Number | Date | Country | Kind |
---|---|---|---|
8-036353 | Feb 1996 | JPX | |
8-344025 | Dec 1996 | JPX |
Number | Name | Date | Kind |
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5388459 | Inoue et al. | Feb 1995 | |
5503016 | Koen | Apr 1996 | |
5514899 | Lau et al. | May 1996 | |
5554806 | Mizuno et al. | Sep 1996 | |
5639696 | Liang et al. | Jun 1997 | |
5724728 | Bond et al. | Mar 1998 |
Number | Date | Country |
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631 461 | Dec 1994 | EPX |
62-150837 | Jul 1987 | JPX |
5-13667 | Jan 1993 | JPX |
5-218134 | Aug 1993 | JPX |
Entry |
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The Engineering Society for Advancing Mobility Land Sea Air and Space International, At International Congress and Expositio-Detroit, Michigan, Feb. 27 -Mar. 2, 1995 "New Accelerometer Based on Innovative Packaging and Circuit Design" D.W. de Bruin et al. |
Electronics Mounting Technology (vol. 10 No. 8, 1994, 8) "Bump Mounting Technology for Passive Chip". |
Journal of Metallurgical Society of Japan vol. 23, No. 12, 1984 "Microsolder Bonding Technology for IC,LSI". |