Number | Name | Date | Kind |
---|---|---|---|
3105869 | Branch et al. | Oct 1963 | |
3748479 | Lehovec | Jul 1973 | |
3769091 | Leinkram et al. | Oct 1973 | |
3904933 | Davis | Aug 1975 | |
4208698 | Narasimhan | Jun 1980 | |
4266282 | Henle et al. | May 1981 | |
4296456 | Reid | Oct 1981 | |
4351706 | Chappell et al. | Sep 1982 | |
4417392 | Ibrahim | Nov 1983 | |
4426689 | Henle et al. | Jan 1984 | |
4437235 | McIver | Mar 1984 | |
4451845 | Philofsky | May 1984 | |
4500905 | Shibata | Feb 1985 | |
4525921 | Carson et al. | Jul 1985 | |
4528530 | Ketchen | Jul 1985 | |
4617160 | Belanger et al. | Oct 1986 | |
4646128 | Carson et al. | Feb 1987 | |
4706166 | Go | Nov 1986 | |
4764846 | Go | Aug 1988 | |
4897708 | Clements | Jan 1990 | |
4956746 | Gates, Jr. et al. | Sep 1990 | |
4959749 | Dzarnoski, Jr. et al. | Sep 1990 | |
4984064 | Teshio et al. | Jan 1991 | |
4992908 | Solomon | Feb 1991 | |
5019943 | Fassbender et al. | May 1991 | |
5019946 | Eichelberger et al. | May 1991 | |
5092782 | Beaman | Mar 1992 | |
5103247 | Sugano et al. | Apr 1992 |
Number | Date | Country |
---|---|---|
0314437 | May 1989 | EPX |
55-115339 | Sep 1980 | JPX |
57-31166 | Feb 1982 | JPX |
59-127856 | Jul 1984 | JPX |
63-255974 | Oct 1988 | JPX |
3-148842 | Jun 1991 | JPX |
WO8502060 | May 1985 | WOX |
Entry |
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"Pursuing 3-D Packages" by M. F. Suer, Elec. Eng. Times, pp. 66, Jan. 21, 1991. |
"3-D Interconnection for Ultra-Dense Multichip Packages", C. Val and T. Lemoine (Thomson CSF), IEEE Trans. CHMFT, 13, Dec. 1990. |
J. B. Gillett, "Inexpensive Chip Package", vol. 33, No. 1A, Jun. 1990, IBM Technical Disclosure Bulletin, pp. 272-273. |
IBM TDB, vol. 19, Jun. 1976, p. 372, "Fabrication of Multiprobe Miniature Electrical Connector", W. Anacker, E. Bassous et al. |
IBM TDB, vol. 18, Mar. 1976, "Solder Bonding of Silicon Chips with Through Holes", L. Kuhn and R. Lane. |
IBM TDB, vol. 20, Apr. 1978, "Vertical Chip Packaging", R. Henle. |
IBM TDB, vol. 21, Dec. 1978, "Edge-Connected Chip Carrier", A. Johnson, IBM. |
IBM TDB, vol. 14(9), 2561 (1972) "Bubble Domain Three-Dimensional Magneto-Optic Memory", H. Chang, IBM. |