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Micro-structural systems; Auxiliary parts of micro-structural devices or systems
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B81B7/00
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Parent Industries
B
PERFORMING OPERATIONS TRANSPORTING
B81
Micro-structural technology
B81B
MICRO-STRUCTURAL DEVICES OR SYSTEMS
Current Industry
B81B7/00
Micro-structural systems; Auxiliary parts of micro-structural devices or systems
Sub Industries
B81B7/0003
MEMS mechanisms for assembling automatically hinged components, self-assembly devices
B81B7/0006
Interconnects
B81B7/0009
Structural features, others than packages, for protecting a device against environmental influences
B81B7/0012
Protection against reverse engineering, unauthorised use, use in unintended manner, wrong insertion or pin assignment
B81B7/0016
Protection against shocks or vibrations
B81B7/0019
Protection against thermal alteration or destruction
B81B7/0022
Protection against electrostatic discharge
B81B7/0025
Protection against chemical alteration
B81B7/0029
Protection against environmental influences not provided for in groups B81B7/0012 - B81B7/0025
B81B7/0032
Packages or encapsulation
B81B7/0035
for maintaining a controlled atmosphere inside of the chamber containing the MEMS
B81B7/0038
using materials for controlling the level of pressure, contaminants or moisture inside of the package
B81B7/0041
maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
B81B7/0045
for reducing stress inside of the package structure
B81B7/0048
between the MEMS die and the substrate
B81B7/0051
between the package lid and the substrate
B81B7/0054
between other parts not provided for in B81B7/0048 - B81B7/0051
B81B7/0058
for protecting against damages due to external chemical or mechanical influences
B81B7/0061
suitable for fluid transfer from the MEMS out of the package or vice-versa
B81B7/0064
for protecting against electromagnetic or electrostatic interferences
B81B7/0067
for controlling the passage of optical signals through the package
B81B7/007
Interconnections between the MEMS and external electrical signals
B81B7/0074
3D packaging
B81B7/0077
Other packages not provided for in groups B81B7/0035 - B81B7/0074
B81B7/008
MEMS characterised by an electronic circuit specially adapted for controlling or driving the same
B81B7/0083
Temperature control
B81B7/0087
On-device systems and sensors for controlling, regulating or monitoring
B81B7/009
Maintaining a constant temperature by heating or cooling
B81B7/0093
by cooling
B81B7/0096
by heating
B81B7/02
containing distinct electrical or optical devices of particular relevance for their function
B81B7/04
Networks or arrays of similar micro-structural devices
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
MEMS package with shock and vibration protection
Patent number
11,975,961
Issue date
May 7, 2024
BEIJING VOYAGER TECHNOLOGY CO., LTD.
Youmin Wang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Sculpted micromirror in a digital micromirror device
Patent number
11,977,220
Issue date
May 7, 2024
Texas Instruments Incorporated
William Craig McDonald
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Microelectromechanical systems (“MEMS”) device having a built-in se...
Patent number
11,975,963
Issue date
May 7, 2024
John J. Albers
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Micromechanical component for a capacitive pressure sensor device
Patent number
11,976,996
Issue date
May 7, 2024
Robert Bosch GmbH
Thomas Friedrich
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Hermetically sealed transparent cavity and package for same
Patent number
11,975,962
Issue date
May 7, 2024
Schott AG
Jens Ulrich Thomas
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor package and method for manufacturing the same
Patent number
11,973,048
Issue date
Apr 30, 2024
Advanced Semiconductor Engineering, Inc.
An-Nong Wen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Application specific integrated circuit (ASIC) chip, and sensor and...
Patent number
11,973,503
Issue date
Apr 30, 2024
NANJING PRIME SEMICONDUCTOR CO., LTD.
Sunfeng Huang
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Protective cover member and member supplying sheet including the same
Patent number
11,969,975
Issue date
Apr 30, 2024
Nitto Denko Corporation
Yuichi Abe
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Device for sensing the activity of people or the status of infrastr...
Patent number
11,961,384
Issue date
Apr 16, 2024
EnOcean GmbH
Frank Schmidt
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Dual-layer micro-ribbon MEMS light modulator
Patent number
11,958,738
Issue date
Apr 16, 2024
Silicon Light Machines Corporation
Olav Solgaard
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method for producing a microelectromechanical sensor and microelect...
