Managed memory component

Abstract

A system and method for combining a leaded package IC and a semiconductor die using a flex circuitry. The leaded packaged IC is disposed along an obverse side of a flex circuit. In a preferred embodiment, the lower surface of the body of the leaded packaged IC contacts the surface of the flex circuitry. The semiconductor die is disposed beneath the leaded package IC and, in preferred embodiments, disposed in a window that passes through at least a part of the flex circuitry and is attached to a conductive layer of the flex circuitry. In other embodiments, the semiconductor die is attached to the body of the leaded packaged IC. The flex circuitry preferably employs at least two conductive layers and, in preferred embodiments, the leaded packaged IC is connected to the flex circuitry at one layer while the semiconductor die is connected to the flex circuitry at the other conductive layer. In preferred modules, the leaded packaged IC is preferably a flash memory device and the semiconductor die is preferably a controller.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a side view of an exemplar module devised in accordance with a preferred embodiment of the present invention.

FIG. 2 is an enlarged side view of the area marked “A” in FIG. 1 of a module devised in accordance with a preferred embodiment of the present invention.

FIG. 3 depicts an alternative embodiment in which the leads of a leaded packaged IC penetrate the flex circuitry employed in a module in accordance with a preferred embodiment of the present invention.

FIG. 4 depicts an alternative embodiment in accord with the present invention in which lead holes are present in the flex circuitry.

FIG. 5 depicts yet another embodiment in accordance with the present invention in which an area of flex circuitry is deflected.

FIG. 6 depicts yet another embodiment for connecting the leaded packaged IC to the flex circuitry in accordance with the present invention.

FIG. 7 depicts an alternative embodiment of the present invention in which flex circuitry has distal ends that contact an inner side of the leads of the leaded packaged IC.

FIG. 8 is a perspective view of a module devised in accordance with an embodiment of the present invention.

FIG. 9 depicts a cross-sectional view of a circuit module taken along line C-C of FIG. 8 and in accordance with an embodiment of the present invention illustrating the disposition of a semiconductor die relative to flex circuitry and a leaded packaged IC.

FIG. 10 depicts a cross-sectional view of a circuit module taken along line C-C of FIG. 8 and in accordance with an alternative embodiment of the present invention illustrating the disposition of a semiconductor die relative to flex circuitry and a leaded packaged IC.

FIG. 11 depicts a cross-sectional view of a circuit module taken along line C-C of FIG. 8 and in accordance with another alternative embodiment of the present invention illustrating the disposition of a semiconductor die relative to flex circuitry and a leaded packaged IC.

FIG. 12 depicts a cross-sectional view of a circuit module taken along line C-C of FIG. 8 and in accordance with another alternative embodiment of the present invention illustrating attaching the semiconductor die to the body of the leaded packaged IC.

FIG. 13 depicts a cross-sectional view of a circuit module in accordance with another alternative embodiment of the present invention illustrating the disposition of a semiconductor die relative to flex circuitry and a leaded packaged IC in which the body leaded packaged IC is not in contact with the flex circuitry.

FIG. 14 depicts a cross-sectional view of a circuit module in accordance with another alternative embodiment of the present invention illustrating the disposition of a semiconductor die relative to flex circuitry and a leaded packaged IC in which the body leaded packaged IC is not in contact with the flex circuitry and the semiconductor die is set into the body of the leaded packaged IC.

FIG. 15 is an enlarged depiction of the attachment of a semiconductor die to a metal layer in flex circuitry in accordance with an embodiment of the present invention.

Claims

1. A circuit module comprising: flex circuitry having first and second sides, the flex circuitry having a plurality of leaded IC pads and the second side of the flex circuitry having an array of module contacts, the flex circuitry comprising multiple layers including at least first and second conductive layers;a semiconductor die attached to one of the multiple layers of the flex circuitry and which semiconductor die is electrically connected to one of the first or second conductive layers;a leaded packaged IC having a body and upper and lower major surfaces, plural peripheral sides, and leads emergent from at least a first one of the plural peripheral sides of the leaded packaged IC, the leads being connected to the flex circuitry through the plurality of leaded IC pads.

