METHOD FOR MOUNTING CHIP COMPONENT AND CIRCUIT BOARD

Abstract

A method for mounting a chip component includes the steps of: flattening a solder deposit adhering onto a land terminal of a circuit board; forming grooves on the solder deposit simultaneously with or after flattening the solder deposit; coating the solder deposit with a flux; and placing a chip component on the solder deposit with the flux interposed therebetween.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view showing a circuit board to be mounted with a chip component by a chip component mounting method according to one embodiment of the present invention;

FIG. 2 is a sectional view schematically showing a step of the chip component mounting method according to one embodiment of the present invention;

FIG. 3 is a sectional view schematically showing a step after the step of FIG. 2;

FIG. 4 is a sectional view schematically showing a step after the step of FIG. 3;

FIG. 5 is a sectional view showing the circuit board after the step of FIG. 4;

FIG. 6 is a plan view of the circuit board of FIG. 5, in which a solder deposit is seen in a thickness direction;

FIG. 7 is a plan view of the circuit board of FIG. 5, in which a solder deposit is patterned according to another embodiment of the present invention;

FIG. 8 is a sectional view schematically showing a step after the step of FIG. 4;

FIG. 9 is a sectional view schematically showing a step after the step of FIG. 8; and

FIG. 10 is a sectional view showing a state where a chip component is soldered to the circuit board.

Claims

1. A method for mounting a chip component comprising the steps of: flattening a solder deposit adhering onto a land terminal of a circuit board;forming grooves on said solder deposit simultaneously with or after flattening said solder deposit;coating said solder deposit with a flux; andplacing a chip component on said solder deposit with said flux interposed therebetween.

2. The method of claim 1, wherein said grooves extend continuously on said solder deposit to reach an edge of said solder deposit.

3. The method of claim 1, wherein said grooves have a larger depth in a peripheral portion of a given chip component mounting area on said circuit board than in a central portion of said chip component mounting area surrounded by said peripheral portion.

4. The method of claim 1, wherein said grooves have a larger number density in a peripheral portion of a given chip component mounting area on said circuit board than in a central portion of said chip component mounting area surrounded by said peripheral portion.

5. The method of claim 1, wherein said chip component comprises a ceramic substrate and terminal electrodes formed on side faces of said ceramic substrate extending parallel to a longitudinal direction of said ceramic substrate.

6. A circuit board comprising: a substrate;a land terminal formed on said substrate; anda solder deposit adhering onto said land terminal, said solder deposit having grooves formed thereon.

7. The circuit board of claim 6, wherein said grooves extend continuously on said solder deposit to reach an edge of said solder deposit.

8. The circuit board of claim 6, wherein said grooves have a larger depth in a peripheral portion of a given chip component mounting area on said circuit board than in a central portion of said chip component mounting area surrounded by said peripheral portion.

9. The circuit board of claim 6, wherein said grooves have a larger number density in a peripheral portion of a given chip component mounting area on said circuit board than in a central portion of said chip component mounting area surrounded by said peripheral portion.