Patent number
11,958,740
Issue date
Apr 16, 2024
Robert Bosch GmbH
Achim Kronenberger
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Combined corrugated piezoelectric microphone and corrugated piezoel...
Patent number
11,962,973
Issue date
Apr 16, 2024
Infineon Technologies AG
Christian Bretthauer
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Microelectromechanical system (MEMS) structure and method of formation
Patent number
11,953,674
Issue date
Apr 9, 2024
Texas Instruments Incorporated
Jose A. Martinez
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Actuator device
Patent number
11,952,265
Issue date
Apr 9, 2024
Hamamatsu Photonics K.K.
Sadaharu Takimoto
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Support structure designs for MEMS-based active cooling
Patent number
11,956,921
Issue date
Apr 9, 2024
Frore Systems Inc.
Suryaprakash Ganti
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Lid, MEMS sensor component and methods of manufacturing
Patent number
11,956,579
Issue date
Apr 9, 2024
TDK Corporation
Wolfgang Pahl
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Packaging structure and method of MEMS pressure sensor
Patent number
11,953,392
Issue date
Apr 9, 2024
Wuxi Sencoch Semiconductor Co., Ltd.
Tongqing Liu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Hollow package and method for manufacturing same
Patent number
11,955,394
Issue date
Apr 9, 2024
Nippon Kayaku Kabushiki Kaisha
Tadashi Naito
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Integrated digital force sensors and related methods of manufacture
Patent number
11,946,817
Issue date
Apr 2, 2024
DecaWave, Ltd.
Ali Foughi
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method for determining at least one temperature compensation parame...
Patent number
11,945,715
Issue date
Apr 2, 2024
Robert Bosch GmbH
Hans-Peter Brueckner
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Bonded structures
Patent number
11,948,847
Issue date
Apr 2, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Systems and methods for providing getters in microelectromechanical...
Patent number
11,945,713
Issue date
Apr 2, 2024
Invensense, Inc.
Daesung Lee
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Electronic device and corresponding method
Patent number
11,945,714
Issue date
Apr 2, 2024
STMicroelectronics S.r.l.
Alex Gritti
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Micromechanical component and method for producing a micromechanica...
Patent number
11,940,618
Issue date
Mar 26, 2024
Robert Bosch GmbH
Alexander Eberspaecher
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Multiaxis sensing system for detection of airborne molecules and ra...
Patent number
11,940,576
Issue date
Mar 26, 2024
National Technology & Engineering Solutions of Sandia, LLC
Mark D. Allendorf
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Dual-output microelectromechanical resonator and method of manufact...
Patent number
11,932,530
Issue date
Mar 19, 2024
STATHERA IP HOLDINGS INC.
George Xereas
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
MEMS device having a metallization structure embedded in a dielectr...
Patent number
11,932,534
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hung-Hua Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Micromechanical component for a pressure sensor device
Patent number
11,932,532
Issue date
Mar 19, 2024
Robert Bosch GmbH
Jochen Reinmuth
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Sensor output digitizer
Patent number
11,933,648
Issue date
Mar 19, 2024
Invensense, Inc.
Federico Mazzarella
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Signal processing circuit for triple-membrane MEMS device
Patent number
11,932,533
Issue date
Mar 19, 2024
Infineon Technologies AG
Marc Fueldner
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
Information
Patent Application
Encapsulated MEMS Switching Element, Device and Production Method
Publication number
20240150166
Publication date
May 9, 2024
SIEMENS AKTIENGESELLSCHAFT
Oliver Raab
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
PIEZOELECTRIC MICROELECTROMECHANICAL RESONATOR DEVICE AND CORRESPON...
Publication number
20240154599
Publication date
May 9, 2024
STMicroelectronics S.r.l.
Federico VERCESI
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
ELECTROMECHANICAL SYSTEM AND METHOD FOR OPERATING AN ELECTROMECHANI...
Publication number
20240140784
Publication date
May 2, 2024
ROBERT BOSCH GmbH
Timo Giesselmann
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MICROMECHANICAL SENSOR WITH INTEGRATED STRESS SENSOR AND METHOD FOR...
Publication number
20240142490
Publication date
May 2, 2024
ROBERT BOSCH GmbH
Johannes Classen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
Publication number
20240140782
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing company Ltd.
PO CHEN YEH
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...