2. The circuit module of claim 1 in which the flex circuitry exhibits a window passing into the flex circuitry from the second side and into which window the semiconductor die is inserted.

3. The circuit module of claim 2 in which the window extends through at least the second conductive layer but not the first conductive layer of the flex circuitry.

4. The circuit module of claim 1 in which the lower major surface of the leaded packaged IC is in contact with the first side of the flex circuitry.

5. The circuit module of claim 2 in which the lower major surface of the leaded packaged IC is in contact with the first side of the flex circuitry.

6. The circuit module of claim 3 in which the lower major surface of the leaded packaged IC is in contact with the first side of the flex circuitry.

7. The circuit module of claim 4 in which adhesive is disposed between the lower major surface of the leaded packaged IC and the flex circuitry.

8. The circuit module of claim 5 in which adhesive is disposed between the lower major surface of the leaded packaged IC and the flex circuitry.

9. The circuit module of claim 6 in which adhesive is disposed between the lower major surface of the leaded packaged IC and the flex circuitry.

10. The circuit module of claim 2 in which the semiconductor die is attached to the first conductive layer.

11. The circuit module of claim 2 in which the semiconductor die is electrically connected to the first conductive layer.

12. The circuit module of claim 2 in which the semiconductor die is electrically connected to the second conductive layer.

13. The circuit module of claim 2 in which the semiconductor die is electrically connected to one of the first or second conductive layers with wire bonds.

14. The circuit module of claim 13 in which encapsulate covers the wire bonds.

15. The circuit module of claim 3 in which the semiconductor die is electrically connected to one of the first or second conductive layers.

16. The circuit module of claim 2 in which the leaded packaged IC is a flash memory device.

17. The circuit module of claim 3 in which the leaded packaged IC is a flash memory device.

18. The circuit module of claim 2 in which the semiconductor die is a controller.

19. The circuit module of claim 3 in which the semiconductor die is a controller.

20. The circuit module of claim 2 in which the semiconductor die is a controller and the leaded packaged IC is flash memory device.

21. The circuit module of claim 3 in which the semiconductor die is a controller and the leaded packaged IC is flash memory device.

22. The circuit module of claim 1 in which the semiconductor die is attached to the second conductive layer.

23. The circuit module of claim 22 in which the semiconductor die is electrically connected to the first conductive layer.

24. The circuit module of claim 22 in which the semiconductor die is electrically connected to the second conductive layer.

25. The circuit module of claim 1 in which the flex circuitry exhibits a window passing into the flex circuitry from the second side and into which window the semiconductor die is inserted, the window passing through the second conductive layer but not the first conductive layer and the semiconductor die being attached to the first conductive layer and electrically connected to the second conductive layer.

26. The circuit module of claim 25 in which the leaded packaged IC is a flash memory device and the semiconductor die is a controller.

27. The circuit module of claim 25 in which the semiconductor die is electrically connected to the flex circuitry with wire bonds.

28. The circuit module of claim 27 in which encapsulate covers the wire bonds.

29. The circuit module of claim 2 in which the plurality of leaded IC pads are accessible from the first side of the flex circuitry.

30. The circuit module of claim 3 in which the leaded IC pads are accessible from the second side of the flex circuitry.

31. The circuit module of claim 1 in which the leads of the leaded packaged IC are parallel to the lower major surface of the leaded packaged IC.

32. The circuit module of claim 1 in which the leads of the leaded packaged IC are connected to the first and second sides of the flex circuitry.

33. The circuit module of claim 1 in which the flex circuitry further comprises a deflected area that bears the plurality of leaded IC pads.

34. The circuit module of claim 1 in which the flex circuitry further comprises a deflected area that is deflected toward the body of the leaded packaged IC.

35. The circuit module of claim 4 in which the flex circuitry exhibits lead holes through which each of the leads projects to contact the leaded IC pads.

36. The circuit module of claim 1 in which the flex circuitry has at least one distal end that contacts an inner side of one of the leads of the leaded packaged IC.

