS. 49 and 50;

FIG. 56 is a plan view of a first main surface of a main chip portion of the card body shown in FIG. 52;

FIG. 57 is a plan view of a second main surface of the main chip portion shown in FIG. 56;

FIG. 58 is a plan view of the second main surface of the main chip portion shown in FIG. 56;

FIG. 59 is a sectional view taken on line X7-X7 in FIGS. 57 and 58;

FIG. 60 is a sectional view taken on line X7-X7 in FIGS. 57 and 58, showing a modification of FIG. 59;

FIG. 61 is an entire plan view of a first main surface of the card body, showing an example of function of external connecting terminals in the card body shown in FIG. 52;

FIG. 62 is an entire plan view of the first main surface of the card body, showing another example of function of the external connecting terminals in the card body shown in FIG. 52;

FIG. 63 is a diagram illustrating an example of use of the card body shown in FIG. 62;

FIG. 64 is a diagram illustrating another example of use of the card body shown in FIG. 62;

FIG. 65 is a perspective view of a first main surface side of a card body of an IC card having a semiconductor device according to a still further embodiment of the present invention;

FIG. 66 is an exploded perspective view of the card body shown in FIG. 65;

FIG. 67 is a perspective view of a first main surface side of a card body of an IC card having a semiconductor device according to a still further embodiment of the present invention;

FIG. 68 is an exploded perspective view of the card body shown in FIG. 67;

FIG. 69 is a perspective view of a first main surface side of a card body of an IC card having a semiconductor device according to a still further embodiment of the present invention;

FIG. 70 is an exploded perspective view of the card body shown in FIG. 69;

FIG. 71 is a perspective view of a first main surface side of a card body according to a still further embodiment of the present invention;

FIG. 72 is a perspective view on a second main surface side of the card body shown in FIG. 71;

FIG. 73 is a sectional view taken on line X8-X8 in FIG. 72;

FIG. 74 is an entire plan view of a first main surface of an IC card having a semiconductor device according to a still further embodiment of the present invention;

FIG. 75 is an entire plan view of a second main surface of the IC card shown in FIG. 74;

FIG. 76 is a side view of the IC card shown in FIG. 75;

FIG. 77 is a perspective view of a first main surface side of a card body of the IC card shown in FIGS. 74 and 75;

FIG. 78 is a perspective view of a second main surface side of the card body shown in FIG. 77;

FIG. 79 is an exploded perspective view of the card body shown in FIG. 77;

FIG. 80 is a perspective view of a first main surface side of a card body of an IC card having a semiconductor device according to a still further embodiment of the present invention;

FIG. 81 is a perspective view of a second main surface side of the card body shown in FIG. 80;

FIG. 82 is a sectional view taken on line X9-X9 in FIG. 81;

FIG. 83 is a plan view of a first main surface of a main chip portion of the card body shown in FIG. 80;

FIG. 84 is a plan view of a second main surface of the main chip portion shown in FIG. 83;

FIG. 85 is a plan view of the second main surface of the main chip portion shown in FIG. 83;

FIG. 86 is a sectional view taken on line X10-X10 in FIGS. 84 and 85;

FIG. 87 is a sectional view taken on line X10-X10 in FIGS. 84 and 85, showing a modification of FIG. 86;

FIG. 88 is an enlarged plan view of external connecting terminals on a wiring board of the main chip portion shown in FIG. 83;

FIG. 89 is a sectional view taken on line X11-X11 in FIG. 88;

FIG. 90 is a sectional view taken on line X11-X11 in FIG. 88, showing a modification of FIG. 89;

FIG. 91 is a sectional view taken on line X11-X11 in FIG. 88, showing another modification of FIG. 89;

FIG. 92 is an entire plan view of a first main surface of a wiring board, illustrating a layout area of external connecting terminals for extended interface in the main chip portion shown in FIG. 83;

FIG. 93 is an entire plan view of the first main surface of the wiring board, illustrating a layout area of wiring in the main chip portion shown in FIG. 83;

FIG. 94 is an entire plan view of the first main surface of the wiring board, showing concrete examples of dimensions related to the external connecting terminals in the main chip portion shown in FIG. 83;

FIG. 95 is a sectional view of a principal portion of the wiring board where a through hole extending through both upper and lower surfaces of an external connecting terminal is formed in a connection area of the external connecting terminal in the IC card according to the present invention;

FIG. 96 is an enlarged plan view of a principal portion of an external connecting terminal on the wiring board in the main chip portion shown in FIG. 83;

FIG. 97 is a plan view of a principal portion of the wiring board wherein solder resist partially covers the outer periphery of an upper surface of an external connecting terminal;

FIG. 98 is an enlarged sectional view taken on line X12-X12 in FIG. 97;

FIG. 99 is an enlarged plan view of a principal portion of an external connecting terminal on the wiring board in the main chip portion shown in FIG. 83;

FIG. 100 is an entire plan view of a first main surface of the card body, showing an example of function of external connecting terminals in the card body shown in FIG. 80;

FIG. 101 is an entire plan view of the first main surface of the card body, showing another example of function of the external connecting terminals in the card body shown in FIG. 80;

FIG. 102 is a perspective view of a first main surface side of a card body of an IC card having a semiconductor device according to a still further embodiment of the present invention;

FIG. 103 is a perspective view of a second main surface side of the card body shown in FIG. 102;

FIG. 104 is a sectional view taken on line X13-X13 in FIG. 103;

FIG. 105 is a perspective view of a first main surface side of a card body according to a still further embodiment of the present invention;

FIG. 106 is a perspective view of a second main surface side of the card body shown in FIG. 105;

FIG. 107 is a sectional view taken on line X14-X14 in FIG. 106;

FIG. 108 is a perspective view of a first main surface side of a card body of an IC card having a semiconductor device according to a still further embodiment of the present invention; and

FIG. 109 is a perspective view of a second main surface side of the card body shown in FIG. 108.