Publication number
20240140783
Publication date
May 2, 2024
STMicroelectronics S.r.l.
Mark Andrew SHAW
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
DIGITAL LIGHT PROCESSING 3D PRINTED MONOLITHIC SUBSTRATES WITH INTE...
Publication number
20240140022
Publication date
May 2, 2024
Toyota Motor Engineering & Manufacturing North America, Inc.
Yuyang Song
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MEMS RESONANT SENSOR ADAPTED TO GENERATE A PULSE OUTPUT SIGNAL
Publication number
20240132341
Publication date
Apr 25, 2024
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Emmanuel HARDY
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES
Publication number
20240132342
Publication date
Apr 25, 2024
ROBERT BOSCH GmbH
Bo CHENG
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM DEVICE AND PIEZOELECTRIC COMPOSITE...
Publication number
20240136994
Publication date
Apr 25, 2024
Vanguard International Semiconductor Corporation
JIA JIE XIA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MICROMECHANICAL DEVICE COMPRISING A HYDROGEN DRAINAGE LAYER
Publication number
20240124296
Publication date
Apr 18, 2024
ROBERT BOSCH GmbH
Johannes Boy
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Semiconductor Devices and Methods of Manufacture
Publication number
20240124298
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yun-Chung Wu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...
Publication number
20240124300
Publication date
Apr 18, 2024
STMICROELECTRONICS, INC.
Jefferson Sismundo TALLEDO
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CARTRIDGE INTERFERENCE
Publication number
20240124297
Publication date
Apr 18, 2024
VueReal Inc.
Gholamreza CHAJI
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
BONDED STRUCTURES
Publication number
20240120245
Publication date
Apr 11, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MEMS MODULE
Publication number
20240116750
Publication date
Apr 11, 2024
Rohm Co., Ltd.
Takashi NAIKI
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240116752
Publication date
Apr 11, 2024
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming CHEN
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
INTEGRATED DEVICE PACKAGE
Publication number
20240118131
Publication date
Apr 11, 2024
Analog Devices International Unlimited Company
Johnny Solana Gealon
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
METHOD FOR SEALING A MEMS DEVICE AND A SEALED MEMS DEVICE
Publication number
20240116753
Publication date
Apr 11, 2024
Murata Manufacturing Co., Ltd.
Antti IIHOLA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES
Publication number
20240118141
Publication date
Apr 11, 2024
PIXART IMAGING INCORPORATION
Chih-Ming Sun
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240116751
Publication date
Apr 11, 2024
XINTEC INC.
Chia-Ming CHENG
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MEMS PIEZOELECTRIC SPEAKER
Publication number
20240114795
Publication date
Apr 4, 2024
AAC Kaitai Technologies (Wuhan) CO., LTD
Yu Shen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240109768
Publication date
Apr 4, 2024
Advanced Semiconductor Engineering, Inc.
Chieh-An YEH
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240109769
Publication date
Apr 4, 2024
XINTEC INC.
Wei-Luen SUEN
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SELF-ALIGNED AIR GAP FORMATION IN MICROELECTRONICS PACKAGES
Publication number
20240101413
Publication date
Mar 28, 2024
Intel Corporation
Jeremy D. Ecton
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS
Publication number
20240100565
Publication date
Mar 28, 2024
BFLY OPERATIONS, INC.
Jonathan M. Rothberg
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MULTIPLE-FREQUENCY-COMPONENT SCANNING INVOLVING SCAN-PATTERN DESIGN...
Publication number
20240094394
Publication date
Mar 21, 2024
The Board of Trustees of the Leland Stanford Junior University
Zhanghao Sun
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
INTEGRATED MEMS ELECTROSTATIC MICRO-SPEAKER DEVICE AND METHOD
Publication number
20240092629
Publication date
Mar 21, 2024
Vibrant Microsystems Inc.
Steven NASIRI
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MEMS Device, Electronic Apparatus, And Vehicle
Publication number
20240094239
Publication date
Mar 21, 2024
SEIKO EPSON CORPORATION
Fumiya ITO
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Packaging Structure and Method of MEMS Pressure Sensor
Publication number
20240094079
Publication date
Mar 21, 2024
Wuxi Sencoch Semiconductor Co., Ltd.
Tongqing Liu
B81 - MICRO-STRUCTURAL TECHNOLOGY