Claims
- 1. A method of manufacturing a ceramic structural body comprising:
- preparing a ceramic green sheet of substantially uniform thickness;
- forming at least one through-hole through the thickness of the ceramic green sheet;
- filling the through-hole with electrically conductive material;
- selectively coating a surface of said ceramic green sheet with metallizing paste to achieve a desired pattern of print layers;
- press-forming the coated ceramic green sheet to form a substantially concave-convex green ceramic member having
- a plate portion,
- a sidewall portion extending from said plate portion at substantially right angles thereof,
- a flange portion extending from the free end of said sidewall portion at substantially right angles thereto,
- wherein said print layers are on the concave side of said green ceramic member;
- sintering said green ceramic member;
- treating said sintering ceramic member to form electrically conductive metal layers from at least part of said print layers;
- mounting at least one electronic component on said sintered ceramic member; and
- electrically connecting said electronic component to said metal layers.
- 2. The method of claim 1, wherein the electrically conductive material in the through-holes electrically connects electronic components through the sintered ceramic member.
- 3. A method as claimed in claim 1, wherein said sidewall portion has at least one step portion.
- 4. A method of manufacturing a ceramic structural body comprising:
- preparing a ceramic green sheet of substantially uniform thickness;
- forming at least one through-hole through the thickness of the ceramic green sheet;
- filling the through-hole with electrically conductive material;
- selectively coating a surface of said ceramic green sheet with metallizing paste to achieve a desired pattern of print layers;
- printing insulating paste on at least a part of said print layers;
- press-forming the coated ceramic green sheet to form a substantially concave-convex green ceramic member having
- a plate portion,
- a sidewall portion extending from said plate portion at substantially right angles thereto,
- a flange portion extending from the free end of said sidewall portion at substantially right angles thereto,
- wherein said print layers are on the concave side of said green ceramic member;
- sintering said green ceramic member;
- treating said sintered ceramic member to form electrically conductive metal layers from at least part of said print layers;
- mounting at least one electronic component on said sintered ceramic member; and
- electrically connecting said electronic component to said metal layers.
- 5. The method of claim 4, wherein the electrically conductive material in the through-holes electrically connects electronic components through the sintered ceramic member.
- 6. A method of manufacturing a ceramic structural body comprising:
- preparing a ceramic green sheet of substantially uniform thickness;
- forming at least one through-hole through the thickness of the ceramic green sheet;
- filling the through-hole with electrically conductive material;
- selectively coating a surface of said ceramic green sheet with metallizing paste to achieve a desired pattern of print layers;
- printing dielectric insulating paste on at least a part of said print layer;
- press-forming the coated ceramic green sheet to form a substantially concave-convex green ceramic member having
- a plate portion;
- a sidewall portion extending from said plate portion at substantially right angles thereto;
- a flange portion extending from the free end of said sidewall portion at substantially right angles thereto;
- wherein said print layers are on the concave side of said green ceramic member;
- sintering said green ceramic member;
- treating said sintered ceramic member to form electrically conductive metal layers from at least part of said print layers;
- mounting at least one electronic component on said sintered ceramic member;
- electrically connecting said electronic component to said metal layers.
- 7. A method as claimed in claim 6, wherein said metallized layer in the inside of the recessed portion is filled with dielectric insulating filler material.
- 8. The method of claim 6, wherein the electrically conductive material in the through-holes electrically connects electronic components through the sintered ceramic member.
Priority Claims (1)
Number |
Date |
Country |
Kind |
52-174414 |
Dec 1977 |
JPX |
|
Parent Case Info
This is a division of application Ser. No. 970,444 filed Dec. 18, 1978, now abandoned.
US Referenced Citations (16)
Foreign Referenced Citations (3)
Number |
Date |
Country |
2424747 |
Dec 1974 |
DEX |
1254101 |
Nov 1971 |
GBX |
1276095 |
Jun 1972 |
GBX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
970444 |
Dec 1978 |
|