Claims

1. A semiconductor device comprising a plurality of terminals formed over a first main surface of a card body, the card body incorporating a card circuit having an IC card circuit and a memory card circuit, the plural terminals comprising a plurality of ISO7816 terminals connected electrically to the card circuit and a non-ISO7816 terminal connected electrically to the card circuit,the non-ISO7816 terminal being disposed in an area sandwiched in between rows of the ISO7816 terminals.

2. A semiconductor device according to claim 1, wherein the card body comprises:a substrate having the first main surface and a second main surface positioned on a back side of the first main surface;a semiconductor chip mounted over the second main surface of the substrate and forming the card circuit; anda sealing body forming a part of the outline of the card body and sealing the semiconductor chip.

3. A semiconductor device according to claim 2, wherein the sealing body is formed by a cap.

4. A semiconductor device according to claim 2, wherein the sealing body is formed by a molding resin.

5. A semiconductor device according to claim 2, wherein the semiconductor chip comprises a first semiconductor chip formed with the IC card circuit, a second semiconductor chip formed with a memory circuit of the memory card circuit, and a third semiconductor chip formed with a control circuit for controlling the operation of the memory circuit.

6. A semiconductor device according to claim 1, wherein the non-ISO7816 terminal is a terminal for a signal for switching over between an independent operation and an interlocked operation of the memory card circuit and the IC card circuit.

7. A semiconductor device according to claim 1, wherein the plurality of non-ISO7816 terminals are arranged between the rows of the ISO7816 terminals.

8. A semiconductor device according to claim 7, wherein a terminal for the memory card circuit is included among the plural non-ISO7816 terminals.

9. A semiconductor device according to claim 7, wherein a terminal for USB is included among the plural non-ISO7816 terminals.

10. A semiconductor device according to claim 1, wherein through holes or wiring lines connected electrically to the plural terminals, or both the through holes and the wiring lines, are formed outside the plural terminals respectively and inside the layout area of the plural ISO7816 terminals.

11. A semiconductor device according to claim 10, wherein the card body includes a substrate having the first main surface and a second main surface positioned on a back side of the first main surface, and the through holes are through type through holes.

12. A semiconductor device according to claim 1, wherein the card body is fixed in a supported state within a card frame.

13. A semiconductor device comprising a plurality of terminals formed over a first main surface of a card body, the card body incorporating a card circuit having an IC card circuit and a memory card circuit, the plural terminals comprising:a plurality of ISO7816 terminals connected electrically to the card circuit; anda non-ISO7816 terminal connected electrically to the card circuit,the non-ISO7816 terminal being a terminal for a signal for switching over between an independent operation and an interlocked operation of the memory card circuit and the IC card circuit,the non-ISO7816 terminal being disposed in an area sandwiched in between rows of the ISO7816 terminals.

14. A semiconductor device according to claim 13, wherein the card body is fixed in a supported state within a card frame.

15. A semiconductor device comprising a plurality of terminals formed over a first main surface of a card body, the card body incorporating a card circuit having an IC card circuit and a memory card circuit, the plural terminals comprising:a plurality of ISO7816 terminals connected electrically to the card circuit; anda non-ISO7816 terminal connected electrically to the card circuit,the plurality of non-ISO7816 terminals being disposed between rows of the ISO7816 terminals.

16. A semiconductor device according to claim 15, wherein the card body is fixed in a supported state within a card frame.

17. A semiconductor device comprising a plurality of terminals formed over a first main surface of a card body, the card body incorporating a card circuit having an IC card circuit and a memory card circuit, the plural terminals comprising:a plurality of ISO7816 terminals connected electrically to the card circuit; anda non-ISO7816 terminal connected electrically to the card circuit,the non-ISO7816 terminal being disposed in an area sandwiched in between rows of the ISO7816 terminals, through holes or wiring lines connected electrically to the plural terminals, or both the through holes and the wiring lines, being disposed outside the plural terminals respectively or inside the layout area of the plural ISO7816 terminals.

18. A semiconductor device according to claim 17, wherein the card body includes a substrate having the first main surface and a second main surface as a back side of the first main surface, and the through holes are through type through holes.

19. A semiconductor device according to claim 17, wherein the card body is fixed in a supported state within a card frame.

20. A semiconductor device comprising a plurality of terminals formed over a first main surface of a card body, the card body incorporating a card circuit having an IC card circuit and a memory card circuit, the plural terminals including a plurality of ISO7816 terminals connected electrically to the card circuit,through holes or wiring lines connected electrically to the plural ISO7816 terminals, or both the through holes and the wiring lines, being disposed outside the plural ISO7816 terminals respectively and inside the layout area of the plural ISO7816 terminals.

21. A semiconductor device according to claim 20, wherein the card body includes a substrate having the first main surface and a second main surface positioned on a backside of the first main surface, and the through holes are through type through holes.