Claims
- 1. A method for bonding conductive structures comprising:
compressing a thin layer of metal between one end of a conductive post and a conducting structure; transforming the thin layer of metal into a bonding layer having a melting temperature higher than the melting temperature of the thin layer of metal; and bonding the conductive post and the conducting structure together via the bonding layer.
- 2. The method of claim 1 further comprising:
depositing a dielectric material around the conductive post.
- 3. The method of claim 1 wherein the thin layer of metal comprises a material selected from the group consisting of In, Sn/Pb eutectic solder, Sn, Bi, and mixtures thereof.
- 4. An electrically conductive article comprising:
a conductive post; a conductive structure; and a thin bonding layer having a bonding-layer melting temperature and disposed between the conductive structure and the conductive post and having been formed from a bonding layer precursor having a precursor melting temperature substantially lower than the bonding-layer melting temperature.
- 5. A method for producing an assembly of substrates comprising:
disposing a thin layer of metal on a conducting structure coupled to a first substantially planar substrate; dispensing a liquid polymeric material between the conducting structure and a second substantially planar substrate supporting a conductive post, the liquid polymeric material being disposed inwardly from the edges of the first and the second substrate; pressing the liquid polymeric material between the first and the second substrates so that the liquid polymeric material flows towards the edges of the first substrate and the second substrate; compressing the thin layer of metal between an end of the conductive post and the conducting structure; transforming the thin layer of metal into a bonding layer having a melting temperature higher than the melting temperature of the thin layer of metal; and bonding the conductive post and the conducting structure together via the bonding layer.
- 6. The method of claim 5 additionally comprising curing the liquid polymeric material.
- 7. The method of claim 6 wherein said liquid polymeric material comprises a polymer fluxing agent.
- 8. The method of claim 5 wherein said liquid polymeric material comprises a polymer fluxing agent.
- 9. The method of claim 6 wherein said polymer fluxing agent comprises a beta phenylacid and/or a beta phenylhydroxyacid.
- 10. The method of claim 8 wherein said polymer fluxing agent comprises a beta phenylacid and/or a beta phenylhydroxyacid.
- 11. The method of claim 9 wherein said beta phenylacid is selected from the group consisting of beta phenylacetic acid, beta phenylacrylic acid, beta phenylcrotonic acid, and mixtures thereof.
- 12. The method of claim 10 wherein said beta phenylacid is selected from the group consisting of beta phenylacetic acid, beta phenylacrylic acid, beta phenylcrotonic acid, and mixtures thereof.
- 13. The method of claim 9 wherein said beta phenylacid comprises beta phenylacrylic acid and said beta phenylhydroxyacid comprises beta phenylhydroxyacrylic acid.
- 14. The method of claim 10 wherein said beta phenylacid comprises beta phenylacrylic acid and said beta phenylhydroxyacid comprises beta phenylhydroxyacrylic acid.
- 15. The method of claim 5 wherein said liquid polymeric material comprises from about 15% by weight to about 70% by weight of a polymeric resin, from about 15% by weight to about 70% by weight of a curing agent, and from about 0.10% by weight to about 20% by weight of a fluxing agent.
- 16. A method for producing an assembly of substrates comprising:
disposing a thin layer of metal on an end of a conductive post attached to a first substantially planar substrate; dispensing a liquid polymeric material between a conducting structure on a second substantially planar substrate and the first substantially planar substrate, the liquid polymeric material being disposed inwardly from the edges of the first and the second substrates; pressing the liquid polymeric material between the first and the second substrates so that the liquid polymeric material flows towards the edges of the first substrate and the second substrate; compressing the thin layer of metal between the end of the conductive post and the conducting structure; transforming the thin layer of metal into a bonding layer having a melting temperature higher than the melting temperature of the thin layer of metal; and bonding the conductive post and the conducting structure together via the bonding layer.
- 17. The method of claim 16 additionally comprising curing the liquid polymeric material.
- 18. The method of claim 16 wherein said liquid polymeric material comprises a polymer fluxing agent.
Parent Case Info
[0001] This application is a continuation-in-part application of copending applications having Ser. No. 09/757,364, filed Jan. 8, 2001, and Ser. No. 09/962,783, filed Sep. 24, 2001. Benefit of all earlier filing dates is claimed for all common subject matter.
Continuation in Parts (2)
|
Number |
Date |
Country |
Parent |
09757364 |
Jan 2001 |
US |
Child |
10066485 |
Feb 2002 |
US |
Parent |
09962783 |
Sep 2001 |
US |
Child |
10066485 |
Feb 2002 |
US |