37. The circuit module of claim 2 in which at least one of the leads passes through the flex circuitry.

38. A circuit module comprising: flex circuitry having first and second sides, the flex circuitry having a plurality of leaded IC pads and the second side of the flex circuitry having an array of module contacts, the flex circuitry comprising multiple layers including at least first and second conductive layers and the flex circuitry having a window that passes through the flex circuitry;a leaded packaged IC having a body and upper and lower major surfaces, plural peripheral sides, and leads emergent from at least a first one of the plural peripheral sides of the leaded packaged IC, the leads being connected to the flex circuitry through the plurality of leaded IC pads and the lower major surface of the leaded packaged IC being in contact with the first side of the flex circuitry; anda semiconductor die attached the body of the leaded packaged IC and which die projects into the window of the flex circuitry and which semiconductor die is electrically connected to one of the first or second conductive layers of the flex circuitry.

39. The circuit module of claim 38 in which adhesive is disposed between the lower major surface of the leaded packaged IC and the first side of the flex circuitry.

40. The circuit module of claim 38 in which the semiconductor die is electrically connected to the second conductive layer.

41. The circuit module of claim 38 in which the semiconductor die is electrically connected to the first conductive layer.

42. The circuit module of claim 38 in which the leads of the leaded packaged IC are inserted through the flex circuitry and are connected to the plurality of leaded IC pads.

43. The circuit module of claim 38 in which the plurality of leaded IC pads are accessible from the first side of the flex circuitry.

44. The circuit module of claim 38 in which the leaded IC pads are accessible from the second side of the flex circuitry.

45. The circuit module of claim 38 in which the leads of the leaded packaged IC are parallel to the lower major surface of the leaded packaged IC.

46. The circuit module of claim 38 in which the leads of the leaded packaged IC are connected to the first and second sides of the flex circuitry.

47. The circuit module of claim 38 in which the flex circuitry further comprises a deflected area that bears the plurality of leaded IC pads.

48. The circuit module of claim 38 in which the flex circuitry further comprises a deflected area that is deflected toward the body of the leaded packaged IC.

49. The circuit module of claim 38 in which the flex circuitry exhibits lead holes through which each of the leads projects to contact the leaded IC pads.

50. The circuit module of claim 38 in which the flex circuitry has at least one distal end that contacts an inner side of one of the leads of the leaded packaged IC.

51. The circuit module of claim 38 in which the semiconductor die is connected to the first conductive layer.

52. The circuit module of claim 38 in which the semiconductor die is connected to the second conductive layer.

53. The circuit module of claim 38 in which the die is electrically connected to one of the first or second conductive layers of the flex circuitry with wire bonds.

54. The circuit module of claim 38 in which the semiconductor die is attached to the body of the leaded packaged IC with die attach adhesive.

55. The circuit module of claim 53 in which encapsulate covers the wire bonds.

56. The circuit module of claim 38 in which the leaded package IC is a flash memory device.

57. The circuit module of claim 38 in which the semiconductor die is a controller.

58. The circuit module of claim 38 in which the leaded packaged IC is flash memory device and the semiconductor die is a controller.

59. The circuit module of claim 38 in which the semiconductor die is set into a recess in the body of the leaded packaged IC.

60. The circuit module of claim 59 in which the semiconductor die is electrically connected to the first conductive layer.

61. The circuit module of claim 59 in which the semiconductor die is electrically connected to the second conductive layer.

62. A circuit module comprising: flex circuitry having first and second sides, the flex circuitry having a plurality of leaded IC pads and the second side of the flex circuitry having an array of module contacts, the flex circuitry comprising multiple layers including at least first and second conductive layers and the flex circuitry having at least one window that passes through the flex circuitry;a leaded packaged IC having a body and upper and lower major surfaces, plural peripheral sides, and leads emergent from at least a first one of the plural peripheral sides of the leaded packaged IC, the leads being connected to the flex circuitry through the plurality of leaded IC pads; anda semiconductor die attached the body of the leaded packaged IC and which semiconductor die is electrically connected to one of the first or second conductive layers of the flex circuitry with wire bonds that pass through the at least one window through the flex circuitry.

63. The circuit module of claim 62 in which the semiconductor die is set into a recess in the body of the leaded packaged IC.