3480843

Information

• Patent Grant
• 3480843

• References
• Source

• Patent Number

  3,480,843

• Date Filed

  Not available

• Date Issued

  Tuesday, November 25, 1969
  56 years ago

• CPC

  • H01L24/05 - of an individual bonding area
  • H01L23/488 - consisting of soldered or bonded constructions
  • H01L24/48 - of an individual wire connector
  • H01L27/2463 - Arrangements comprising multiple bistable or multistable switching components of the same type on a plane parallel to the substrate
  • H01L29/00 - Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
  • H01L45/10 - based on bulk electronic defects
  • H01L45/1233 - adapted for essentially vertical current flow
  • H01L45/1253 - Electrodes
  • H01L45/148 - Other compounds of groups 13-15
  • H01L45/1625 - by physical vapor deposition
  • H03K3/313 - by the use, as active elements, of semiconductor devices with two electrodes, one or two potential-jump barriers, and exhibiting a negative resistance characteristic
  • H03K17/74 - using diodes
  • H01L24/45 - of an individual wire connector
  • H01L24/49 - of a plurality of wire connectors
  • H01L2224/04042 - Bonding areas specifically adapted for wire connectors
  • H01L2224/05548 - Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
  • H01L2224/05556 - in side view
  • H01L2224/451 - with a principal constituent of the material being a metal or a metalloid
  • H01L2224/45101 - the principal constituent melting at a temperature of less than 400°C
  • H01L2224/45109 - Indium (In) as principal constituent
  • H01L2224/45124 - Aluminium (Al) as principal constituent
  • H01L2224/45144 - Gold (Au) as principal constituent
  • H01L2224/45169 - Platinum (Pt) as principal constituent
  • H01L2224/45184 - Tungsten (W) as principal constituent
  • H01L2224/48463 - the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
  • H01L2224/48599 - Principal constituent of the connecting portion of the wire connector being Gold (Au)
  • H01L2224/48699 - Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
  • H01L2224/4918 - being disposed on at least two different sides of the body
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01014 - Silicon [Si]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01042 - Molybdenum [Mo]
  • H01L2924/01049 - Indium [In]
  • H01L2924/01052 - Tellurium [Te]
  • H01L2924/01073 - Tantalum [Ta]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01078 - Platinum [Pt]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/014 - Solder alloys
  • H01L2924/3025 - Electromagnetic shielding
  • Y10S438/90 - Bulk effect device making

• US Classifications

  • 257 - Active solid-state devices
  • 148 - Metal treatment
  • 327 - Miscellaneous active electrical nonlinear devices, circuits, and systems
  • 365 - Static information storage and retrieval
  • 438 - Semiconductor device manufacturing: process