Claims
- 1. A method comprising:
depositing a dielectric layer on a circuitized layer having a conductive region; forming an aperture in the dielectric layer over the conductive region; inserting a conductive body into the aperture, wherein the conductive body comprises a main region and a depletion region, and wherein the depletion region contacts the conductive region; and forming an intermetallic region from the depletion region.
- 2. The method of claim 1 wherein the depletion region comprises tin, the main region comprises copper, and the intermetallic region comprises Cu3Sn.
- 3. The method of claim 1 wherein the circuitized layer is a first circuitized layer, and the conductive body is disposed on a second circuitized layer.
- 4. The method of claim 3 further comprising laminating the first circuitized layer and the second circuitized layer together.
- 5. The method of claim 1 wherein the intermetallic region surrounds the sides and an end of the main region.
- 6. The method of claim 1 wherein forming an aperture comprises laser drilling.
- 7. The method of claim 1 wherein said inserting a conductive body into the aperture produces a gap between a wall of the aperture and the conductive body.
- 8. The method of claim 7 additionally comprising filling the gap with a dielectric material.
- 9. The method of claim 7 additionally comprising laminating the dielectric layer to cause said gap to fill.
- 10. A conductive article comprising:
a first circuitized layer having a dielectric layer and a first conductive region; a second circuitized layer having a dielectric layer and a second conductive region; and a via structure disposed between the first and second conductive regions, wherein the via structure comprises a main region and an intermetallic region disposed around the sides and around one end of the main region.
Parent Case Info
[0001] This application is a continuation-in-part application of copending application having Ser. No. 09/757,364, filed Jan. b 8, 2001.
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
09757364 |
Jan 2001 |
US |
Child |
09962783 |
Sep 2001 |
US |