Claims
- 1. A semiconductor device comprising:
- a LSI chip provided with semiconductor elements on one surface thereof;
- a non-conductive carrier for mounting said LSI chip in a space within the carrier;
- a cover for hermetically enclosing said LSI chip within the carrier, said cover being rigidly connected to the carrier by a sealing material; and
- a shield plate having such a high purity that any radioactive rays emanating therefrom do not cause soft error, and being arranged in the space between said LSI chip and said carrier, so that said shield plate confronts said one surface of said LSI chip and supports said LSI chip, the surface area of said shield plate being larger than the surface area of said one surface of said LSI chip.
- 2. A semiconductor device according to claim 1, wherein said shield plate is provided with conductor leads on a surface confronting said semiconductor elements.
- 3. A semiconductor device according to claim 2, wherein said LSI chip is supported by said shield plate via said conductor leads and by pads formed on the surface of the LSI chip confronting said shield plate.
- 4. A semiconductor device according to claim 1, wherein said shield plate includes a lug along the periphery thereof, so that the radioactive rays emitted laterally from an inner wall of said carrier can be shielded by said lug.
- 5. A semiconductor device according to claim 1, 2, 3 or 4 wherein said shield plate is made of a high purity silicon.
- 6. A semiconductor device according to claim 1, 2, 3 or 4 wherein said shield plate is made of a high purity metal.
- 7. A semiconductor device according to claim 1, 2, 3 or 4 wherein said semiconductor elements comprise memory cells which store information by the existence or non existence of electrons or holes in the memory cells.
- 8. A semiconductor device according to claim 1, wherein said shield plate consists of high purity silicon having a purity identical to that of semiconductor material.
- 9. A semiconductor device according to claim 1, wherein an insulating material film is formed on the inner surface of said shield plate.
Priority Claims (1)
Number |
Date |
Country |
Kind |
54-71900 |
Jun 1979 |
JPX |
|
Parent Case Info
This is a continuation of Ser. No. 157,851, filed June 9, 1980, now abandoned.
US Referenced Citations (10)
Foreign Referenced Citations (2)
Number |
Date |
Country |
950592 |
Feb 1964 |
GBX |
1204805 |
Sep 1970 |
GBX |
Non-Patent Literature Citations (2)
Entry |
Technical Notes; Radiation Shielding of Electronic Components; by Schenk et al, Jun. 11, 1975. |
Packaging; MOS/LSI Plastic Package for 20 Cents, Electronics, Dec. 6, 1971, p. 40. |
Continuations (1)
|
Number |
Date |
Country |
Parent |
157851 |
Jun 1980 |
|