Claims
- 1. A semiconductor plastic package structured by fixing a semiconductor chip on one surface of a printed circuit board, connecting a semiconductor circuit conductor to a signal propagation circuit conductor formed on a printed circuit board surface in the vicinity thereof by wire bonding, at least connecting the signal propagation circuit conductor on the printed circuit board surface to another signal propagation circuit conductor formed on another surface of the printed circuit board or a connecting conductor pad of a solder ball with a through-hole conductor, and encapsulating the semiconductor chip with a resin,the printed circuit board having a metal sheet of nearly a same size as the printed circuit board and nearly in a center in a thickness direction of the printed circuit board, the metal sheet being insulated from front and reverse circuit conductors with a heat-resistant resin composition, the metal sheet being provided with at least one clearance hole having a diameter greater than a diameter of a through hole, the through hole being provided in the at least one clearance hole, and the through-hole being insulated from the metal sheet with resin composition, at least one additional through-hole being connected to the metal sheet, one surface of the metal sheet being provided with at least one protrusion portion which is of a same size as the semiconductor chip and exposed on a surface, the semiconductor chip being fixed on the at least one protrusion portion.
- 2. A semiconductor plastic package according to claim 1, wherein the at least one protrusion portion has a diameter or a side length that is 40 to 90% of a the diameter or a side length of the semiconductor chip.
- 3. A semiconductor plastic package according to claim 2, wherein a heat-conductive adhesive bonds the semiconductor chip, and a through-hole conductor located below the semiconductor chip is isolated from the heat-conductive adhesive with a heat-curable resist or a photo-selective thermosetting resist.
- 4. A semiconductor plastic package according to claim 1, wherein the at least one clearance hole has the form of a slit having a width greater than a diameter of the through-hole.
- 5. A semiconductor plastic package according to claim 1, wherein the signal propagation circuit conductor on the printed circuit board surface is connected to the other signal propagation circuit conductor on the other surface or the connecting conductor pad of the solder ball with the through-hole conductor through a blind via conduction hole formed in the side of the printed circuit board surface.
- 6. A semiconductor plastic package according to claim 5, wherein the other signal propagation circuit conductor and the signal propagation circuit conductor each have at least three layers.
- 7. A semiconductor plastic package according to claim 1, wherein the metal sheet and metal for circuits of the semiconductor plastic package are an alloy having a copper content of at least 95%.
- 8. A semiconductor plastic package according to claim 1, wherein the heat-resistant resin composition is a thermosetting resin composition containing a polyfunctional cyanate ester or a prepolymer of the polyfunctional cyanate ester.
Priority Claims (17)
Number |
Date |
Country |
Kind |
9-340129 |
Dec 1997 |
JP |
|
10-975 |
Jan 1998 |
JP |
|
10-3984 |
Jan 1998 |
JP |
|
10-4835 |
Jan 1998 |
JP |
|
10-4836 |
Jan 1998 |
JP |
|
10-9567 |
Jan 1998 |
JP |
|
10-9568 |
Jan 1998 |
JP |
|
10-11528 |
Jan 1998 |
JP |
|
10-15893 |
Jan 1998 |
JP |
|
10-17045 |
Jan 1998 |
JP |
|
10-34232 |
Jan 1998 |
JP |
|
10-34233 |
Jan 1998 |
JP |
|
10-34234 |
Jan 1998 |
JP |
|
10-34235 |
Jan 1998 |
JP |
|
10-34236 |
Jan 1998 |
JP |
|
10-34238 |
Jan 1998 |
JP |
|
10-38917 |
Feb 1998 |
JP |
|
Parent Case Info
This application is a Divisional of Ser. No. 09/207,115, filed Dec. 8, 1998 U.S. Pat. No. 6,376,908.
US Referenced Citations (7)
Number |
Name |
Date |
Kind |
4682270 |
Whitehead et al. |
Jul 1987 |
A |
5319244 |
Papathomas et al. |
Jun 1994 |
A |
5397917 |
Ommen et al. |
Mar 1995 |
A |
5642261 |
Bond et al. |
Jun 1997 |
A |
5710459 |
Teng et al. |
Jan 1998 |
A |
6097089 |
Gaku et al. |
Aug 2000 |
A |
6376908 |
Gaku et al. |
Apr 2002 |
B1 |
Foreign Referenced Citations (2)
Number |
Date |
Country |
4443424 |
Jun 1995 |
DE |
0692823 |
Jan 1996 |
EP |
Non-Patent Literature Citations (1)
Entry |
Patent Abstracts of Japan, vol. 017, No. 310 (E-1380), Jun. 14, 1993 and JP 05029502A (NEC IC Microcomput Syst LTD), Feb. 5, 1993. |